自动铟封设备及其控制系统
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摘要
铟封是一种重要的软金属封接方法,陀螺的玻璃腔体和金属电极采用铟封,实现谐振腔的真空。目前铟封多采用手工操作,较难实现铟环、电极和腔体孔的对准,且封接一致性差,因此本课题研制自动铟封设备,实现铟环和电极与腔体孔的自动对准放置,并施加温度和封接力。本文利用温度控制器、加热棒、Pt电阻设计了温度闭环控制系统,采用位移-力控制策略,通过控制热压头的位移,结合系统刚度,实现了压封力的稳定控制。实验表明,设备的温度控制最大偏差小于±0.3℃,压封力控制偏差小于9 N。
As a kind of soft metal sealing technology,indium packaging is used in the vacuum sealing process of glass-parts and metal-parts to realize a vacuum space in gyroscope in resonant cavities. But the packaging is commonly manually performed so that the center of the indium ring,the axis of the metal-part and the center of the glass-part's hole are difficult to be ensure in the same line,and the consistent equality of different productions are different to ensure. So an automatic equipment was designed and fabricated. With temperature controller,electrical heaters,and platinum resistences,a simple and effective temperature control system which adopts close-loop strategy is designed to be suitable for the temperature control in the indium packaging process. In the force control part,the position-force strategy is adopted,which means the force is controlled through adjusting the hot embossing head position. According to the experimental results,that the maximum error of the temperature less than ± 0. 3 ℃ and the margin of the force error is 9 N. The system is available for the indium packging.
As a kind of soft metal sealing technology,indium packaging is used in the vacuum sealing process of glass-parts and metal-parts to realize a vacuum space in gyroscope in resonant cavities. But the packaging is commonly manually performed so that the center of the indium ring,the axis of the metal-part and the center of the glass-part's hole are difficult to be ensure in the same line,and the consistent equality of different productions are different to ensure. So an automatic equipment was designed and fabricated. With temperature controller,electrical heaters,and platinum resistences,a simple and effective temperature control system which adopts close-loop strategy is designed to be suitable for the temperature control in the indium packaging process. In the force control part,the position-force strategy is adopted,which means the force is controlled through adjusting the hot embossing head position. According to the experimental results,that the maximum error of the temperature less than ± 0. 3 ℃ and the margin of the force error is 9 N. The system is available for the indium packging.
引文
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[2]Liang Chen,Shuqin Zhang,Shangzhong Jin,et al.Comparative research on Indium Seal Process for Transmission-Mode Ga As Photocathodes[J].Optics Communications,2013,311:385-388.
[3]Yuepng Fang,Trevor J Hyde,Farid Arya,et al.Indium AlloySealedvauum Glazing Development and Context[J].Renewable and Sustainable Energy Reviews 2014,37:480-501.
[4]王涛,赵文锦,唐家叶,等.像增强管制作过程中的气密性研究[J].光电子技术,2015,35(2):140-143.
[5]Qi Chen,Run Hu,Xiaobing Luo.A Statistical Study to Identify the Efforts of Packaging Structures on Lumen Reliability of LEDs[J].Microelectronics Reliability,2017,71:51-55.
[6]何潜,赵玉龙,赵立波,等.MEMS耐高温压力传感器封装工艺研究[J].传感技术学报,2008,21(2):310-313.
[7]任弘毅,王庆生,王国栋,等.He-Ne激光陀螺仪真空铟封结构应力分析与工艺优化[J].真空科学与技术学报,2016,36(11):1266-1270.
[8]Marion Volpert,Christophe Kopp,Julien Routin,et al.A Fluxless Bonding Process Using Au Sn or Indium for Miniaturized Hermetic Package[C]//Electronic Components and Technology Conference2009,San Diego,IEEE:224-31.
[9]曹雪峰.OLED封装技术的研究[D].成都:电子科技大学,2016.
[10]Melinda Hale,David E Hardt.Development of a Low-Cost,RapidCycle Hot Embossing System for Microscale Parts[C]//ASMEInternational Mechanical Engineering Congress and Exposition,Proceedings,Paper No.IMECE2008-67372.
[11]Melinda Hale,David E Hardt.Development and Testing of a Low-Cost Rapid-Cycle Hot Embossing System for Manufacturing Microscale Parts[C]//Proceedings of the ASME Internation Mechanical Engineering Congress and Exposition 2009,Paper No.IMECE2009-11094.
[12]Akash Deodhar,Panos S Shiakolas,Sunil Belligundu.An AI Based Controller for Temperature Control for a Hot Embossing System[C]//Proceeding of the 13th Mediterranean Conference on Control and Automation.Limassol,Cyprus,2005:27-29.
[13]王晓东,刘冲,王立鼎.面向聚合物微结构制作的热压成形设备的研制[J].中国机械工程,2005,16(14):1229-1232.
[14]Wang X D,Liu C,Wang L D,et al.Temperature Control System of Hot Embossing Machine for Fabrication of Micro Channels[C]//Proceeding of 3rd International Symposium on Instrumentation Science and Technology,Xi’an,China,2004:468-473.
[15]苏磊,王晓东,刘冲.RYJ-Ⅱ型聚合物微结构热压成型设备研制[J].机电产品开发与创新,2006,19(6):34-36.
[16]Yashu Ma,Yu Sui,Tao Li,et al.A Submillimeter Packaging for Microsystems in High-Pressure and High-Salinity Downhole Environments[J].Journal of Microelectromechanical System,2015,24(4):861-869.
[17]徐敏,罗怡,王晓东,等.聚合物微结构热压成形温度有限元分析[J].传感技术学报,2006,19(5):2015-2021.
[18]Chang J H,Yang S Y.Development of Fluid-Based Heating and Pressing Syetems for Micro Hot Embossing[J].Microsystem Technologies,2015,11:396-403.