基于多物理场耦合的电子器件性能分析
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摘要
考虑电子器件实际工作过程中受到电、热、力多个物理场的耦合作用,基于顺序耦合计算理论,构建了电子器件的多物理场耦合分析方法。以某型电子插槽为对象,通过实例分析计算,对该分析方法进行了具体应用。最后,通过实验对该分析方法的准确性进行验证,结果表明:仿真计算误差在4.6%以内,能够用于电子器件的性能预测与优化。
A multi-field coupling analysis method of electronic device is constructed based on the sequential coupled calculation theory,considering the coupling interaction of electro-thermal-mechanical,during the electronic device's working condition. Taking the electronic slot as an example,the constructed analysis method is applied to calculate the concrete performance. Then,an actual experiment is conducted to verify the calculation accuracy of the constructed analysis method. The test results show that the calculation error is less than 4. 6%,which indicates that the analysis method could be applied to the forecasting and optimization of electronic device.
A multi-field coupling analysis method of electronic device is constructed based on the sequential coupled calculation theory,considering the coupling interaction of electro-thermal-mechanical,during the electronic device's working condition. Taking the electronic slot as an example,the constructed analysis method is applied to calculate the concrete performance. Then,an actual experiment is conducted to verify the calculation accuracy of the constructed analysis method. The test results show that the calculation error is less than 4. 6%,which indicates that the analysis method could be applied to the forecasting and optimization of electronic device.
引文
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2禹鑫,杜明星,窦汝振,等.IGBT功率模块键合线故障下的温度特性研究.电力电子技术,2015;49(2):55-57Yu Xin,Du Mingxing,Dou Ruzhen,et al.The research about temperature characteristics of IGBT power modules under the bonding wires failure.Power Electronics,2015;49(2):55-57
3赵亮,郭建平,田沣.机载电子设备热力耦合仿真分析.机械研究与应用,2016;29(2):31-32Zhao Liang,Guo Jianping,Tian Feng.Thermo-mechanical coupling simulation analysis of airborne electronics equipment.Mechanical Research&Application,2016;29(2):31-32
4 Koziol P,Hryniewicz Z.Analysis of bending waves in beam on viscoelastic random foundation using wavelet technique.International Journal of Solids and Structures,2006;43(22):6965-6977
5贾晓东,高原文.热电器件焊接层热电耦合应力分布特征.兰州大学学报(自然科学版),2011;47(1):91-96Jia Xiaodong,Gao Yuanwen.Distribution characteristics of thermoelectric coupling stress in the solder layer of thermoelectric devices.Journal of Lanzhou University(Natural Sciences),2011;47(1):91-96
6周思柱,廖建敏,李宁,等.基于热固耦合的压裂泵泵头体工作特性研究.科学技术与工程,2015;15(25):38-43Zhou Sizhu,Liao Jianmin,Li Ning,et al.Research on working characteristics of pump body of fracturing pump based on thermal-solid coupling analysis.Science Technology and Engineering,2015;15(25):38-43
7李雅娣,南宝江,吴平.微点火单元电热过程分析.科学技术与工程,2012;12(3):611-614Li Yadi,Nan Baojiang,Wu Ping.Electrothermal analysis of tiny ignition unit.Science Technology and Engineering,2012;12(3):611-614