摘要
基于热电分离式理念开发出一种功率为25 W且散热性能极佳的汽车灯照明用LED车灯光源,同时利用积分球系统和结温测试仪对其光热特性进行了表征,并利用快速温度变化实验箱通过冷热循环试验对其可靠性进行了验证,最后与目前应用较为广泛的卤素灯进行了对比研究。结果表明,当环境温度为30℃时,LED车灯光源的结温为118. 59℃;与卤素灯相比,LED在能耗仅为卤素灯46. 84%的前提下,其光通量、光功率、光效分别是卤素灯的2. 6倍、1. 34倍、5. 56倍;当环境温度为65℃,LED车灯光源工作6 000 h之后,光通量几乎无衰减;当循环初始温度为20℃时,光源经-40~85℃冷热循环100 cycle后仍然保持正常工作状态,完全满足实际工程应用要求。
An 25 W LED automobile lamp of excellent heat dissipation performance was developed on the base of thermoelectric separation concept. Integrating sphere system and junction temperature tester were employed to characterize its optical and thermal properties. Its reliability was confirmed through thermal cycle test using thermal cycling chamber and a comparison study was carried out between the LED lamp and the most widely-used halogen lamp in present. It was found that the junction temperature of the LED lamp is 118. 59 ℃ when the ambient temperature is 30 ℃. Even under the condition when the power consumption is merely 46. 84% of that of halogen lamp,LED's luminous flux,radiant power and luminous efficacy are 2. 6 times,1. 34 times and 5. 56 times that of the halogen lamp; when the ambient temperature is 65 ℃,the light failure of LED automobile lamp is almost zero after working 6 000 hours; when the starting temperature is 20 ℃,LED automobile lamp is still working properly when experiencing 100 cycles with temperature varying from -40 ℃ to 85 ℃,which totally satisfies the practical engineering application requirement.
引文
[1] YU G Y,ZHU X P,HU S H,et al. Thermal simulation and optimization design on a high-power LED spot lamp[J]. Optoelectronics Letters,2011,7(2):117-121.
[2]秦典成,李保忠,黄奕钊,等.陶瓷复合FR4结构界面形貌与导热性能[J].半导体技术,2017,42(11):864-869.
[3]彭安娜. LED汽车前照灯的光学系统设计研究[D].广州:华南理工大学,2016.
[4]郭聪慧.基于发光二极管的汽车前照灯散热研究[D].广州:华南理工大学,2015.
[5]朱惠宗.大功率LED汽车前照灯散热研究[D].广州:华南理工大学,2015.
[6]付贤政,胡良兵. LED灯的散热问题研究[J].照明工程学报,2011,20(3):73-77.
[7]赵敏,陈志平,张巨勇.大功率LED灯的热分析与热设计[J].机电工程,2012,29(2):220-223.
[8] LU X Y,HUA T C,WANG Y P. Thermal analysis of high power LED package with heat pipe heat sink[J].Microelectronics Journal,2011,42(11):1257-1262.
[9] HU J Z, YANG L Q, SHIN M W. Thermal and mechanical analysis of high power LEDs with ceramic packages[J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIBILITY,2008,8(2):297-303.
[10]余彬海,王浩.结温与热阻制约大功率LED发展[J].发光学报,2005,26(6):761-766.
[11] CHENG H H,HUANG D S, LIN M T.[J].Microelectronics Reliability,2012,52(6):905-911.
[12]马振辉,黄金亮,殷镖,等. LED散热铝基板用导热介质材料的制备与性能研究[J].工程塑料应用,2011,39(12):50-53.