聚合物热黏弹塑性变形微热压成型机理的数值模拟研究
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摘要
研究了聚甲基丙烯酸甲酯(PMMA)超疏性阵列圆柱微结构特征功能表面的微热压成型技术,通过模拟研究了成型工艺参数对成型过程的影响规律,揭示了其热黏弹塑性变形充填流动机理,明晰了关键调控参数。结果表明,基片材料的弹性模量、成型温度和压力是影响充填成型的关键调控参数,成型压力和变形应力与成型温度呈负关联关系,而充填高度与成型温度呈正关联关系;提高成型温度至高于基片材料的玻璃化转变温度(Tg),使基片处于黏弹性高弹态,易使基片快速产生明显的热黏弹塑性变形,且可使成型压力和变形应力趋于最小值,这有利于基片避免断裂损伤并加速充模流动。
This paper reported a study on the patterning superhydrophobic surface with a PMMApillared array based on the micro-hot embossing technology.The effect of process parameters on the micro hot embossing process was investigated by means of numerical simulation,and the thermal viscoelastic plastic deformation filling mechanism was described. Moreover,the key control parameters were clarified.The results indicated that the elastic modulus of the base materials,hot embossing temperature and pressure are the key control parameters for the microhot formation.The hot embossing pressure and deformation stress were reciprocally correlated with the hot embossing temperature,whereas the filling height of polymers was proportionally correlated with the hot embossing temperature.With increasing hot embossing temperature over the glass transition temperature of a polymeric base material,the base material could be kept in a high elastic state.In this case,the base material is easy to perform a significant thermal viscoelastic plastic deformation in a rapid way,which can minimize the hot embossing pressure and deformation stress.This is beneficial for polymeric base materials to avoid fracture damages and promote filling flow.
This paper reported a study on the patterning superhydrophobic surface with a PMMApillared array based on the micro-hot embossing technology.The effect of process parameters on the micro hot embossing process was investigated by means of numerical simulation,and the thermal viscoelastic plastic deformation filling mechanism was described. Moreover,the key control parameters were clarified.The results indicated that the elastic modulus of the base materials,hot embossing temperature and pressure are the key control parameters for the microhot formation.The hot embossing pressure and deformation stress were reciprocally correlated with the hot embossing temperature,whereas the filling height of polymers was proportionally correlated with the hot embossing temperature.With increasing hot embossing temperature over the glass transition temperature of a polymeric base material,the base material could be kept in a high elastic state.In this case,the base material is easy to perform a significant thermal viscoelastic plastic deformation in a rapid way,which can minimize the hot embossing pressure and deformation stress.This is beneficial for polymeric base materials to avoid fracture damages and promote filling flow.
引文
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[10]CHENG G,SAHLI M,GELIN J C,et al.Physical Modelling,Numerical Simulation and Experimental Investigation of Microfluidic Devices with Amorphous Thermoplastic Polymers Using a Hot Embossing Process[J].Journal of Materials Processing Technology,2015,229:36-53.
[11]SRIVASTAVA V,CHESTER S A,AMES N M,et al.A Thermo-mechanically-coupled Large-deformation Theory for Amorphous Polymers in a Temperature Range Which Spans Their Glass Transition[J].International Journal of Plasticity,2010,26(8):1 138-1 182.
[12]ZHOU G F,YANG P M,LUO Z,et al.Numerical Simulation on in Mold Micro Assembly Molding Process Based on Viscoelastic Thermal Fluid Structure Coupling[J].CIESC Journal,2017,68(3).
[13]MATHIESEN D,VOGTMANN D,DUPAIX R B.Characterization and Constitutive Modeling of Stress-relaxation Behavior of Poly(methyl methacrylate)(PMMA)Across the Glass Transition Temperature[J].Mechanics of Materials,2014,71(5):74-84.
[14]SHU C G.Physical Modeling,Numerical Simulation and Experimental Investigation of Hot Embossing Process with the Amorphous Thermoplastic Polymers[D].French:University of Franche-comte,2014.
[2]YEO L P,NG S H,WANG Z F,et al.Micro-fabrication of Polymeric Devices Using Hot Roller Embossing[J].Microelectronic Engineering,2009,86(4/5/6):933-936.
[3]贺永,傅建中,陈子辰.微热压成型脱模缺陷分析及其脱模装置[J].机械工程学报,2008,44(11):53-58.HE Y,FU J Z,CHEN Z C.Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process[J].Chinese Journal of Mechanical Engineering,2008,44(11):53-58.
[4]KAFKA J,LARSEN N B,SKAARUP S,et al.Fabrication of an All-polymer Electrochemical Sensor by Using a One-step Hot Embossing Procedure[J].Microelectronic Engineering,2010,87(5/6/7/8):1 239-1 241.
[5]CHANG W Y,WU J T,LIN K H,et al.Fabrication of Gold Sub-wavelength Pore Array Using Gas-assisted Hot Embossing with Anodic Aluminum Oxide(AAO)Template[J].Microelectronic Engineering,2011,88(6):909-913.
[6]JENA R K,YUE C Y,LAM Y C,et al.Comparison of Different Molds(Epoxy,Polymer and Silicon)for Microfabrication by Hot Embossing Technique[J].Sensors&Actuators B:Chemical,2012,163(1):233-241.
[7]HUNG G J C,TSAI Y P,HUNG C.Development of a New Apparatus for Ultrasonic Vibration-assisted Glass Hot Embossing Process[J].Precision Engineering,2013,37(1):222-227.
[8]ZHONG Z W,SHAN X C.A Study of Meniscus Formation and Its Effect on Roll-to-roll UV Embossing[J].International Journal of Engineering Science,2014,85:10-19.
[9]PALACIOS-CUESTA M,VASIEV I,GADEGAARD N,et al.Direct Micrometer Patterning and Functionalization of Polymer Blend Surfaces by Using Hot Embossing[J].European Polymer Journal,2014,59:333-340.
[10]CHENG G,SAHLI M,GELIN J C,et al.Physical Modelling,Numerical Simulation and Experimental Investigation of Microfluidic Devices with Amorphous Thermoplastic Polymers Using a Hot Embossing Process[J].Journal of Materials Processing Technology,2015,229:36-53.
[11]SRIVASTAVA V,CHESTER S A,AMES N M,et al.A Thermo-mechanically-coupled Large-deformation Theory for Amorphous Polymers in a Temperature Range Which Spans Their Glass Transition[J].International Journal of Plasticity,2010,26(8):1 138-1 182.
[12]ZHOU G F,YANG P M,LUO Z,et al.Numerical Simulation on in Mold Micro Assembly Molding Process Based on Viscoelastic Thermal Fluid Structure Coupling[J].CIESC Journal,2017,68(3).
[13]MATHIESEN D,VOGTMANN D,DUPAIX R B.Characterization and Constitutive Modeling of Stress-relaxation Behavior of Poly(methyl methacrylate)(PMMA)Across the Glass Transition Temperature[J].Mechanics of Materials,2014,71(5):74-84.
[14]SHU C G.Physical Modeling,Numerical Simulation and Experimental Investigation of Hot Embossing Process with the Amorphous Thermoplastic Polymers[D].French:University of Franche-comte,2014.