电阻突变法研究厌氧浸渗剂固化的影响因素
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摘要
采用甲基丙烯酸月桂酯、双甲基丙烯酸二缩三乙二醇酯、过氧化二异丙苯、邻苯甲酰磺酰亚胺、N,N-二甲基邻苯胺和萘醌为原料制备厌氧浸渗剂,采用提拉法和电阻突变法测量固化时间,并通过正交试验优化各组分用量,考察各组分用量对浸渗剂的固化时间、固化后胶棒硬度的影响。结果表明:电阻突变法测得的厌氧浸渗剂固化时间比提拉法测得的时间短;其各组分最合适用量为:甲基丙烯酸月桂酯82.484%,双甲基丙烯酸二缩三乙二醇酯14.556%,过氧化二异丙苯0.970%,邻苯甲酰磺酰亚胺0.728%,N,N-二甲基邻苯胺1.213%,萘醌0.049%。在该组分下浸渗剂电阻突变法固化时间为593 s,固化后胶棒邵氏A硬度为92。
Anaerobic impregnant was prepared using methacrylate lauryl,tri-EGDMA,dicumyl peroxide, Saccharin,N,N-Dimethyl-o-toluidine,naphthoqinone. The gelation time was measured by both resistance mutation method and lifing method. With the orthogonal experiments,the influence of each component amount on the gelation time and glue stick hardness was discussed. Results showed that the lift method took longer time to achieve end point of gelation than resistance mutation method. The appropriate amounts of each methacrylate lauryl,hydroxypropyl methacrylate,1,6-hexanediol dimethacrylate,modified polyethylene glycol,emulsifier,initiator,and inhibitor component were accounted for 82. 484%, 14. 556%,0. 970%,0. 728%,1. 213%,and 0. 049%,respectively. Using these components of impregnant,the gelation time was 593 s,the hardness of the cured adhesive rod was 92 Shore A.
Anaerobic impregnant was prepared using methacrylate lauryl,tri-EGDMA,dicumyl peroxide, Saccharin,N,N-Dimethyl-o-toluidine,naphthoqinone. The gelation time was measured by both resistance mutation method and lifing method. With the orthogonal experiments,the influence of each component amount on the gelation time and glue stick hardness was discussed. Results showed that the lift method took longer time to achieve end point of gelation than resistance mutation method. The appropriate amounts of each methacrylate lauryl,hydroxypropyl methacrylate,1,6-hexanediol dimethacrylate,modified polyethylene glycol,emulsifier,initiator,and inhibitor component were accounted for 82. 484%, 14. 556%,0. 970%,0. 728%,1. 213%,and 0. 049%,respectively. Using these components of impregnant,the gelation time was 593 s,the hardness of the cured adhesive rod was 92 Shore A.
引文
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[2]天津海特磁性材料有限公司.粘结钕铁硼磁体真空浸渗厌氧胶的生产工艺及其用途,中国:101937753A[P].2011-01-05.
[3]叶毅.浸渗工艺的发展与应用[J].工艺与装备,2009(3):63-64.
[4]Bogue R.Recent developments in adhesive technology:a review[J].Assembly Automation,2011,31(3):207-211.
[5]Brockmann W,Gei P L,Klingen J,et al.Adhesive bonding:materials,applications and technology[M].Weinheim:Vch Verlagsgesellschaft Mbh,2009.
[6]贾培英.浸渗技术在压铸件中的应用[J].陕西煤炭,2006(4):41-42.
[7]史晓平,李逍翔.铸造生产中浸渗剂及浸渗技术的选用[J].铸造,2012,61(2):211-214.
[8]王强,时维振.一种新型厌氧胶黏剂的合成[J].合成材料老化与应用,2009,38(3):32-35.
[9]凌霄,郑理,项尚林,等.低收缩型有机浸渗密封剂的制备与表征[J].中国胶粘剂,2012,21(1):15-19.
[10]Baldan A.Adhesively-bonded joints and repairs in metallic alloys,polymers and composite materials:adhesives,adhesion theories and surface pretreatment[J].Journal of Materials Science,2004,39(1):1-49.
[11]尹福炎.电阻应变片发展历史的回顾:纪念电阻应变片诞生70周年(1938-2008)[J].衡器,2009,38(3):46-52.
[12]Taguchi C.Fluorescent impregnant for sealing pores of castingscontg fluorescent agents and e.g.anaerobic acrylic-resin:JP,1197057-A[P].1989-08-08.
[13]Burleigh M B,Hatfield T L.Process for preserving wood using fluoro-materials:US,2010/0124612 A1[P].2010-01-21.
[14]Salem L.化学反应中的电子:基本原理[M].张敬畅,曹维良,译.北京:科学出版社,1987.
[15]马希文.正交设计的数学理论[M].北京:人民教育出版社,1981.
[16]Wang W H,Li X P,Zhang X Q.A soy-based adhesive from basic modification[J].Pigment&Resin Technology,2008,37(2):93-97.
[17]陶菊春,吴建民.综合加权评分法的综合权重确定新探[J].系统工程理论与实践,2001,21(8):43-48.