微量Pr添加对Sn-9Zn钎料/Cu界面特征的影响
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摘要
研究了0.1wt.%稀土元素Pr在Sn-9Zn中的添加对合金显微结构的影响,分析了Sn-9Zn-XPr(X=0,0.1)合金钎料/Cu焊点界面化合物微观结构特征。结果表明,微量稀土元素Pr添加能够显著细化Sn-9Zn钎料组织,合金中局部Pr富集形成的Pr Sn3化合物相呈"花朵状";0.1wt.%Pr元素添加能够Sn-9Zn合金钎料/Cu界面反应更为充分和均衡,界面IMC尺寸细化且分布均匀。
The effect of the 0. 1 wt% rare earth element Pr added in Sn-9 Zn on the microstructure of the alloy is studied. The microstructure characteristics of Sn-9 Zn-XPr( X = 0,0. 1) alloy solder/Cu solder joint interface compound are also analyzed. The results show that the addition of Sn to the Sn-9 Zn can significantly refine the Sn-9 Zn solder structure. The Pr Sn3 compound phase formed by local Pr enrichment in the alloy is"flower-like"; The interfacial reaction of Sn-9 Zn/Cu becomes more sufficient and balanced with 0. 1 wt%Pr addition,and the IMC size is refined and evenly distributed.
The effect of the 0. 1 wt% rare earth element Pr added in Sn-9 Zn on the microstructure of the alloy is studied. The microstructure characteristics of Sn-9 Zn-XPr( X = 0,0. 1) alloy solder/Cu solder joint interface compound are also analyzed. The results show that the addition of Sn to the Sn-9 Zn can significantly refine the Sn-9 Zn solder structure. The Pr Sn3 compound phase formed by local Pr enrichment in the alloy is"flower-like"; The interfacial reaction of Sn-9 Zn/Cu becomes more sufficient and balanced with 0. 1 wt%Pr addition,and the IMC size is refined and evenly distributed.
引文
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[3]张亮,杨帆,孙磊,等.近十年含稀土无铅钎料研究进展及发展趋势[J].稀土,2017,38(1):126-133.
[4]Fujiwara Y,Enomoto H,Nagao T,et al.Composite plating of Sn–Ag alloys for Pb-free soldering[J].Surface&Coatings Technology,2003,169(3):100-103.
[5]杨帆,张亮,刘志权,等.Sn-Cu-Ni系电子封装互连材料的研究进展[J].电子元件与材料,2016,35(12):1-6.
[6]杨帆,张亮,孙磊,等.Sn-Bi系电子互连材料研究进展[J].电子元件与材料,2016,35(6):1-7.
[7]Zhang L,Xue S,Gao L,et al.Development of Sn–Zn lead-free solders bearing alloying elements[J].Journal of Materials Science Materials in Electronics,2010,21(1):1-15.
[8]孙磊,张亮.Sn-Zn系无铅钎料最新进展[J].电子工艺技术,2015(1):4-11.
[9]Zhang L,Xue S,Gao L,et al.Development of Sn–Zn lead-free solders bearing alloying elements[J].Journal of Materials Science Materials in Electronics,2010,21(1):1-15.
[10]韩翼龙,薛松柏,薛鹏,等.Pr,Nd对Sn0.3Ag0.7Cu0.5Ga无铅钎料显微组织的影响[J].焊接学报,2017,38(1):103-106.
[11]熊丽媛,薛松柏,王禾,等.稀土元素Pr,Nd对无铅钎料组织和性能的影响[J].焊接,2017(12):9-17.
[12]Gao L,Xue S,Zhang L,et al.Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder[J].Journal of Materials Science Materials in Electronics,2010,21(9):910-916.
[13]Zhao G,Jing Y,Sheng G,et al.Effects of Rapid Solidification Process and 0.1 wt.%Pr Addition on Properties of Sn-9Zn Alloy and Cu/Solder/Cu Joints[J].Journal of Materials Engineering&Performance,2016,25(5):2037-2042.
[14]Xiao Z,Xue S,Hu Y,et al.Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr[J].Journal of Materials Science Materials in Electronics,2011,22(6):659-665.
[15]Jing Y,Sheng G,Zhao G.Influence of rapid solidification on microstructure,thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn–9Zn alloy[J].Materials&Design,2013,52(24):92-97.
[16]赵国际,盛光敏,邓永强.Sn-6.5Zn钎料/Cu基板焊点界面特征与金属间化合物形成机理[J].中国有色金属学报.2012,22(2):434-440.
[17]李双,胡小武,徐涛,等.Sn-9Zn/Cu焊点界面反应及其化合物生长行为[J].电子元件与材料,2017,36(11):60-67.