基于焊接材料与基板材料组分等因素对焊点失效的分析
摘要
本文从LED支架材料、焊接材料和基板材料的组成成分、导热率和CTE(热膨胀系数)等技术参数研究入手,结合切片观察的手段,探讨了大功率舞台灯模组焊点断裂失效的原因,并提出了相应的解决措施。研究表明,LED陶瓷支架与焊锡层间CTE严重失配,从而在冷热冲击环境下界面层产生横向剪切力,是LED焊点界面合金共化物层(IMC层)断裂失效的成因;而选用可靠性更高的汽车电子用锡膏和低CTE的钼铜材料,能够有效解决LED焊点过早断裂失效问题。
Based on the technical data of LED substrate、solder paste and PCB and cross-section observation, the cause of solder joint crack has been explored with fixing solution being provided. The study shows that CTE mismatch between LED substrate and solder layer will cause shear force in the interface, which is root cause of solder joint IMC crack; Switching to use high reliability Automotive solder paste and low CTE PCB material is effective to avoid LED solder joint crack earlier.
Based on the technical data of LED substrate、solder paste and PCB and cross-section observation, the cause of solder joint crack has been explored with fixing solution being provided. The study shows that CTE mismatch between LED substrate and solder layer will cause shear force in the interface, which is root cause of solder joint IMC crack; Switching to use high reliability Automotive solder paste and low CTE PCB material is effective to avoid LED solder joint crack earlier.
引文
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[2]秦典成,李保忠,肖永龙.陶瓷金属化研究现状及发展趋势[J].中国陶瓷工业,2017,24(05):30-36.
[3]秦典成,李保忠,黄奕钊,肖永龙,张军杰.陶瓷复合FR4结构界面形貌与导热性能[J].半导体技术,2017,42(11):864-869.
[4]郭强,赵玫,孟光.随机振动条件下SMT焊点半经验疲劳寿命累积模型[J].振动与冲击,2005,(02):24-26+36-146.
[5]谢青松,赵立博.SMT表面贴装技术工艺应用与探讨[J].船电技术,2009,29(10):36-38.
[6]赵辉煌.SMT焊点图像处理及焊点三维质量信息提取技术研究[D].西安电子科技大学,2010.
[7]王胜利,闫卫红.SMT工艺中的PCB设计[J].电子工艺技术,2010,31(05):286-289+309.
[8]齐成.SMT工艺技术要点和缺陷的处理[J].印制电路信息,2011(08):62-67.
[9]李婧,刘万伟.SMT求解器理论组合技术研究[J].计算机工程与科学,2011,33(10):111-119.
[10]李晓延,武传松,李午申.中国焊接制造领域学科发展研究[J].机械工程学报,2012,48(06):19-31.
[11]何荣芳,孙长库,王鹏,杨国威.SMT封装电路板三维在线检测技术[J].传感技术学报,2015,28(02):290-296.
[12]赵少伟,张婧亮,韩春.基于SMT技术的组装新工艺探讨[J].电子工艺技术,2016,37(04):191-195.