纳米颗粒增强SAC0307锡膏焊点的分析
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摘要
研究了纳米颗粒添加对低银SAC0307锡膏焊点显微组织和力学性能的影响.结果表明,添加纳米铜颗粒的焊点钎料共晶区中岛状Cu_6Sn_5相尺寸大、且难于弥散分布,添加量超过0.3%时,Cu_6Sn_5相极易在液/气界面聚集、合并和长大,导致钎料流动性变差、锡膏中助焊剂气体难于逸出而形成气孔.而添加0.1~5.0%纳米银颗粒的焊点均无气孔产生,其焊点钎料中的Ag3Sn相尺寸小易于弥散分布,且β-Sn初晶相细化明显.随纳米银添加量的增加,焊点抗剪强度先增加后降低,0.5%添加量时抗剪强度最大、较相同条件下的SAC0307焊点提高了30.8%.
The influence of nano-particles addition on the microstructure and mechanical properties of soldering joint of low silver SAC0307 soldering paste was studied.The results show that the island-like Cu_6Sn_5 phase exists in a larger size and is difficult to keep dispersion in solder eutectic regions with the addition of nano-Cu.When the additive amount of nano-Cu exceeded 0.3%,the Cu_6Sn_5 phase was easy to accumulate,merge and grow up in the liquid/gas interface.This behavior leaded the deterioration of the flowability of solder,and produced large amount of pores because the flux gas in the solder paste is difficult to escape during the soldering process.While there is no pores in solder joints with 0.1%~5.0%nanoAg addition.The Ag3Sn phase exists in a tiny size and diffuses distribution in these solder eutectic regions,and theβ-Sn primary crystals are refined significantly in solder joints.With the increase of nano-Ag addition,the shear strength increases firstly and then decreases.when the addition is 0.5%the shear strength is the largest,meaning the shear strength in this addition is 30.8%higher than the shear strength of solder joint the SAC0307 solder paste under the same conditions.
The influence of nano-particles addition on the microstructure and mechanical properties of soldering joint of low silver SAC0307 soldering paste was studied.The results show that the island-like Cu_6Sn_5 phase exists in a larger size and is difficult to keep dispersion in solder eutectic regions with the addition of nano-Cu.When the additive amount of nano-Cu exceeded 0.3%,the Cu_6Sn_5 phase was easy to accumulate,merge and grow up in the liquid/gas interface.This behavior leaded the deterioration of the flowability of solder,and produced large amount of pores because the flux gas in the solder paste is difficult to escape during the soldering process.While there is no pores in solder joints with 0.1%~5.0%nanoAg addition.The Ag3Sn phase exists in a tiny size and diffuses distribution in these solder eutectic regions,and theβ-Sn primary crystals are refined significantly in solder joints.With the increase of nano-Ag addition,the shear strength increases firstly and then decreases.when the addition is 0.5%the shear strength is the largest,meaning the shear strength in this addition is 30.8%higher than the shear strength of solder joint the SAC0307 solder paste under the same conditions.
引文
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[2]刘平,顾小龙,赵新兵,等.不同Ag元素含量Sn-Ag-Cu无铅钎料性能分析[J].焊接学报,2012,33(6):55-58.Liu Ping,Gu Xiaolong,Zhao Xinbing,et al.Properties of Sn-AgCu lead free solder with different silver content[J].Transactions of the China Welding Institution,2012,33(6):55-58.
[3]Shnawah D A,Sabri M F M,Badruddin I A,et al.A review on thermal cycling and drop impact reliability of SAC solder jint in portable electronic products[J].Micro-electronics Reliability,2012,52(1):90-99.
[4]高鹏.低银Sn Ag Cu系无铅钎料接头冲击和跌落性能研究[D].北京工业大学,2014.
[5]林金堵,吴梅珠.无铅的锡-银-铜焊料的发展-第二代低银含量Sn-Ag-Cu体系[J].印制电路信息,2012,225(1):67-70.Lin Jindu,Wu Meizhu.The development of the lead-free solder in Sn-Ag-Cu system[J].Printed Circuit Information,2012,225(1):67-70.
[6]符永高,王宏芹,王玲,等.低银无铅焊料润湿及可靠性能研究[J].电子工艺技术,2010,31(6):320-323.Fu Yonggao,Wang Hongqin,Wang Ling,et al.Investigation on wetting and reliability of low Ag lead-free solders[J].Electronics Process Technology,2010,31(6):320-323.
[7]Hammad A E.Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni[J].Materials&Design,2013,50(17):108-116.
[8]刘芳.纳米材料的结构与性质[J].光谱实验室,2011,28(2):735-738.Liu Fang.Structure and character of nano-materials[J].Chinese Journal of Spectroscopy Laboratory,2011,28(2):735-738.
[9]社长华,王涛,甘贵生,等.纳米颗粒复合钎料的研究进展[J].重庆理工大学学报(自然科学版),2012,26(6):36-41.She Changhua,Wang Tao,Gan Guisheng,et al.Research progress on nano-composite solders[J].Journal of Chongqing University of Technology,2012,26(6):36-41.