摘要
提出一种支持向量机SVM的检测方法,用于半导体制造过程中特征参数检测。首先对SVM模型进行分析,结果显示2D SVM和模糊SVM模型效果最佳。然后提出一种将2D SVM和模糊SVM这两种模型结合的方法,证明了这种方法更有利于半导体晶圆厂检测产品的各种特征参数。
In this paper, a detection method of support vector machine(SVM) is proposed for feature parameter detection in semiconductor manufacturing process. Firstly, the SVM model is analyzed, and the results show that the two-dimensional SVM and the fuzzy SVM model are the best. Then a method combining the two models of 2 D SVM and Fuzzy SVM is proposed, which proves that this method is more advantageous for semiconductor wafer factory to detect various characteristic parameters of products.
引文
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