氨基磺磺酸法剥离废印刷线路板表面镀金层的研究
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摘要
含有贵金属金的废弃印刷线路板有较高回收价值。采用氨基磺酸腐蚀法,浸出镀金层下的铜和镍,回收得到金箔。探索氨基磺酸法回收金的最佳工艺条件,研究结果表明:常温条件下,取内存条与氨基磺酸溶液的固液比(g/mL) 1:5,双氧水体积分数15%,氨基磺酸浓度70 g/L,废旧内存条浸出时间120 min (不同类型板因镀层差异剥落时间稍有差异),此工艺条件下金的回收率可以达到96%以上。氨基磺酸腐蚀法对金的回收选择性好,剥离的金箔可直接熔炼,脱金后的线路板可用于回收其他金属和非金属;溶液回收铜镍后,可循环使用,实现回收过程中的闭路循环,减轻环境污染。
Wasted printed circuit boards with precious metal of gold have high recovery value. With the technique of sulfaminic acid etching, copper and nickel undered the gold plate were leached and then the gold foil could be collected. The optimum conditions of sulfaminic acid etching technique were explored. The results show that at room temperature, when the solid-liquid ratio(g/mL) of the wasted memory stick and sulfaminic acid is 1 : 5, the recovery rate of gold may be up to 96% with 15% hydrogen peroxide by volume,70 g/L sulfaminic acid concentration and 120 min soaking time of wasted memory sticks(the coating flaking time varied slightly due to the type difference of plates). In addition, it has a good selectivity for element Au, the stripped gold can be melted directly while the treated printed circuit boards can be used for recovering other metal or nonmetal, and the solution can also be recycled after recovering copper and nickel, which would realize the closed circulation in recycling process and reduce environmental pollution.
Wasted printed circuit boards with precious metal of gold have high recovery value. With the technique of sulfaminic acid etching, copper and nickel undered the gold plate were leached and then the gold foil could be collected. The optimum conditions of sulfaminic acid etching technique were explored. The results show that at room temperature, when the solid-liquid ratio(g/mL) of the wasted memory stick and sulfaminic acid is 1 : 5, the recovery rate of gold may be up to 96% with 15% hydrogen peroxide by volume,70 g/L sulfaminic acid concentration and 120 min soaking time of wasted memory sticks(the coating flaking time varied slightly due to the type difference of plates). In addition, it has a good selectivity for element Au, the stripped gold can be melted directly while the treated printed circuit boards can be used for recovering other metal or nonmetal, and the solution can also be recycled after recovering copper and nickel, which would realize the closed circulation in recycling process and reduce environmental pollution.
引文
[1]徐敏.废弃印刷线路板的资源化回收技术研究[D].上海:同济大学, 2008.
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[9]杨大锦,廖元双,徐亚飞,等.硫脲从含金黄铁矿中浸金试验研究[J].黄金, 2002, 10(23):28-30.
[10]白建峰,白静,王鹏程,等.酸性硫脲浸出废旧手机线路板中金的研究[J].矿冶工程, 2015, 35(2):87-90.
[11]OGUNNIYI I O, VERMAAK M K G, GROOT D R.Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations[J]. Waste Management, 2009, 29(7):2140-2146.
[12]KIM E Y, KIM M S, LEE J C, et al. Selective recovery of gold from waste mobile phone PCBs by hydrometallurgical process[J]. Journal of Hazardous Materials, 2011, 198:206-215.
[13]韩科昌.电镀废液旋流电解提镍工艺与中试试验研究[D].衡阳:南华大学, 2018.
[14]邹森.电镀工艺主要参数对氨基磺酸镍镀层的影响[J].电子工业专用设备, 2011, 40(8):44-46.
[2]BALDé C P, FORTI V, GRAY V, et al. The global e-waste monitor–2017[EB/OL].[2019-03-01].http://collections.unu.edu/eserv/UNU:6341/Global-Ewaste Monitor 2017 electronic single pages.pdf.
[3]李洋,白建峰,王鹏程,等.不同废弃线路板中金属元素含量及资源化价值分析[J].环境工程, 2015, 33(4):116-120.
[4]高颖楠.中国废弃手机资源化研究[D].天津:南开大学,2012.
[5]王波,洪丽.废弃印刷线路板处置技术的研究进展[J].安全与环境学报, 2013, 13(1):80-84.
[6]PETTER P M H, VEIT H M, BERNARDES A M. Evaluation of gold and silver leaching from printed circuit board of cellphones[J]. Waste Management, 2014, 34(2):475-482.
[7]赵志新,蔡世军,陈增仁,等.富氧氰化浸出在老柞山金矿的应用[J].黄金, 2001, 22(5):38-40.
[8]徐秀丽,李晶莹.硫脲法从废旧电路板中浸取金、银的研究[J].青岛大学学报(工程技术版), 2011, 26(2):69-73.
[9]杨大锦,廖元双,徐亚飞,等.硫脲从含金黄铁矿中浸金试验研究[J].黄金, 2002, 10(23):28-30.
[10]白建峰,白静,王鹏程,等.酸性硫脲浸出废旧手机线路板中金的研究[J].矿冶工程, 2015, 35(2):87-90.
[11]OGUNNIYI I O, VERMAAK M K G, GROOT D R.Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations[J]. Waste Management, 2009, 29(7):2140-2146.
[12]KIM E Y, KIM M S, LEE J C, et al. Selective recovery of gold from waste mobile phone PCBs by hydrometallurgical process[J]. Journal of Hazardous Materials, 2011, 198:206-215.
[13]韩科昌.电镀废液旋流电解提镍工艺与中试试验研究[D].衡阳:南华大学, 2018.
[14]邹森.电镀工艺主要参数对氨基磺酸镍镀层的影响[J].电子工业专用设备, 2011, 40(8):44-46.