镀有石墨烯层微热压模具电热耦合作用数值仿真
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摘要
提出一种提高微热压模具加热冷却速率、缩短微热压成型循环周期的方法。在硅片表面使用化学气相沉积CVD的方法制备石墨烯层,利用石墨烯层高电导率、热导率等特性,研究石墨烯层电热耦合作用对模具温度的影响规律。模拟结果表明,硅模具施加电势增加或石墨烯层厚增加,硅片表面平均温度的升高速率增大;当石墨烯层厚为40 nm、施加电压为150 V时,硅片表面由室温升温加热速率可以达到9.87 K/s,模具温度稳定后,微结构处的温度略高于硅片表面其他位置。
A method for increasing the micro extrusion mold heating cooling rate and shortening the hot pressing molding cycle was put forward. By coating graphene layers on the silicon wafer surface by CVD(Chemical vapor deposition),according to the properties of graphene with high electrical conductivity and thermal conductivity and so on,the influence of the graphene layer electric coupling on the mold's temperature was studied. The simulation results indicated that the higher voltage and thicker graphene layer would cause a relatively higher temperature rising rate. When the graphene layer has a thickness of 40 nm and the applied voltage is 150 V,the temperature of silicon wafer surface increases quickly to a heating rate of 9.87 K/s from room temperature. When the temperature of the silicon mold temperature is stable,the temperature of the microstructure is higher than the bulk silicon wafer surface.
A method for increasing the micro extrusion mold heating cooling rate and shortening the hot pressing molding cycle was put forward. By coating graphene layers on the silicon wafer surface by CVD(Chemical vapor deposition),according to the properties of graphene with high electrical conductivity and thermal conductivity and so on,the influence of the graphene layer electric coupling on the mold's temperature was studied. The simulation results indicated that the higher voltage and thicker graphene layer would cause a relatively higher temperature rising rate. When the graphene layer has a thickness of 40 nm and the applied voltage is 150 V,the temperature of silicon wafer surface increases quickly to a heating rate of 9.87 K/s from room temperature. When the temperature of the silicon mold temperature is stable,the temperature of the microstructure is higher than the bulk silicon wafer surface.
引文
[1]谈卫国,许忠斌,蒋兴浩.聚合物微纳加工设备的研究进展[J].橡塑技术与装备,2015,41(2):6-12Tan W G,Xu Z B,Jiang X H.Advances in polymer micro nanofabrication equipment[J].China Rubber/Plastics Technology and Equipment,2015,41(2):6-12(in Chinese)
[2]杨振洲.聚合物微结构平板热压印成型工艺的研究[D].北京:北京化工大学,2015Yang Z Z.The study of polymer micro-structure plate to plate hot embossing process[D].Beijing:Beijing University of Chemical Technology,2015(in Chinese)
[3]贺永,傅建中,陈子辰.微热压成型过程聚合物流动特性研究[J].浙江大学学报(工学版),2008,42(5):858-862He Y,Fu J Z,Chen Z C.Flow behavior of polymer during micro hot embossing[J].Journal of Zhejiang University(Engineering Science),2008,42(5):858-862(in Chinese)
[4]Kimerling T E,Liu W D,Kim B H,et al.Rapid hot embossing of polymer microfeatures[J].Microsystem Technologies,2006,12(8):730-735
[5]Xie P C,He P,Yen Y C,et al.Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampers[J].Surface and Coatings Technology,2014,258:174-180
[6]Jha J S,Joshi S S.Numerical simulation of micro hot embossing of polymer substrate[J].International Journal of Precision Engineering and Manufacturing,2012,13(12):2215-2224
[7]Chang J H,Yang S Y.Development of fluid-based heating and pressing systems for micro hot embossing[J].Microsystem Technologies,2005,11(6):396-403
[8]Jeng M C,Chen S C,Minh P S,et al.Rapid mold temperature control in injection molding by using steam heating[J].International Communications in Heat and Mass Transfer,2010,37(9):1295-1304
[9]Nagato K,Hattori S,Hamaguchi T,et al.Rapid thermal imprinting of high-aspect-ratio nanostructures with dynamic heating of mold surface[J].Journal of Vacuum Science&Technology B,2010,28(6):C6M122-C6M124
[10]Meyer J C,Geim A K,Katsnelson M I,et al.The structure of suspended graphene sheets[J].Nature,2007,446(7131):60-63
[11]任成,王小军,李永祥,等.石墨烯复合材料的研究及其应用[J].现代化工,2015,35(1):32-35Ren C,Wang X J,Li Y X,et al.Research and application of graphene composites[J].Modern Chemical Industry,2015,35(1):32-35(in Chinese)
[12]肖淑娟,于守武,谭小耀.石墨烯类材料的应用及研究进展[J].化工进展,2015,34(5):1345-1348Xiao S J,Yu S W,Tan X Y.Research progress and the applications of graphene materials[J].Chemical Industry and Engineering Progress,2015,34(5):1345-1348(in Chinese)
[13]Warner J H,Schffel F,Bachmatiuk A,等.石墨烯:基础及新兴应用[M].付磊,曾梦琪,译.北京:科学出版社,2015:107-187Warner J H,Schffel F,Bachmatiuk A,et al.Graphene:fundamentals and emergent applications[M].Fu L,Zeng M Q,Trans.Beijing:Science Press,2015:107-187(in Chinese)
[14]Rafiee M A,Rafiee J,Wang Z,et al.Enhanced mechanical properties of nanocomposites at low graphene content[J].ACS Nano,2009,3(12):3884-3890
[2]杨振洲.聚合物微结构平板热压印成型工艺的研究[D].北京:北京化工大学,2015Yang Z Z.The study of polymer micro-structure plate to plate hot embossing process[D].Beijing:Beijing University of Chemical Technology,2015(in Chinese)
[3]贺永,傅建中,陈子辰.微热压成型过程聚合物流动特性研究[J].浙江大学学报(工学版),2008,42(5):858-862He Y,Fu J Z,Chen Z C.Flow behavior of polymer during micro hot embossing[J].Journal of Zhejiang University(Engineering Science),2008,42(5):858-862(in Chinese)
[4]Kimerling T E,Liu W D,Kim B H,et al.Rapid hot embossing of polymer microfeatures[J].Microsystem Technologies,2006,12(8):730-735
[5]Xie P C,He P,Yen Y C,et al.Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampers[J].Surface and Coatings Technology,2014,258:174-180
[6]Jha J S,Joshi S S.Numerical simulation of micro hot embossing of polymer substrate[J].International Journal of Precision Engineering and Manufacturing,2012,13(12):2215-2224
[7]Chang J H,Yang S Y.Development of fluid-based heating and pressing systems for micro hot embossing[J].Microsystem Technologies,2005,11(6):396-403
[8]Jeng M C,Chen S C,Minh P S,et al.Rapid mold temperature control in injection molding by using steam heating[J].International Communications in Heat and Mass Transfer,2010,37(9):1295-1304
[9]Nagato K,Hattori S,Hamaguchi T,et al.Rapid thermal imprinting of high-aspect-ratio nanostructures with dynamic heating of mold surface[J].Journal of Vacuum Science&Technology B,2010,28(6):C6M122-C6M124
[10]Meyer J C,Geim A K,Katsnelson M I,et al.The structure of suspended graphene sheets[J].Nature,2007,446(7131):60-63
[11]任成,王小军,李永祥,等.石墨烯复合材料的研究及其应用[J].现代化工,2015,35(1):32-35Ren C,Wang X J,Li Y X,et al.Research and application of graphene composites[J].Modern Chemical Industry,2015,35(1):32-35(in Chinese)
[12]肖淑娟,于守武,谭小耀.石墨烯类材料的应用及研究进展[J].化工进展,2015,34(5):1345-1348Xiao S J,Yu S W,Tan X Y.Research progress and the applications of graphene materials[J].Chemical Industry and Engineering Progress,2015,34(5):1345-1348(in Chinese)
[13]Warner J H,Schffel F,Bachmatiuk A,等.石墨烯:基础及新兴应用[M].付磊,曾梦琪,译.北京:科学出版社,2015:107-187Warner J H,Schffel F,Bachmatiuk A,et al.Graphene:fundamentals and emergent applications[M].Fu L,Zeng M Q,Trans.Beijing:Science Press,2015:107-187(in Chinese)
[14]Rafiee M A,Rafiee J,Wang Z,et al.Enhanced mechanical properties of nanocomposites at low graphene content[J].ACS Nano,2009,3(12):3884-3890