聚合物微圆柱热压成型工艺实验
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摘要
微热压工艺在高深宽比聚合物微型制件成型领域应用较为广泛。利用孔直径为0.3 mm、深度为1.5 mm的微圆柱阵列模具,研究了高温低压和低温高压2种工艺范围下,高深宽比微圆柱的微热压成型规律。实验结果表明,随着热压温度或热压压力的增大,微圆柱高度均提高;当热压压力为定值时,温度每升高3℃,微圆柱高度最大增值为0.213 mm;当热压温度为定值时,热压压力每增加1 MPa,微圆柱高度最大增值为0.342 mm。微圆柱的深宽比在低温高压组可达4.2,在高温低压组可达2.95,通过二元线性回归分析得到了热压温度和热压压力对微圆柱高度的影响关系,为微热压成型高深宽比聚合物微制件提供了一定的技术依据。
Micro hot embossing process was widely applied in the forming field of micro-scale polymer products. A mold with an array of through-holes with the diameter of 0. 3 mm and depth of 1. 5 mm was used to study the micro hot embossing process to form the polymer micro pillars array. The experimental results showed that the height of micro pillars increased gradually,with the increase of the molding temperature or the embossing force. The maximum increment of the micro pillars height was 0. 213 mm for each 3 ℃ rise in the molding temperature with the constant embossing force. At a given molding temperature,a rise of 1 MPa in the embossing force will maximally increase the height of micro pillars by about 0. 342 mm. The aspect ratio of micro pillars reached 4. 2 in the low-temperature and high-pressure group and 2. 95 in the high-temperature and low-pressure group. The relationship of the molding temperature and the embossing force on the height of micro pillars could be obtained by means of binary linear regression analysis,which will provide reference for micro hot embossing process of high aspect ratio polymer micro-parts.
Micro hot embossing process was widely applied in the forming field of micro-scale polymer products. A mold with an array of through-holes with the diameter of 0. 3 mm and depth of 1. 5 mm was used to study the micro hot embossing process to form the polymer micro pillars array. The experimental results showed that the height of micro pillars increased gradually,with the increase of the molding temperature or the embossing force. The maximum increment of the micro pillars height was 0. 213 mm for each 3 ℃ rise in the molding temperature with the constant embossing force. At a given molding temperature,a rise of 1 MPa in the embossing force will maximally increase the height of micro pillars by about 0. 342 mm. The aspect ratio of micro pillars reached 4. 2 in the low-temperature and high-pressure group and 2. 95 in the high-temperature and low-pressure group. The relationship of the molding temperature and the embossing force on the height of micro pillars could be obtained by means of binary linear regression analysis,which will provide reference for micro hot embossing process of high aspect ratio polymer micro-parts.
引文
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[8]曹宏深,陈金周,韩榜,等.PMMA高弹态热压变形行为[J].锻压技术,2010,35(6):104-108.
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[11]刘明,王仁曾.基于t检验的逐步回归的改进[J].统计与决策,2012(6):16-19.
[12]刘立祥.线性回归模型中自变量的选择与逐步回归方法[J].统计与决策,2015(21):80-82.
[2]KOLEW A,HEILIG M,SCHNEIDER M,et al.Hot embossing of transparent high aspect ration micro parts[J].Microsyst Technol,2014,20(10):1967-1973.
[3]HECKELE M,SCHOMBURG W K.Review on micro molding of thermoplastic polymers[J].Journal of Micromechanics and Microengineering,2004,14(3):R1-R14.
[4]KUDUVA-RAMAN-THANUMOORTHY R,YAO D.Hot embossing of discrete microparts[J].Polymer Engineering and Science,2009,49(10):1894-1901.
[5]MOORE S,GOMEZ J,LEK D.Experimental study of polymer microlens fabrication using partial-filling hot embossing technique[J].Microelectronic Engineering,2016,162:57-62.
[6]KUO C C,CHEN B C.Optimization of hot embossing molding process parameters of fresnel lens using taguchi method[J].Materialwissenschaft Und Werkstofftechnik,2015,46(9):942-948.
[7]DATTA P,GOETTERT J.Method for polymer hot embossing process development[J].Microsystem Technologies,2007,13(3):265-270.
[8]曹宏深,陈金周,韩榜,等.PMMA高弹态热压变形行为[J].锻压技术,2010,35(6):104-108.
[9]司卫华,董晓文,顾文琪.热压印中聚合物的研究[J].电子工业专业设备,2007,36(7):17-21.
[10]贺永,傅建中,陈子辰.微热压印过程中聚合物流动形貌的研究[J].光学精密工程,2008,16(2):270-278.
[11]刘明,王仁曾.基于t检验的逐步回归的改进[J].统计与决策,2012(6):16-19.
[12]刘立祥.线性回归模型中自变量的选择与逐步回归方法[J].统计与决策,2015(21):80-82.