特征分析视角下半导体制造产业关键技术分布研究
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  • 英文篇名:Key Technology Distribution of Semiconductor Manufacture Industry from the Perspective of Characteristic Analysis
  • 作者:李宏宽 ; 何海燕 ; 单捷飞 ; 姜李丹
  • 英文作者:Li Hongkuan;He Haiyan;Shan Jiefei;Jiang Lidan;School of Management and Economics,Beijing Institute of Technology;Center for National Defense Innovation and Education Development,Beijing Institute of Technology;
  • 关键词:半导体制造 ; 产业关键技术 ; 基础性技术主题
  • 英文关键词:Semiconductor manufacture;;Industry key technology;;Basic technical topics
  • 中文刊名:ZGKT
  • 英文刊名:Forum on Science and Technology in China
  • 机构:北京理工大学管理与经济学院;北京理工大学国防科技创新与教育发展战略研究中心;
  • 出版日期:2019-06-05
  • 出版单位:中国科技论坛
  • 年:2019
  • 期:No.278
  • 基金:国家自然科学基金项目“产业安全视角下我国贸易摩擦治理机制与政策研究”(71473017);; 国家科技重大专项“极大规模集成电路制造装备及成套工艺专项实施状况分析及区域产业、知识产权协同共享机制研究”(2016ZX02301003)
  • 语种:中文;
  • 页:ZGKT201906011
  • 页数:15
  • CN:06
  • ISSN:11-1344/G3
  • 分类号:85-99
摘要
本文从产业关键技术特征分析的视角出发,构建两阶段递进型产业关键技术识别分析框架,利用GN共被引社区发现算法对半导体制造领域基础性技术主题的识别及发展趋势进行分析,并在此基础上借助动态专利组合分析模型进一步对半导体制造领域关键技术的分布进行研究。最终发现,当前半导体制造产业的关键技术主要聚焦在光伏半导体制造技术、存储器制造技术、半导体打印制造工艺以及SIP封装技术;产业内技术创新整体的活跃性呈下降态势,但技术之间相互关联程度逐渐增高,且技术发展方向不断聚焦;此外,半导体制造产业在2007—2011年处于技术变革期,原有产业技术结构出现较大变动,新兴技术逐渐吸引产业更多的关注,而2012—2016年则在整体上进入技术深化期,产业技术结构进一步稳固。
        From the perspective of analysis on industry key technology characteristics,a two stage progressive identification analysis framework for industry key technology was proposed in this paper. Based on this framework,the identification and development trend of basic technical topics in semiconductor manufacture industry was analyzed by Girvan-Newman clustering algorithm for Patent co-citation. Then on the basis of these basic technical topics,the key technology distribution of semiconductor manufacture industry was further studied by dynamic patent portfolio analysis model. The result shows that present key technologies of semiconductor manufacture industry mainly focus on" photovoltaic semiconductor manufacture technology"," memory semiconductor manufacture technology ","semiconductor printing manufacture process"and"SIP packaging technology". The overall activity of technological innovation in semiconductor manufacture industry is declining,but on the contrary,the degree of interrelation between technologies in semiconductor manufacture industry is increasing,and the development direction of technology is constantly focusing. In addition,the technology changes of semiconductor manufacture industry are in progress in 2007—2011 period. The technology structure of industry is changed greatly,and emerging technologies attracted more attention from the industry. But in the period of 2012—2016,the semiconductor manufacture industry enters the technical strengthening period on the whole. The technology structure of industry becomes more stable.
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