多波长集成光源阵列封装用微波馈线设计
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摘要
针对多波长集成光源阵列封装设计了一种具有低传输损耗、低串扰的阵列微波馈线。通过分析微带线和接地共面波导在传输高频微波信号时的优缺点,设计了一种桥型微波馈线结构。同时利用有限元法,对馈线尺寸参数进行仿真优化。在30GHz范围内,得到了反射系数低于-17dB、传输损耗小于0.4dB、相邻信号电极间串扰小于-26dB的仿真结果。设计了基于金线键合的阵列芯片方案,并通过有限元法仿真确定了传输性能良好的封装间距。
A microwave transmission line with low transmission loss and low crosstalk was designed for the packaging of integrated light source array.A bridge-type microwave transmission line was obtained by analyzing the advantages and disadvantages of microstrip line and grounded coplanar waveguide.Simulations based on finite element method were used to optimize the structural parameters of the transmission line,and the results show that in the fequency range of up to 30 GHz,the reflection coefficient of the transmission line is less than-17 dB,the transmission loss is less than 0.4 dB,and the crosstalk between adjacent lanes is less than-26 dB.A package design for the array chip based on wire-bonding was presented,and the distance between the array chip and the transmission line was optimized.
A microwave transmission line with low transmission loss and low crosstalk was designed for the packaging of integrated light source array.A bridge-type microwave transmission line was obtained by analyzing the advantages and disadvantages of microstrip line and grounded coplanar waveguide.Simulations based on finite element method were used to optimize the structural parameters of the transmission line,and the results show that in the fequency range of up to 30 GHz,the reflection coefficient of the transmission line is less than-17 dB,the transmission loss is less than 0.4 dB,and the crosstalk between adjacent lanes is less than-26 dB.A package design for the array chip based on wire-bonding was presented,and the distance between the array chip and the transmission line was optimized.
引文
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[2] Kanazawa S,Fujisawa T,Ohki A,et al.A compact EADFB laser array module for a future 100-Gb/s ethernet transceiver[J].IEEE J.of Sel.Topics in Quantum Electron.,2011,17(5):1191-1197.
[3]赵家美,孙长征,熊兵,等.4×25Gb/s电吸收调制器与DFB激光器集成光源阵列封装方案研究[J].半导体光电,2017,38(1):12-15.Zhao Jiamei,Sun Changzheng,Xiong Bing,et al.Package design for 4×25Gb/s electroabsorption modulated laser array[J].Semiconductor Optoelectronics,2017,38(1):12-15.
[4]野瑞萍.CPW空气桥及其在不连续性结构中的应用研究[D].南京:南京邮电大学,2014.Ye Ruiping.Research on CPW air bridge and its application in discontinuities[D].Nanjing:Nanjing University of Posts and Telecommun.,2014.
[5] Kanazawa S,Fujisawa T,Nunoya N,et al.Ultra-compact100 GbE transmitter optical sub-assembly for 40-km SMF transmission[J].J.of Lightwave Technol.,2013,31(4):602-608.
[6] Ghione G, Naldi C U.Coplanar waveguides for MMIC applications:Effect of upper shielding,conductor backing,finite-extent ground planes,and line-to-line coupling[J].IEEE Trans.on Microwave Theory and Techniques,1987,35(3):260-267.
[7] Sain A,Melde K L.Impact of ground via placement in grounded coplanar waveguide interconnects[J].IEEE Trans.on Components,Packaging and Manufacturing Technol.,2016,6(1):136-144.
[8] Zhang Z,Liu Y,Wang J,et al.Three-dimensional package design for electro-absorption modulation laser array[J].IEEE Photon.J.,2016,8(2):1-12.
[9] Raskin J P,Gauthier G,Katehi L P,et al.Mode conversion at GCPW-to-microstrip-line transitions[J].IEEE Trans.on Microwave Theory and Techniques,2000,48(1):158-161.
[10] Varoutas D,Arapoyianni A,Sphicopoulos T.Modeling of electrical crosstalk in OEIC modules[J].Fiber and Integrated Optics,2005,24(2):91-111.