电真空器件用金银锗钎料研制
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摘要
研究了Au-Ag-Ge系列合金的熔化特性、加工性能以及钎焊性能。结果表明,在Au-12Ge合金中加入Ag元素,可以提高合金的熔化温度,但是仍不能满足使用要求。Au-52Ag-6Ge合金熔化温度为566～586℃,采用冷轧制+真空退火工艺可将合金加工制备为0. 10 mm厚的带材,清洁性、溅散性和铺展性能良好,可以与AgCu28共晶钎料、Ag Cu In钎料、AgCuInSn钎料形成四级梯度钎料,满足真空电子器件封接需求。
The melting characteristics,processability and solderability of Au-Ag-Ge solder were investigated. The result shows that Ag addition in Au-12 Ge alloy can increase melting temperature of the solder,but not enough to use. Au-52Ag-6Ge alloy with 566 ～ 586 ℃ melting temperature meets the requirements for use. Cold rolling and subsequently vacuum annealing process can be used to prepare 0. 10 mm thick strip material,and the composite solder has good cleanness,spatter and spread performance. The Au-52Ag-6Ge solder can form a quaternary gradient solder with AgCu28,Ag Cu In,and AgCuInSn solders to meet the needs of vacuum electronic devices.
The melting characteristics,processability and solderability of Au-Ag-Ge solder were investigated. The result shows that Ag addition in Au-12 Ge alloy can increase melting temperature of the solder,but not enough to use. Au-52Ag-6Ge alloy with 566 ～ 586 ℃ melting temperature meets the requirements for use. Cold rolling and subsequently vacuum annealing process can be used to prepare 0. 10 mm thick strip material,and the composite solder has good cleanness,spatter and spread performance. The Au-52Ag-6Ge solder can form a quaternary gradient solder with AgCu28,Ag Cu In,and AgCuInSn solders to meet the needs of vacuum electronic devices.
引文
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[2]吴善东.新一代信息技术产业发展趋势展望[J].时代金融,2018,33:349-351
[3]邢纪红,龚惠群.我国新一代信息技术产业自主创新能力评价研究[J].华东经济管理,2017,31(3):100-104.
[4]林峥.电子战武器的发展及高功率微波武器[J].航天电子对抗,2000(1):28-31.
[5]孙鹏,唐宏.电子战武器装备发展现状与展望[J].电讯技术,2008(3):7-11.
[6]罗群.军事电子先进制造技术发展战略分析[J].现代雷达,2007(8):7-11.
[7]陈登权,李伟,罗锡明,等.电子工业用金基和银基中温钎料的研究进展[J].贵金属,2009(3):62-67.
[8]甘卫平,陈慧,杨伏良. Ag-Cu-In-Sn钎料加工工艺的研究[J].材料导报,2007(3):156-158.
[9]康佳睿,宋晓国,胡胜鹏,等. Ag Cu钎料钎焊TC4钛合金与QCr0. 8铬青铜接头界面结构及性能[J].焊接学报,2018,39(4):27-30.
[10]陈波,熊华平,毛唯,等.采用Au基钎料真空钎焊Al2O3陶瓷[J].焊接学报,2016,37(11):47-50.
[11]陈波,吴世彪,熊华平,等.采用Ag-Cu-In-Ti钎料真空钎焊Si O2f/Si O2复合陶瓷与铌[J].焊接学报,2016,37(4):47-51.
[12]刘志高,杨建,丘泰.电子器件用中温钎料的研究进展[J].电子元件与材料,2008,27(6):37-40.
[13]蔡正旭,齐岳峰,张国清,等. Sn含量对Ag-Cu-In合金钎料加工及钎焊性能的影响[J].焊接,2017(4):29-32.
[14]李春元,王西涛,袁文霞. Ag-Au-Ge中温钎料的性能[J].北京科技大学学报,2008,30(12):1402-1405.
[15]崔大田,王志法,胡忠举,等.单辊旋淬Au-19. 25Ag-12. 80Ge钎料薄带的显微组织与焊接性能[J].稀有金属材料与工程,2012,41(3):442-446.