银钯内电极浆料对片式多层陶瓷电容器性能的影响
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摘要
分别制备了三种不同烧结收缩特性,以及两种由不同粒径无机添加剂组成的电极浆料。研究了电极浆料与介质烧结收缩匹配性、电极厚度、无机添加剂粒径对多层陶瓷电容器(MLCC)性能的影响。结果显示电极浆料与介质的烧结收缩越接近,产品无损检测缺陷越少。电极越厚产品耐焊后越容易出现瓷体裂纹;而电极越薄电压处理后越容易出现电容量精度偏差超标。无机添加剂粒径过大会造成产品电容量变小。
Three electrode pastes with different sintering shrinkage and two electrode pastes that are different in particle size of inorganic additive were prepared. The effects of sintering shrinkage match between electrode and ceramic,the thickness of electrode and the particle size of additive on the MLCC's performance were studied. The results show that the better the sintering shrinkage match between electrode and ceramic,the less inner defects in the MLCC product. The thicker the electrode is,the more esaily the cracks happen after soldering heat test. However the thinner the electrode is,the more easily the capacitance will turn down after voltage processing. The big particle size of inorganic additive will decrease the capacitance of product.
Three electrode pastes with different sintering shrinkage and two electrode pastes that are different in particle size of inorganic additive were prepared. The effects of sintering shrinkage match between electrode and ceramic,the thickness of electrode and the particle size of additive on the MLCC's performance were studied. The results show that the better the sintering shrinkage match between electrode and ceramic,the less inner defects in the MLCC product. The thicker the electrode is,the more esaily the cracks happen after soldering heat test. However the thinner the electrode is,the more easily the capacitance will turn down after voltage processing. The big particle size of inorganic additive will decrease the capacitance of product.
引文
1郝晓光.多层陶瓷电容器用镍内电极浆料的现状与展望[J].电子元件与材料,2017,36(2):1-5Hao Xiaoguang. Current situation and development prospect of nickel inner electrode paste used in MLCC[J]. Electronic Components&Materials,2017,36(2):1-5
2 张韶鸽,孟淑媛,付衣梅.镍电极MLCC内电极浆料与介质烧成收缩匹配性的研究[J].电子质量,2010,4:34-36Zhang Shaoge,Meng Shuyuan,Fu Yimei. The study of matching of the MLCC Ni inner paste and the media on the firing shrinkage[J].Electronics Quality,2010,4:34-36
3 Zuo R,Li L,Gui Z. Interfacial development and microstructural imperfection of multilayer ceramic chips with Ag/Pd electrodes[J]. Ceramics International,2001,27(8):889-893
4 陈雷,王晓慧,李龙土. BME MLCC中陶瓷-金属界面行为的研究[J].电子元件与材料,2007,26(1):56-58Chen Lei,Wang Xiaohui,Li Longtu. Investigation of ceramic-metal interfacial behavior in base metal electrode MLCC[J]. Electronic Components and Materials,2007,26(1):56-58
5 刘新,李筱瑜,陈长云. MLCC制作过程中分层开裂原因分析[J].电子工艺技术,2011,32(6):335-337Liu Xin,Li Xiaoyu,Chen Changyun. Analysis of reasons for MLCC delamination during manufacturing[J]. Electronics Process Technology,2011,32(6):335-337
6 陈长云,李筱瑜,刘新. MLCC内电极厚度对其性能影响的研究[J].电子工艺技术,2011,32(2):105-107Chen Changyun,Li Xiaoyu,Liu Xin. Research of inner electrode tthickness on performance of MLCC[J]. Electronics Process Technology,2011,32(2):105-107
7 Zuo R,Li L,Gui Z. Influence of silver migration on dielectric properties and reliability of relaxor based MLCCs[J]. Ceramics International,2000,26(6):673-676
8 冯小玲,陆亨,安可荣,等.铜内电极MLCC爆瓷问题的研究[J].电子工艺技术,2017,38(2):89-92Feng Xiaoling,Lu Heng,An Kerong,et al. Study of ceramic body burst problem of MLCCs with copper internal electrodes[J]. Eletronics Process Technology,2017,38(2):89-92
9 王艳红,宋子峰,祝忠勇.高Q值铜内电极MLCC的研制[J].电子元件与材料,2011,30(8):5-8Wang Yanhong,Song Zifeng,Zhu Zhongyong. Development of high Q MLCC with Cu internal electrode. Electronic Components&Materials,2011,30(8):5-8
10 易凤举,张红旗,赵碧全.无机添加剂对多层陶瓷电容器钯银内电极浆料的影响.电子元件与材料,2012,31(9):13-15Yi Fengju,Zhang Hongqi,Zhao Biquan. Effect of inorganic additives on the Pd-Ag inner electrode paste of MLCC. Electronic Components&Materials,2012,31(9):13-15
2 张韶鸽,孟淑媛,付衣梅.镍电极MLCC内电极浆料与介质烧成收缩匹配性的研究[J].电子质量,2010,4:34-36Zhang Shaoge,Meng Shuyuan,Fu Yimei. The study of matching of the MLCC Ni inner paste and the media on the firing shrinkage[J].Electronics Quality,2010,4:34-36
3 Zuo R,Li L,Gui Z. Interfacial development and microstructural imperfection of multilayer ceramic chips with Ag/Pd electrodes[J]. Ceramics International,2001,27(8):889-893
4 陈雷,王晓慧,李龙土. BME MLCC中陶瓷-金属界面行为的研究[J].电子元件与材料,2007,26(1):56-58Chen Lei,Wang Xiaohui,Li Longtu. Investigation of ceramic-metal interfacial behavior in base metal electrode MLCC[J]. Electronic Components and Materials,2007,26(1):56-58
5 刘新,李筱瑜,陈长云. MLCC制作过程中分层开裂原因分析[J].电子工艺技术,2011,32(6):335-337Liu Xin,Li Xiaoyu,Chen Changyun. Analysis of reasons for MLCC delamination during manufacturing[J]. Electronics Process Technology,2011,32(6):335-337
6 陈长云,李筱瑜,刘新. MLCC内电极厚度对其性能影响的研究[J].电子工艺技术,2011,32(2):105-107Chen Changyun,Li Xiaoyu,Liu Xin. Research of inner electrode tthickness on performance of MLCC[J]. Electronics Process Technology,2011,32(2):105-107
7 Zuo R,Li L,Gui Z. Influence of silver migration on dielectric properties and reliability of relaxor based MLCCs[J]. Ceramics International,2000,26(6):673-676
8 冯小玲,陆亨,安可荣,等.铜内电极MLCC爆瓷问题的研究[J].电子工艺技术,2017,38(2):89-92Feng Xiaoling,Lu Heng,An Kerong,et al. Study of ceramic body burst problem of MLCCs with copper internal electrodes[J]. Eletronics Process Technology,2017,38(2):89-92
9 王艳红,宋子峰,祝忠勇.高Q值铜内电极MLCC的研制[J].电子元件与材料,2011,30(8):5-8Wang Yanhong,Song Zifeng,Zhu Zhongyong. Development of high Q MLCC with Cu internal electrode. Electronic Components&Materials,2011,30(8):5-8
10 易凤举,张红旗,赵碧全.无机添加剂对多层陶瓷电容器钯银内电极浆料的影响.电子元件与材料,2012,31(9):13-15Yi Fengju,Zhang Hongqi,Zhao Biquan. Effect of inorganic additives on the Pd-Ag inner electrode paste of MLCC. Electronic Components&Materials,2012,31(9):13-15