电连接器多物理场耦合分析方法研究
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摘要
针对电连接器机械结构的可靠性问题及其工作状态中复杂的物理环境,提出了采用多物理场耦合分析方法进行研究,通过采用CST和ANSYS模拟技术,在建立的USB 3.0电连接器模型基础上分析研究了电连接器的电热耦合和热力耦合特性,获取了USB 3.0电连接器的电流密度分布、温度分布及应力-应变分布规律。由电-热-力耦合作用而产生的2个不同温度区间的最大应力值分别达到1 019.4 MPa和1 238.1 MPa。所得结论可为电连接器的结构优化设计及可靠性评估提供参考。
The multi-physics coupling analysis method was proposed to solve reliability problems on the mechanical structure of electrical connectors which were working in the complex physical environment.The electro-thermal coupling and thermal-mechanical coupling properties based on USB 3.0electrical connector model were studied by using CST and ANSYS simulation techniques.Meanwhile,the current density distribution,temperature distribution and stress-strain distribution were obtained for USB3.0electrical connector.Moreover,stress is produced by electro-thermal-mechanical coupling effect.The maximum stress values within two different temperature ranges are 1 019.4 MPa and 1 238.1 MPa,respectively.The conclusions can be helpful for structure optimization design and reliability evaluation of electrical connectors.
The multi-physics coupling analysis method was proposed to solve reliability problems on the mechanical structure of electrical connectors which were working in the complex physical environment.The electro-thermal coupling and thermal-mechanical coupling properties based on USB 3.0electrical connector model were studied by using CST and ANSYS simulation techniques.Meanwhile,the current density distribution,temperature distribution and stress-strain distribution were obtained for USB3.0electrical connector.Moreover,stress is produced by electro-thermal-mechanical coupling effect.The maximum stress values within two different temperature ranges are 1 019.4 MPa and 1 238.1 MPa,respectively.The conclusions can be helpful for structure optimization design and reliability evaluation of electrical connectors.
引文
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[22]余红光.Micro-USB电连接器无铅焊点热疲劳寿命研究[D].成都:电子科技大学,2014.YU Hongguang.Research of the thermal fatigue life on the lead-free solder joint of micro-USB connector[D].Chengdu:University of Electronic Science and Technology of China,2015.(in Chinese)
[2]LARSSON M P,SYMS R R A.Self-aligning MEMSin-line separable electrical connector[J].Journal of Microelectromechanical Systems,2004,13(2):365-376.
[3]FU R,CHOE S Y B,JACKSON R L,et al.Vibrationinduced changes in the contact resistance of high power electrical connectors for hybrid vehicles[J].IEEETransactions on Components Packaging&Manufacturing Technology,2012,2(2):185-193.
[4]MENGOTTI E,DUARTE L I,PIPPOLA J,et al.Fretting corrosion:analysis of the failure mechanism for low voltage drives applications[J].Microelectronics Reliability,2014,54(9/10):2109-2114.
[5]储刘庆.振动环境对开关连接器电接触可靠性影响的研究[D].北京:北京邮电大学,2011.CHU Liuqing.research on raliability of switch connectors under dynamic environment[D].Beijing:Beijing University of Posts and Telecommunications,2011.(in Chinese)
[6]钱萍.航天电连接器综合应力加速寿命试验与统计分析的研究[D].浙江:浙江大学,2010.QIAN Ping.Research on multiple stresses accelerated life test and statistical analysis of aerospace electrical connector[D].Zhejiang:Zhejiang University,2010.(in Chinese)
[7]AHN H M,KIM J K,OH Y H,et al.Multi-physics analysis for temperature rise prediction of power transformer[J].Journal of Electrical Engineering&Technology,2014,9(1):114-120.
[8]MAZZANTI G.The combination of electro-thermal stress,load cycling and thermal transients and its effects on the life of high voltage ac cables[J].IEEETransactions on Dielectrics and Electrical Insulation,2009,16(4):1168-1179.
[9]WANG C S,DUAN B Y,ZHANG F S,et al.Coupled structural-electromagnetic-thermal modelling and analysis of active phased Array antennas[J].IET Microwaves Antennas&Propagation,2010,4(2):247-257.
[10]POLCHOW J R,ANGADI S V,JACKSON R L,et al.A multi-physics finite element analysis of round pin high power connectors[C]Electrical Contacts(HOLM),2010 Proceedings of the 56th IEEE Holm Conference on.[S.l.]IEEE,2010:1-9.
[11]GUAN X Y,SHU N Q,KANG B,et al.Multiphysics analysis of plug-in connector under steady and short circuit conditions[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2015,5(3):320-327.
[12]MEI Q G,SCHOENMAKER W,WENG S H,et al.An efficient transient electro-thermal simulation framework for power integrated circuits[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2016,35(5):832-843.
[13]YE Y H,SHI Y X,CAI N S,et al.Electro-thermal modeling and experimental validation for lithium ion battery[J].Journal of Power Sources,2012,199(1):227-238.
[14]李腾,林成涛,陈全世.锂离子电池三维多层多物理场模型[J].清华大学学报(自然科学版),2012,52(7):995-1000.LI Teng,LIN Chengtao,CHEN Quanshi.Lithium-ion battery 3-dimensional multi-layer multi-field model[J].Journal of Tsinghua University(Science and Technology),2012,52(7):995-1000.(in Chinese)
[15]LAI Y S,WANG T H,LEE C C.Thermal-mechanical coupling analysis for coupled power-and thermal-cycling reliability of board-level electronic packages[J].IEEE Transactions on Device and Materials Reliability,2008,8(1):122-128.
[16]WANG T H,LAI Y S,LEE C C,et al.Coupled power and thermal cycling reliability of board-level packageon-package stacking assembly[J].IEEE Transactions on Electronics Packaging Manufacturing,2009,32(1):14-21.
[17]CARVOU E,EL ABDI R,RAZAFIARIVELO J,et al.Thermo-mechanical study of a power connector[J].Measurement,2012,45(5):889-896.
[18]宋少云.多场耦合问题的协同求解方法研究与应用[D].武汉:华中科技大学,2007.SONG Shaoyun.Research and application of collaborative solution method for multiphysics problems[D].Wuhan:Huazhong University of Science and Technology,2007.(in Chinese)
[19]程张.混合多物理场仿真方法及其在封装中的可靠性应用研究[D].上海:上海交通大学,2014.CHENG Zhang.Mixed multi-physics simulation method and its application in reliability studies of package[D].Shanghai:Shanghai Jiao Tong University,2014.(in Chinese)
[20]李淼.热替换条件下电连接器电热耦合失效机理研究[D].成都:电子科技大学,2015.LI Miao.The thermal-electric coupling failure mechanism research of eectric connector under the condition of hot replacement[D].Chengdu:University of Electronic Science and Technology of China,2015.(in Chinese)
[21]曾正明.实用金属材料选用手册[M].北京:机械工业出版社,2012:632-637.ZENG Zhengming.Practical metal material selection manual[M].Beijing:China Machine Press,2012:632-637.(in Chinese)
[22]余红光.Micro-USB电连接器无铅焊点热疲劳寿命研究[D].成都:电子科技大学,2014.YU Hongguang.Research of the thermal fatigue life on the lead-free solder joint of micro-USB connector[D].Chengdu:University of Electronic Science and Technology of China,2015.(in Chinese)