阳极氧化铝基板的制备及在LED散热领域的应用
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摘要
利用阳极氧化技术制备了普通阳极氧化铝基板,并在此基础上结合图形转移的方法制备出了选择性阳极氧化铝基板。借助电镜扫描并通过冷热循环冲击试验对铝材与阳极氧化膜界面处在高低温突变情况下的界面形貌进行了分析。利用结温测试仪、积分球系统、功率计、半导体制冷温控台等仪器设备,通过结温及热阻测试对比研究了两种铝基板与普通MCPCB(Metal Core PCB,金属芯印刷电路板)对LED模组散热效果的影响情况。结果表明,两种基板在经低温-55℃,高温125℃,1000次冷热循环后,氧化膜无裂纹滋生,氧化膜与铝材界面结合完好;对于驱动功率为3 W的LED灯珠,普通MCPCB、普通阳极氧化铝基板与选择性阳极氧化铝基板所对应的芯片结温分别为46.5℃、42.03℃和38.52℃,对应模组的热阻则分别为9.29℃/W、7.49℃/W和5.85℃/W。
The regular anodic alumina substrate was prepared using anodization technique,and the selective anodic alumina substrate was also fabricated in the same way with the application of graphic transfer technique. The microscopic morphology of interface between anodic oxide film and aluminium alloy under the condition of sudden temperature change has been studied by thermal shock test using scanning electron microscope. A comparison of heat dissipation effect between these anodic alumina substrates and MCPCB in LEDs' application has also been researched using junction temperature tester,integrating sphere system,power meter and semiconductor refrigeration temperature control platform. As a result,it has been found that when the temperature went from-55 ℃ up to 125 ℃,no crack happened in the Anodic oxide film and the interface between anodic oxide film and aluminium alloy exhibited a sound combination after 1000 cycles,suggesting a good bonding strength on the condition of drastic temperature change. Meanwhile, as for the LED with 3 W driving power, the junction temperatures were 46. 5 ℃,42. 03 ℃ and 38. 52 ℃,and the thermal resistances were 9. 29 ℃/W,7.49 ℃/W and 5. 85 ℃/W when the traditional MCPCB,regular anodic alumina substrate and selective anodic alumina substrate came into use respectively.
The regular anodic alumina substrate was prepared using anodization technique,and the selective anodic alumina substrate was also fabricated in the same way with the application of graphic transfer technique. The microscopic morphology of interface between anodic oxide film and aluminium alloy under the condition of sudden temperature change has been studied by thermal shock test using scanning electron microscope. A comparison of heat dissipation effect between these anodic alumina substrates and MCPCB in LEDs' application has also been researched using junction temperature tester,integrating sphere system,power meter and semiconductor refrigeration temperature control platform. As a result,it has been found that when the temperature went from-55 ℃ up to 125 ℃,no crack happened in the Anodic oxide film and the interface between anodic oxide film and aluminium alloy exhibited a sound combination after 1000 cycles,suggesting a good bonding strength on the condition of drastic temperature change. Meanwhile, as for the LED with 3 W driving power, the junction temperatures were 46. 5 ℃,42. 03 ℃ and 38. 52 ℃,and the thermal resistances were 9. 29 ℃/W,7.49 ℃/W and 5. 85 ℃/W when the traditional MCPCB,regular anodic alumina substrate and selective anodic alumina substrate came into use respectively.
引文
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[3]YU G Y,ZHU X P,HU S H,et al.Thermal simulation and optimization design on a high-power LED spot lamp[J].Optoelectronics Letters,2011,7(2):117-121.
[4]付贤政,胡良兵.LED灯的散热问题研究[J].照明工程学报,2011,20(3):73-77.
[5]马振辉,黄金亮,殷镖,等.LED散热铝基板用导热介质材料的制备与性能研究[J].工程塑料应用,2011,39(12):50-53.
[6]王勇涛,张军,徐文,等.高导热阳极氧化铝陶瓷膜铝基板的研制[J].绝缘材料,2015,48(08):19-22.
[7]孟祥凤.铝合金阳极氧化膜的制备及其性能研究[D].杭州:中国计量学院,2014.
[8]于佳音.铝合金表面阳极氧化膜的耐热性能研究[D].哈尔滨:哈尔滨工程大学,2013.
[9]孙衍乐,宣天鹏,徐少楠,等.铝合金的阳极氧化及其研发进展[J].电镀与精饰,2010,32(04):18-21.
[10]韩用新.PCB图形转移制程常见的曝光线细不良因素[J].印制电路信息,2016,24(07):65-67.
[11]余彬海,王浩.结温与热阻制约大功率LED发展[J].发光学报,2005,26(6):761-766.
[12]曾凡初,史书汉.水池效应对厚铜板蚀刻的影响分析[J].印制电路信息,2012,(04):1-5.
[13]张志祥.蚀刻在PCB生产中应用和工艺控制[J].印制电路信息,2003,(06):24-30.
[14]陈爽.提高铝合金阳极氧化膜在高温下的抗开裂性能研究[D].北京:北京化工大学,2009.