基于温度的MMC变流器均压控制方法
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摘要
为了提高MMC变流器的可靠性,在传统均压控制的基础上引入了热平衡控制,通过控制子模块的投切过程以减少子模块温度波动,实现MMC变流器可靠性的改善。针对子模块温度的估算,提出了以IGBT模块的福斯特热网络模型为基础的子模块温度计算方法,在电压均衡和热平衡控制过程中选择需要投切的子模块,通过减少不必要的子模块投切动作以降低子模块温度。采用Matlab/Simulink仿真平台对该控制方法进行验证,并将其验证结果与传统均压控制的温度波动和均压效果进行比较分析。结果表明该控制方法可有效降低器件温度波动,提高变流器的可靠性,具有较好的实用性。
To improve the reliability of the MMC converter, the heat balance control is introduced on the basis of the traditional mean voltage control. By controlling the switching process of the sub module to reduce the temperature fluctuation of the sub module, the reliability of the MMC converter is improved. To estimate the temperature of the sub module, the temperature calculation method based on the Forster thermal network model of the IGBT module is proposed. In the process of voltage balance and heat balance control, it selects the submodules that need to change the state. The sub module temperature can be reduced by reducing the unnecessary submodule switching action. The control method is validated by using Matlab/Simulink simulation platform, and the results of the test are compared with the temperature fluctuation and the uniform pressure effect of the traditional pressure control. The results show that the control method can effectively reduce the temperature fluctuation of the device and improve the reliability of the converter, and has good practicability.
To improve the reliability of the MMC converter, the heat balance control is introduced on the basis of the traditional mean voltage control. By controlling the switching process of the sub module to reduce the temperature fluctuation of the sub module, the reliability of the MMC converter is improved. To estimate the temperature of the sub module, the temperature calculation method based on the Forster thermal network model of the IGBT module is proposed. In the process of voltage balance and heat balance control, it selects the submodules that need to change the state. The sub module temperature can be reduced by reducing the unnecessary submodule switching action. The control method is validated by using Matlab/Simulink simulation platform, and the results of the test are compared with the temperature fluctuation and the uniform pressure effect of the traditional pressure control. The results show that the control method can effectively reduce the temperature fluctuation of the device and improve the reliability of the converter, and has good practicability.
引文
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[2]刘钟淇,宋强,刘文华.基于模块化多电平变流器的轻型直流输电系统[J].电力系统自动化,2010,34(2):53-58.LIU Zhongqi,SONG Qiang,LIU Wenhua.VSC-HCDCsystem based on modular multilevel converters[J].Automation of Electric Power Systems,2010,34(2):53-58.
[3]姚致清,于飞,赵倩,等.基于模块化多电平换流器的大型光伏并网系统仿真研究[J].中国电机工程学报,2013,33(36):27-33,6.YAO Zhiqing,YU Fei,ZHAO Qian,et al.Simulation research on large-scale PV grid-connected systems based on MMC[J].Proceedings of the CSEE,2013,33(36):27-33,6.
[4]黄守道,王海宁,荣飞,等.考虑系统损耗的MMC换流阀冗余配置策略[J].电力系统保护与控制,2018,46(6):1-8.HUANG Shoudao,WANG Haining,RONG Fei,et al.Redundant configuration strategy of MMC converter valve considering system loss[J].Power System Protection and Control,2018,46(6):1-8.
[5]韩子娇,高凯,王朝斌,等.无换流变MMC-HVDC的零序电流影响机理分析与抑制[J].电力系统保护与控制,2017,45(12):67-73.HAN Zijiao,GAO Kai,WANG Chaobin,et al.Zero sequence current effect mechanism analysis and suppression for the transformerless MMC-HVDC system[J].Power System Protection and Control,2017,45(12):67-73.
[6]杨珍贵,周雒维,杜雄,等.基于器件的结温变化评估风机中参数差异对网侧变流器可靠性的影响[J].中国电机工程学报,2013,33(30):41-49,8.YANG Zhengui,ZHOU Luowei,DU Xiong,et al.Effects of different parameters on reliability of grid-side converters based on varied junction temperature of devices in wind turbines[J].Proceedings of the CSEE,2013,33(30):41-49,8.
[7]李洪才,陈非凡,董永贵.功率器件散热特性的非稳态测量方法[J].电工技术学报,2012,27(2):114-120.LI Hongcai,CHEN Feifan,DONG Yonggui.An unsteady-state measurement method for charactering heat dissipation properties of power electronic devices[J].Transactions of China Electrotechnical Society,2012,27(2):114-120.
[8]王秀丽,郭静丽,庞辉.模块化多电平换流器的结构可靠性分析[J].中国电机工程学报,2016,36(7):1908-1914.WANG Xiuli,GUO Jingli,PANG Hui.Structural reliability analysis of modular multi-level converters[J].Proceedings of the CSEE,2016,36(7):1908-1914.
[9]刘飞.考虑结温波动的同相补偿变流器可靠性评估[D].成都:西南交通大学,2017.LIU Fei.Reliability evaluation of co-phase compensation converter considering the junction temperature fluctuations[D].Chengdu:Southwest Jiaotong University,2017.
[10]张晏铭,周雒维,刘洪纪,等.一种IGBT散热器动态响应性能优化数值算法[J].中国电机工程学报,2016,36(11):3017-3026.ZHANG Yanming,ZHOU Luowei,LIU Hongji,et al.Anumerical algorithm for optimizing dynamic response performance of IGBT heat sinks[J].Proceedings of the CSEE,2016,36(11):3017-3026.
[11]屠卿瑞,徐政.基于结温反馈方法的模块化多电平换流器型高压直流输电阀损耗评估[J].高电压技术,2012,38(6):1506-1512.TU Qingrui,XU Zheng.Dissipation analysis of MMC-HVDC based on junction temperature feedback method[J].High Voltage Engineering,2012,38(6):1506-1512.
[12]MA K,HE N,LISERRE M,et al.Frequency-domain thermal modelling and characterization of power semiconductor devices[J].IEEE Transactions on Power Electronics,2016,31(10):7183-7193.
[13]HAN X,YANG Q,WU L,et al.Analysis of thermal cycling stress on semiconductor devices of the modular multilevel converter for drive applications[C]//2016IEEE Applied Power Electronics Conference&Exposition.,March 20-24,2016,Long Beach,CA,USA:2957-2962.
[14]井皓,许建中,徐莹.考虑子模块相关性的MMC可靠性分析方法[J].中国电机工程学报,2017,37(13):3835-3842.JING Hao,XU Jianzhong,XU Ying.Reliability analysis of MMC considering the submodule correlations[J].Proceedings of the CSEE,2017,37(13):3835-3842.
[15]BERGNA G,D'ARCO S,SUUL J A,et al.Analysis of power cycling for semiconductor devices in modular multilevel converters[C]//2016 IEEE 17th Workshop on Control and Modeling for Power Electronics(COMPEL),June 27-30,2016,Trondheim,Norway:1-7.
[16]KAZEM M,MA K,LOH P C,et al.Indirect thermal control for improved reliability of modular multilevel converter by utilizing circulating current[C]//2015 IEEEApplied Power Electronics Conference&Exposition,March 15-19,2015,Charlotte,NC,USA:2167-2173.
[17]SMET V,FOREST F,HUSELSTEIN J J,et al.Ageing and failure modes of IGBT modules in high-temperature power cycling[J].IEEE Transactions on Industrial Electronics,2011,58(10):4931-4941.
[18]BUSCA C,TEODORESCU R,BLAABJERG F,et al.An overview of the reliability prediction related aspects of high power IGBTs in wind power applications[J].Microelectronics Reliability,2011,51(9-11):1903-1907.
[19]SANGWONGWANICH A,MATHE L,TEODORESCUR,et al.Two-dimension sorting and selection algorithm featuring thermal balancing control for modular multilevel converters[C]//Proceedings of the 18th European Conference on Power Electronics and Applications,EPE2016,September 5-9,2016,Karlsruhe,Germany:1-10.
[20]HAHN F,ANDRESEN M,BUTICCHI G,et al.Thermal analysis and balancing for modular multilevel converters in HVDC applications[J].IEEE Transactions on Power Electronics,2018,33(3):1985-1996.