钢铁基体化学镀Ni-W-P合金镀层的研究
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摘要
在化学镀液基本成分不变的情况下,考察了硫脲的质量浓度、乳酸的质量浓度、温度、pH值对沉积速率和化学镀Ni-W-P合金镀层中W的质量分数的影响。确定了最佳的工艺条件为:硫脲5×10~(-5) g/L,乳酸16 g/L,温度90℃,pH值8.8。最佳工艺条件下所得化学镀Ni-W-P合金镀层中Ni、W、P三种元素的质量分数分别为86.38%、4.08%、9.54%。最佳工艺条件下所得化学镀Ni-W-P合金镀层能提高钢铁基体的显微硬度及其在中性盐溶液中的耐蚀性。
The influences of mass concentration of thiourea, mass concentration of lactic acid, temperature and pH value on the deposition rate and mass fraction of W element in electroless Ni-W-P alloy coatings were investigated under the conditions that the basic composition of electroless plating bath remains unchanged. The optimum process conditions were determined as follows: thiourea 5×10~(-5) g/L, lactic acid 16 g/L, temperature 90 ℃, pH value 8.8. Under the optimum conditions, it was found that the mass fraction of Ni, W and P in the electroless Ni-W-P alloy coating was 86.38%, 4.08%, 9.54%, respectively, and the as-prepared electroless Ni-W-P alloy coating could improve the microhardness and corrosion resistance of steel substrate in neutral salt solution.
The influences of mass concentration of thiourea, mass concentration of lactic acid, temperature and pH value on the deposition rate and mass fraction of W element in electroless Ni-W-P alloy coatings were investigated under the conditions that the basic composition of electroless plating bath remains unchanged. The optimum process conditions were determined as follows: thiourea 5×10~(-5) g/L, lactic acid 16 g/L, temperature 90 ℃, pH value 8.8. Under the optimum conditions, it was found that the mass fraction of Ni, W and P in the electroless Ni-W-P alloy coating was 86.38%, 4.08%, 9.54%, respectively, and the as-prepared electroless Ni-W-P alloy coating could improve the microhardness and corrosion resistance of steel substrate in neutral salt solution.
引文
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[4] 俞素芬,雷军,范伟光,等.化学镀Ni-W-P合金沉积机理初探[J].材料保护,2001,34(12):18-19.
[5] 苏修梁,张欣宇.表面涂层与基体间的界面结合强度及其测定[J].电镀与环保,2004,24(2):6-11.
[2] TUSHAR B,SEN R S,ORAON B,et al.Predicting electroless Ni-Co-P coating using response surface method[J].The international journal of advanced manufacturing technology,2013,64(9):1729-1736.
[3] CHENG Y H,CHEN S S,JEN T C,et al.Effect of copper addition on the properties of electroless Ni-Cu-P coating on heat transfer surface[J].The international journal of advanced manufacturing technology,2015,76(9):2209-2215.
[4] 俞素芬,雷军,范伟光,等.化学镀Ni-W-P合金沉积机理初探[J].材料保护,2001,34(12):18-19.
[5] 苏修梁,张欣宇.表面涂层与基体间的界面结合强度及其测定[J].电镀与环保,2004,24(2):6-11.