Al/Zn-3Al/Al超声波辅助钎焊接头焊合率及显微组织
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摘要
采用固定间隙超声波辅助无钎剂钎焊方法制备了Al/Zn-3Al/Al钎焊接头,并研究了超声振动时间、超声振动功率以及钎焊温度对接头焊合率和显微组织的影响.结果表明,液相钎料与母材间的冶金结合首先发生在接头的边角处,随着超声振动时间的延长或功率的增加,冶金结合区域逐步向接头的中心蔓延;当超声振动功率高于210 W,超声振动时间长于2 s时,接头能获得优良的焊合率;接头的钎缝层主要由Zn-Al共晶相和α-Al相组成,升高钎焊温度或延长超声振动时间均会增加钎缝层中α-Al相的含量,其机制主要归因于超声空化效应对母材的溶蚀作用.
Al/Zn-3 Al/Al joints were fabricated with a gap-confined ultrasound-assisted brazing method. The effects of ultrasonic vibration time,ultrasonic vibration power and brazing temperature on the bonding ratio and microstructure of joint were investigated. The results showed that metallurgic bonding between the liquid filler and base metal firstly occurred at the corner of joint; then the bonding region spread to the center of joint with the increase of ultrasonic vibration power or time. Excellent bonding ratio could be obtained for the joint brazed with ultrasonic vibration power and time higher than 210 W and 2 s,respec-tively. The filler metal layer of joint was mainly composed of ZnAl eutectic phase and α-Al phase,and the content of α-Al phase was improved with the increase of ultrasonic vibration time or brazing temperature,which could be attributed to the induced dissolution effect under ultrasonic cavitation.
Al/Zn-3 Al/Al joints were fabricated with a gap-confined ultrasound-assisted brazing method. The effects of ultrasonic vibration time,ultrasonic vibration power and brazing temperature on the bonding ratio and microstructure of joint were investigated. The results showed that metallurgic bonding between the liquid filler and base metal firstly occurred at the corner of joint; then the bonding region spread to the center of joint with the increase of ultrasonic vibration power or time. Excellent bonding ratio could be obtained for the joint brazed with ultrasonic vibration power and time higher than 210 W and 2 s,respec-tively. The filler metal layer of joint was mainly composed of ZnAl eutectic phase and α-Al phase,and the content of α-Al phase was improved with the increase of ultrasonic vibration time or brazing temperature,which could be attributed to the induced dissolution effect under ultrasonic cavitation.
引文
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[4]Ma Z P,Zhao W W,Yan J C,et al.Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti-6Al-4V and Al-4Cu-1Mg[J].Ultrasonics Sonochemistry,2011,18(5):1062-1067.
[5]Nagaoka T,Morisada Y,Fukusumi M,et al.Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn-Zn hypereutectic solder[J].Journal of Materials Processing Technology,2009,209(11):5054-5059.
[6]Li Y X,Leng X S,Cheng S,Y,et al.Microstructure design and dissolution behavior between 2024Al/Sn with the ultrasonicassociated soldering[J].Materials and Design,2012,40:427-432.
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[8]Li M Y,Li Z L,Xiao Y,et al.Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature[J].Applied Physics Letters,2013,102(9):094104-4.
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[10]Atamanenko T V,Eskin D G,Zhang L,et al.Criteria of grain refinement induced by ultrasonic melt treatment of aluminum alloys containing Zr and Ti[J].Metallurgical and Materials Transactions A,2010,41(8):2056-2066.