陶瓷-金属针封开裂问题研究
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摘要
针封作为陶瓷-金属封接类型之一,封接难度很大,封接界面常常出现微观开裂;研究了小孔加工磨料粒径、焊针材质以及封接间隙对封接效果的影响,结果表明:采用320目的碳化硼磨料进行小孔加工,选用4J-34的焊针,控制0.15~0.20mm的封接间隙,可以有效避免针封开裂。
As one of ceramic-metal sealing technique,pin sealing is very difficult to realize and microcracks often appear in sealing interface.The effect on sealing of abrasive particle size of micro hole-making,material of welding pin and the sealing gap and the sealing gap were studied in this work.The results showed that cracking could be effectively eliminated by using 320-mesh boron carbide abrasive particle,4J-34 welding pin and a sealing gap of 0.15~0.20 mm.
As one of ceramic-metal sealing technique,pin sealing is very difficult to realize and microcracks often appear in sealing interface.The effect on sealing of abrasive particle size of micro hole-making,material of welding pin and the sealing gap and the sealing gap were studied in this work.The results showed that cracking could be effectively eliminated by using 320-mesh boron carbide abrasive particle,4J-34 welding pin and a sealing gap of 0.15~0.20 mm.
引文
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[6]高陇桥.陶瓷二次金属化和封接的可靠性[J].真空电子技术,2009,(2):41-49.
[7]高陇桥.陶瓷-金属封装中的二次金属化技术[J].电子工艺技术,2002,23(4):164-166.
[8]赵世柯,肖东梅,吕京京.透明氧化铝陶瓷金属化与封接实验研究[J].真空电子技术,2010,(3):25-27.
[9]高陇桥.陶瓷金属化厚度及其均匀性[J].山东陶瓷,2002,25(2):21-23.
[10]尚阿曼,高鸣,黄亦工,等.高纯氧化铝陶瓷表面形貌对Mo-Mn法金属化封接强度的影响[J].真空电子技术,2013,(4):27-30.
[11]旷峰华,张洪波,任瑞康,等.凝胶注模法法制备氧化铝基片常见微观缺陷分析[J].真空电子技术,2013,(4):50-61.
[12]PINCUS A G.Metallographic Examination of CeramicMetal Seals[J].J Am Ceram Soc,1953,36(5):152-158.
[2]高陇桥.当前陶瓷-金属封接及其相关技术的新进展[J].真空电子技术,2005,(5):18-24.
[3]孙栋.电真空陶瓷管金属化生产中常见的缺陷分析[J].江苏陶瓷,2000,33(5):23-30.
[4]荀燕红,陈丽梅.高强度Mo-Mn金属化工艺研究[J].真空电子技术,2006,(3):61-63.
[5]刘桂武,乔冠军.活化钼-锰法陶瓷-金属封接研究的进展[J].硅酸盐学报,2006,34(12):1522-1527.
[6]高陇桥.陶瓷二次金属化和封接的可靠性[J].真空电子技术,2009,(2):41-49.
[7]高陇桥.陶瓷-金属封装中的二次金属化技术[J].电子工艺技术,2002,23(4):164-166.
[8]赵世柯,肖东梅,吕京京.透明氧化铝陶瓷金属化与封接实验研究[J].真空电子技术,2010,(3):25-27.
[9]高陇桥.陶瓷金属化厚度及其均匀性[J].山东陶瓷,2002,25(2):21-23.
[10]尚阿曼,高鸣,黄亦工,等.高纯氧化铝陶瓷表面形貌对Mo-Mn法金属化封接强度的影响[J].真空电子技术,2013,(4):27-30.
[11]旷峰华,张洪波,任瑞康,等.凝胶注模法法制备氧化铝基片常见微观缺陷分析[J].真空电子技术,2013,(4):50-61.
[12]PINCUS A G.Metallographic Examination of CeramicMetal Seals[J].J Am Ceram Soc,1953,36(5):152-158.