二月桂酸二丁基锡对氰酸酯/聚苯醚复合材料性能的影响
|
摘要
为了提高氰酸酯/聚苯醚树脂体系的固化效率,采用二月桂酸二丁基锡固化催化剂,验证了其催化作用,并研究二月桂酸二丁基锡的用量对覆铜板力学性能、介电性能、吸水率和耐锡焊性的影响。结果表明:二月桂酸二丁基锡可以降低氰酸酯/聚苯醚树脂体系的表观活化能;随着二月桂酸二丁基锡用量的增加,体系的弯曲强度先上升后下降,在用量为2%时达到最大值;介电常数和介质损耗因数随着二月桂酸二丁基锡用量的增加先下降后上升,在用量为1%时达到最低值;吸水率随着二月桂酸二丁基锡用量的增加先下降后上升,在用量为2%时达到最低值;二月桂酸二丁基锡用量大于1%时会影响覆铜板的288℃耐焊锡性。加入适量的二月桂酸二丁基锡不仅可以提高基体树脂的固化效率,而且可以改善氰酸酯/聚苯醚树脂基覆铜板的韧性、介电性能、耐锡焊性,降低吸水率。
In order to improve the curing efficiency of cyanate ester/polyphenylene oxide resin(CE/PPO)system, dibutyl tin dilaurate(DBTDL) was used as catalyst and its catalytic ability was proved. The effects of DBTDL dosage on the mechanical properties, dielectric properties, water absorption rate, and soldering resistance of copper clad laminate(CCL) were studied. The results show that DBTDL can reduce the apparent activation energy of CE/PPO system; with the increase of DBTDL dosage, the bending strength of CE/PPO system increases at first and then decreases, reaches the maximum value when the dosage is 2%; the dielectric constant and dielectric loss factor of CE/PPO system decrease at first and then increase with the increase of DBTDL dosage, both reach the minimum values when the dosage is 1%; the water absorption rate of CE/PPO system decreases at first and then increases with the increase of DBTDL dosage, reaches the minimum value when the dosage is 2%; when the dosage of DBTDL is more than 1%, the soldering resistance of CCL at 288 ℃ is influenced. Adding proper amount of DBTDL improves the toughness, dielectric properties, and soldering resistance, while decreases the water absorption rate of CE/PPO based copper clad laminate.
In order to improve the curing efficiency of cyanate ester/polyphenylene oxide resin(CE/PPO)system, dibutyl tin dilaurate(DBTDL) was used as catalyst and its catalytic ability was proved. The effects of DBTDL dosage on the mechanical properties, dielectric properties, water absorption rate, and soldering resistance of copper clad laminate(CCL) were studied. The results show that DBTDL can reduce the apparent activation energy of CE/PPO system; with the increase of DBTDL dosage, the bending strength of CE/PPO system increases at first and then decreases, reaches the maximum value when the dosage is 2%; the dielectric constant and dielectric loss factor of CE/PPO system decrease at first and then increase with the increase of DBTDL dosage, both reach the minimum values when the dosage is 1%; the water absorption rate of CE/PPO system decreases at first and then increases with the increase of DBTDL dosage, reaches the minimum value when the dosage is 2%; when the dosage of DBTDL is more than 1%, the soldering resistance of CCL at 288 ℃ is influenced. Adding proper amount of DBTDL improves the toughness, dielectric properties, and soldering resistance, while decreases the water absorption rate of CE/PPO based copper clad laminate.
引文
[1]辜信实.印刷电路用覆铜箔层压板[M].北京:化学工业出版社,2002.
[2]张梦萌,颜红侠,管兴华,等.氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料固化动力学研究[J].中国塑料,2012,26(4):40-44.
[3]PRABU A A,ALAGAR M.Mechanical and thermal studies of intercross-linked networks on siliconized polyurethane-epoxy/unsaturated polyester coatings[J].Progress in Organic Coatings,2004,49(3):236-243.
[4]崔溢,赵继承,蔡良元,等.热塑性树脂增韧氰酸酯树脂的研究进展[J].高科技纤维与应用,2009,34(2):38-41.
[5]马泽民.环氧/氰酸酯/聚醚酮半互穿网络聚合物的结构与性能[D].大连:大连理工大学,2008.
[6]何少波.半互穿网络结构改性氰酸酯树脂体系研究[D].西安:西北工业大学,2007.
[7]田文平.氰酸酯树脂改性及其碳纤维复合材料的性能研究[D].南京:南京航空航天大学,2016.
[8]吴培熙,张留城.聚合物共混改性原理及工艺[M].北京:中国轻工业出版社,1984.
[9]PRIVALKO V P,AZARENKOV V P,BAIBAK A V,et al.Thermodynamic characterization of interpenetrating polymer networks[J].Polymer Engineering&Science,1996,36(8):1052-1057.
[10]HAMERTON I.Chemistry and technology of cyanate ester resins[M].London:Blackie Academic and Professional,1994.
[11]REGHUNADHAN NAIR C P.Advances in addition-cure phenolic resins[J].Progress in Polymer Science,2004,29(5):401-498.
[12]娄宝兴,王家梁,张丹枫.氰酸酯树脂的结构与性能[J].绝缘材料,2005,38(6):53-57.
[13]李文峰,章文利,梁国正,等.氰酸酯树脂的固化反应及其催化剂[J].航空材料学报,2003,23(2):56-62.
[14]MATHEW D,NAIR C P R,KRISHNAN K,et al.Catalysis of the cure reaction of bisphenol A dicyanate.A DSC study[J].Journal of Polymer Science Part A:Polymer Chemistry,1999,37(8):1103-1114.
[15]李文峰,辛文利,梁国正,等.有机锡化合物催化氰酸酯树脂固化反应的研究——(Ⅱ)催化剂的生成反应及催化固化反应机理[J].高分子材料科学与工程,2004,20(3):72-75.
[2]张梦萌,颜红侠,管兴华,等.氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料固化动力学研究[J].中国塑料,2012,26(4):40-44.
[3]PRABU A A,ALAGAR M.Mechanical and thermal studies of intercross-linked networks on siliconized polyurethane-epoxy/unsaturated polyester coatings[J].Progress in Organic Coatings,2004,49(3):236-243.
[4]崔溢,赵继承,蔡良元,等.热塑性树脂增韧氰酸酯树脂的研究进展[J].高科技纤维与应用,2009,34(2):38-41.
[5]马泽民.环氧/氰酸酯/聚醚酮半互穿网络聚合物的结构与性能[D].大连:大连理工大学,2008.
[6]何少波.半互穿网络结构改性氰酸酯树脂体系研究[D].西安:西北工业大学,2007.
[7]田文平.氰酸酯树脂改性及其碳纤维复合材料的性能研究[D].南京:南京航空航天大学,2016.
[8]吴培熙,张留城.聚合物共混改性原理及工艺[M].北京:中国轻工业出版社,1984.
[9]PRIVALKO V P,AZARENKOV V P,BAIBAK A V,et al.Thermodynamic characterization of interpenetrating polymer networks[J].Polymer Engineering&Science,1996,36(8):1052-1057.
[10]HAMERTON I.Chemistry and technology of cyanate ester resins[M].London:Blackie Academic and Professional,1994.
[11]REGHUNADHAN NAIR C P.Advances in addition-cure phenolic resins[J].Progress in Polymer Science,2004,29(5):401-498.
[12]娄宝兴,王家梁,张丹枫.氰酸酯树脂的结构与性能[J].绝缘材料,2005,38(6):53-57.
[13]李文峰,章文利,梁国正,等.氰酸酯树脂的固化反应及其催化剂[J].航空材料学报,2003,23(2):56-62.
[14]MATHEW D,NAIR C P R,KRISHNAN K,et al.Catalysis of the cure reaction of bisphenol A dicyanate.A DSC study[J].Journal of Polymer Science Part A:Polymer Chemistry,1999,37(8):1103-1114.
[15]李文峰,辛文利,梁国正,等.有机锡化合物催化氰酸酯树脂固化反应的研究——(Ⅱ)催化剂的生成反应及催化固化反应机理[J].高分子材料科学与工程,2004,20(3):72-75.