200℃等温时效下SAC305/Co-5%P焊点的界面组织及断裂模式演变
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摘要
目的研究BGA封装的SAC305/Co-5%P焊点在200℃等温时效下的界面反应。方法制备SAC305/Co-5%P的BGA焊点,200℃等温时效0, 200, 400, 600, 1000 h,采用场发射扫描电镜(配EDS)观察不同时效时间下SAC305/Co-5%P焊点界面的IMC形貌与断口特征,采用焊点接合强度测试仪测试相应的剪切强度变化。结果时效1000 h时,在钎料/Co Sn3的IMC层界面处生成(Cu, Co)_6Sn_5,界面CoSn3的IMC之间的通道得到填充,界面形貌变得平整。随着时效时间的增加,焊点的剪切强度先增后降,位于Sn层断口的断裂模式由韧性断裂向韧脆混合型断裂转变。结论随着时效时间的增加,界面IMC层厚度不断增加,界面IMC形貌发生改变。
The paper aims to research the interfacial reaction of SAC305/Co-5%P solder joints that encapsulated by BGA during isothermal aging at 200 ℃. SAC305/Co-5%P BGA solder joints were prepared by isothermal aging for 0, 200, 400, 600,1000 h at 200 ℃. The interface IMC morphology and fracture characteristics of SAC305/Co-5%P solder joints were observed by SEM(equip EDS), and the shear strength changes were measured by solder joint strength tester.(Cu, Co)6 Sn5 was formed at the interface of solder/CoSn3 IMC layer during isothermal aging for 1000 h; the channel between the interface CoSn3 IMC was filled; and the interface morphology became smooth. With the increase of aging time, the shear strength of solder joints increased first and then decreased. The fracture pattern changed from ductile fracture in Sn layer to ductile-brittle mixed fracture.With the increase of aging time, the thickness of IMC layer increases and the morphology of IMC changes.
The paper aims to research the interfacial reaction of SAC305/Co-5%P solder joints that encapsulated by BGA during isothermal aging at 200 ℃. SAC305/Co-5%P BGA solder joints were prepared by isothermal aging for 0, 200, 400, 600,1000 h at 200 ℃. The interface IMC morphology and fracture characteristics of SAC305/Co-5%P solder joints were observed by SEM(equip EDS), and the shear strength changes were measured by solder joint strength tester.(Cu, Co)6 Sn5 was formed at the interface of solder/CoSn3 IMC layer during isothermal aging for 1000 h; the channel between the interface CoSn3 IMC was filled; and the interface morphology became smooth. With the increase of aging time, the shear strength of solder joints increased first and then decreased. The fracture pattern changed from ductile fracture in Sn layer to ductile-brittle mixed fracture.With the increase of aging time, the thickness of IMC layer increases and the morphology of IMC changes.
引文
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[4]KANG M S,JEON Y J,KIM D S,et al.Degradation Characteristics and Ni3Sn4IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics[J].International Journal of Precision Engineering and Manufacturing,2016,17(4):445-452.
[5]SUN F,ZHU Y,LI X.Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate[J].Journal of Electronic Materials,2017,46(7):1-5.
[6]尹立孟,张新平.电子封装微互连中的电迁移[J].电子学报,2008,36(8):1610-1614.YIN Li-meng,ZHANG Xin-ping.The Electromigration in Electronic Package Micro-interconnects[J].Acta Electronic Sinica,2008,36(8):1610-1614.
[7]董博文,龙伟民,张青科,等.BCu68Zn钎料表面热浸镀锡的工艺研究[J].精密成形工程,2015,7(1):61-65.DONG Bo-wen,LONG Wei-min,ZHANG Qing-ke,et al.The Investigate on the Process of Hot Dip Tin Plating on BCu68Zn Solder[J].Journal of Netshape Forming Engineering,2015,7(1):61-65.
[8]赵宁,钟毅,黄明亮,等.热迁移对Cu/Sn/Cu焊点液-固界面Cu6Sn5生长动力学的影响[J].物理学报,2015,64(16):344-353.ZHAO Ning,ZHONG Yi,HUANG Ming-liang,et al.Effect of Thermal Migration on Growth Kinetics of Cu6Sn5at Liquid/Solid Interface of Cu/Sn/Cu Solder Joints[J].Acta Physica Sinica,2015,64(16):344-353.
[9]王涛,甘贵生,胡志兰,等.纳米Ni颗粒对焊锡膏的界面IMC影响[J].精密成形工程,2014,6(6):122-126.WANG Tao,GAN Gui-sheng,HU Zhi-lan,et al.Effect of Nano-Ni Particles on the Interface IMC of Solder Paste[J].Journal of Netshape Forming Engineering,2014,6(6):122-126.
[10]HAMMAD A E,IBRAHIEM A A.Enhancing the Microstructure and Tensile Creep Resistance of Sn-3.0Ag-0.5Cu Solder Alloy by Reinforcing Nano-sized ZnO Particles[J].Microelectronics Reliability,2017,75:187-194.
[11]YANG G,YANG D,LI L.Microstructure and Morphology of Interfacial Intermetallic Compound Co Sn3 in Sn-Pb/Co-P Solder Joints[J].Microelectronics Reliability,2015,55(11):2403-2411.
[12]TIAN S,ZHOU J,XUE F,et al.Microstructure,Interfacial Reactions and Mechanical Properties of Co/Sn/Co and Cu/Sn/Cu Joints Produced by Transient Liquid Phase Bonding[J].Journal of Materials Science Materials in Electronics,2018,29(19):16388-16400.
[13]LEE B S,KO Y H,BANG J H,et al.Interfacial Reactions and Mechanical Strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu Solder Joints for Power Electronics Applications[J].Microelectronics Reliability,2017,71:119-125.
[14]XIAO H,LI X Y,ZHU Y X,et al.Intermetallic Growth Study on SnAgCu/Cu Solder Joint Interface during Thermal Aging[J].Journal of Materials Science Materials in Electronics,2013,24(7):2527-2536.
[15]YANG L,GE J,ZHANG Y,et al.Investigation on the Microstructure,Interfacial IMC Layer,and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints[J].Journal of Electronic Materials,2016,45(7):3766-3775.