一种应用于半导体制造业的支持向量机SVM检测方法
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  • 英文篇名:A Detection Method of Support Vector Machine SVM for Semiconductor Manufacturing
  • 作者:王艳生 ; 俞微 ; 魏峥颖
  • 英文作者:WANG Yansheng;YU Wei;WEI Zhengying;Shanghai Huali Microelectronics Corporation;
  • 关键词:集成电路制造 ; 机器学习 ; 支持向量机SVM ; 特征参数检测
  • 英文关键词:IC manufacturing;;machine learning;;support vector machine SVM;;feature parameter detection
  • 中文刊名:JCDL
  • 英文刊名:Application of IC
  • 机构:上海华力微电子有限公司;
  • 出版日期:2019-07-23 11:18
  • 出版单位:集成电路应用
  • 年:2019
  • 期:v.36;No.311
  • 基金:上海市经济和信息化委员会软件和集成电路产业发展专项基金(1500204)
  • 语种:中文;
  • 页:JCDL201908019
  • 页数:4
  • CN:08
  • ISSN:31-1325/TN
  • 分类号:62-65
摘要
提出一种支持向量机SVM的检测方法,用于半导体制造过程中特征参数检测。首先对SVM模型进行分析,结果显示2D SVM和模糊SVM模型效果最佳。然后提出一种将2D SVM和模糊SVM这两种模型结合的方法,证明了这种方法更有利于半导体晶圆厂检测产品的各种特征参数。
        In this paper, a detection method of support vector machine(SVM) is proposed for feature parameter detection in semiconductor manufacturing process. Firstly, the SVM model is analyzed, and the results show that the two-dimensional SVM and the fuzzy SVM model are the best. Then a method combining the two models of 2 D SVM and Fuzzy SVM is proposed, which proves that this method is more advantageous for semiconductor wafer factory to detect various characteristic parameters of products.
引文
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