两种热电分离式基板导热性能的对比研究
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摘要
基于热电分离式设计理念,开发出FR4/Cu与FR4/AlN两种高导热散热基板,并利用SMT工艺将13 W的Osram S2W型LED灯珠分别与上述两种散热基板焊接后组装成LED模组;利用半导体制冷温控台恒定散热基板底部温度后,使用结温测试仪对LED的结温进行了测试。同时借助直流电源和积分球分别对LED的总功率和光功率进行了测量后得到了模组的热功率值。最后根据LED结温测试结果与热功率值计算得出了模组的热阻值,并在此基础上对两种基板的散热性能进行了对比研究。结果表明,FR4/AlN基板的散热性能较之FR4/Cu基板稍逊。当使用FR4/Cu基板散热时,LED的结温和热阻分别是49.72℃、2.21℃/W。当使用FR4/AlN基板散热时,LED的结温和热阻分别是51.32℃、2.32℃/W。
On the base of thermos-electric separation concept,FR4/Cu substrate and FR4/AlN substrate,which were expected to be high thermally conductive,were fabricated and then mounted with 13 W Osram S2W LEDs employing SMT technology to prepare LED modules. The LED's junction temperature was evaluated employing junction temperature tester with the temperature on the bottom side of the above mentioned substrates fixed constant by semiconductor refrigeration temperature control platform. The LED's thermal power was obtained by measuring their total power values and radiant power values using DC Power and integrating sphere respectively. After that,a comparative study on the heat dissipation performance,characterized by module's thermal resistance in relation with LED's junction temperature and thermal power,between FR4/Cu and FR4/AlN substrates was performed. It was found that FR4/Cu substrate presents a slightly better heat dissipation performance than FR4/AlN substrate does.That is when FR4/Cu substrate and FR4/AlN substrate were used as heat dissipation substrate respectively,the junction temperatures were 49.72 ℃ and 51. 32 ℃ and the thermal resistances were 2. 21 ℃/W and 2. 31 ℃/W correspondingly.
On the base of thermos-electric separation concept,FR4/Cu substrate and FR4/AlN substrate,which were expected to be high thermally conductive,were fabricated and then mounted with 13 W Osram S2W LEDs employing SMT technology to prepare LED modules. The LED's junction temperature was evaluated employing junction temperature tester with the temperature on the bottom side of the above mentioned substrates fixed constant by semiconductor refrigeration temperature control platform. The LED's thermal power was obtained by measuring their total power values and radiant power values using DC Power and integrating sphere respectively. After that,a comparative study on the heat dissipation performance,characterized by module's thermal resistance in relation with LED's junction temperature and thermal power,between FR4/Cu and FR4/AlN substrates was performed. It was found that FR4/Cu substrate presents a slightly better heat dissipation performance than FR4/AlN substrate does.That is when FR4/Cu substrate and FR4/AlN substrate were used as heat dissipation substrate respectively,the junction temperatures were 49.72 ℃ and 51. 32 ℃ and the thermal resistances were 2. 21 ℃/W and 2. 31 ℃/W correspondingly.
引文
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[2]Liu Dongjing,Yang Haiying,Yang Ping.Experimental and Numerical Approach on Junction Temperature of High-Power LED[J].Microelectronics Reliability,2014(54):926-931.
[3]Khaoula Ben Abdelmlek,Zouhour Araoud,Rabie Ghnay,et al.Effect of Thermal Conduction Path Deficiency on Thermal Properties of LEDs Package[J].Applied Thermal Engineering,2016(102):251-260.
[4]Yoon Y G,Hyung J P,Jeong U H,et al.Life Time Comparison of LED Package and the Self-Ballasted LED Lamps by Simple Linear Regression Analysis[J].Microelectronics Reliability,2015(55):1779-1783.
[5]马振辉,黄金亮,殷镖,等.LED散热铝基板用导热介质材料的制备与性能研究[J].工程塑料应用,2011,39(12):50-53.
[6]Anithambigai P,Shanmugan S,Mutharasu D,et al.Study on Thermal Performance of High Power LED Employing Aluminum Filled Epoxy Composite as Thermal Interface Material[J].Microelectronics Journal,2014(45):1726-1733.
[7]秦典成,李保忠,黄奕钊,等.陶瓷复合FR4结构界面形貌与导热性能[J].半导体技术,2017,42(11):864-869.
[8]余彬海,王浩.结温与热阻制约大功率LED发展[J].发光学报,2005,26(6):761-766.
[9]李志刚,张亚玲,曹博,等.IGBT热阻测量方法的综述[J].电子元件与材料,2015,34(9):25-30.
[10]石零,米铁,刘延湘.固-固接触热传导的声子传递系数[J].低温与超导,2006,(3):176-178.
[11]张春伟,毕可东,王建立,等.金属/非金属间界面热导的飞秒激光瞬态热反射法测量[J].中国科学(技术科学),2012,42(5):597-602.
[12]Wasim Akhtar M,Yun Seon Lee,Dong Jin Yoo,et al.Alumina-Graphene Hybrid Filled Epoxy Composite:Quantitative Validation and Enhanced Thermal Conductivity[J].Composites:Part B,2017(131):184-195.
[13]Seran Choi,Jooheon Kim.Thermal Conductivity of Epoxy Composites with a Binary-Particle System of Aluminum Oxide and Aluminum Nitride Fillers[J].Composites:Part B,2013(51):140-147.