焊接温度对Cu/Al瞬间液相扩散焊接头性能的影响
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摘要
采用AC8B铝合金箔,在0.1 Pa真空度下,对Cu/Al异种金属进行瞬间液相扩散连接(Transient Liquid Phase,TLP),并研究了在不同焊接温度下接头区显微组织、不同区域元素的扩散迁移及接头力学性能。结果表明,Cu/Al TLP连接接头界面元素扩散明显,存在一定厚度的扩散层;铜铝两侧扩散层主要由Cu9Al4、Cu Al2金属间化合物组成,且随着焊接温度的变化,金属间化合物种类未发生改变。两侧扩散层的显微硬度明显高于基体母材,随着焊接温度的增加,接头剪切强度呈现出先上升而后下降的趋势,且在焊接温度为500℃时,接头剪切强度达到60.4 MPa。
Transient Liquid Phase( TLP) of Cu/Al dissimilar metals was investigated applying AC8 B aluminum alloy foil under vacuum protection of 0. 1 Pa. The microstructures of joints as well as its mechanical properties and diffusion of elements in different regions under different welding temperature conditions were investigated. The results show that elements on Cu/Al TLP interface diffuse significantly and there is a certain thickness of diffusion layer,which is mainly composed of intermetallic compounds( Cu9 Al4 and Cu Al2) on both sides. The types of intermetallic compounds wouldn't change with welding temperature. The micro-hardness of two-sided diffusion layer is significantly higher than that of the matrix. The shear strength of the joint rises firstly with welding temperature increases and then decreases.The joint shear strength reaches 60. 4 MPa at 500 ℃.
Transient Liquid Phase( TLP) of Cu/Al dissimilar metals was investigated applying AC8 B aluminum alloy foil under vacuum protection of 0. 1 Pa. The microstructures of joints as well as its mechanical properties and diffusion of elements in different regions under different welding temperature conditions were investigated. The results show that elements on Cu/Al TLP interface diffuse significantly and there is a certain thickness of diffusion layer,which is mainly composed of intermetallic compounds( Cu9 Al4 and Cu Al2) on both sides. The types of intermetallic compounds wouldn't change with welding temperature. The micro-hardness of two-sided diffusion layer is significantly higher than that of the matrix. The shear strength of the joint rises firstly with welding temperature increases and then decreases.The joint shear strength reaches 60. 4 MPa at 500 ℃.
引文
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[2]BRAUNOVIC M.Reliability of power connections[J].Journal of Zhejiang university science A,2007,8(3):343-356.
[3]张满.铝/铜异种材料焊接的研究现状[J].热加工工艺,2009,38(9):116-119.
[4]夏春智,李亚江,王娟.Cu/Al异种金属连接的研究现状[J].焊接,2008(1):17-20.
[5]肖勇.超声波辅助Cu/Al液相钎焊接头冶金连接机制及性能研究[D].哈尔滨:哈尔滨工业大学,2014.
[6]张贵锋,张建勋,王士元,等.瞬间液相扩散焊与钎焊主要特点之异同[J].焊接学报,2002,23(6):92-96.
[7]DUVALL D S,OWCZARSKI W A,PAULONIC D F.TLP bonding:A new method for joining heat resistant alloys[J].Welding Journal,1974,53(4):203-214.
[8]KOYAMA K,SHINOZAKI K J,LKEDA K J,et al.Evaluation of brazig properties using Al-Si-Mg-Bi brazing alloy-development of brazing technique for Al-Cu dissimilar joint[J].Joumal of light metal welding and construction,2002,40(9):13-20.
[9]王学刚.铜铝瞬间液相扩散焊组织与性能研究[D].济南:山东大学,2015.
[10]王非森,陈思杰,高增,等.焊接温度对10Cr9Mo1VNb钢TLP接头性能的影响[J].热加工工艺,2009,38(23):161-162.
[11]EIZADJOU M,TALACHI A K,MANESH H D,et al.Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by Accumulative Roll Bonding(ARB)process[J].Composites science&technology,2008,68(9):2003-2009.
[12]李小兵,祖国胤,王平.退火温度对异步轧制铜/铝复合板界面组织及力学性能的影响[J].中国有色金属学报,2013,23(5):1202-1207.
[13]GUO Y J,LIU G W,JIN H Y,et al.Intermetallic phase formation in diffusion-bonded Cu/Al laminates[J].Journal of materials science,2011,46(8):2467-2473.
[14]常东旭,王平,龚潇于,等.Si对Cu/Al冷轧复合界面组织与力学性能的影响[J].稀有金属材料与工程,2015,44(9):2216-2221.