柔性固化剂固化工艺对纳米晶铁芯性能的影响
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  • 英文篇名:The influence of curing process of flexible adhesive on the performance of nano-crystalline cores
  • 作者:倪明 ; 甘章华 ; 华称文 ; 曾玉婷 ; 朱昭峰
  • 英文作者:NI Ming;GAN Zhang-hua;HUA Cheng-wen;ZEN Yu-ting;ZHU Zhao-feng;State Key Laboratory of Refractory and Metallurgy, Dapartment of Materials and Metallurgy,Wuhan University of Science and Technology;Jiangsu Amorphd New Material Technology Co, Ltd;
  • 关键词:纳米晶铁芯 ; 固化工艺 ; 可切割性 ; 磁性能
  • 英文关键词:nano-crystalline core;;curing process;;cuttability;;magnetic properties
  • 中文刊名:CXCQ
  • 英文刊名:Journal of Magnetic Materials and Devices
  • 机构:武汉科技大学材料与冶金学院省部共建耐火材料与冶金国家重点实验室;江苏奥玛德新材料科技有限公司;
  • 出版日期:2019-01-15
  • 出版单位:磁性材料及器件
  • 年:2019
  • 期:v.50;No.242
  • 基金:2016盐城市515人才项目
  • 语种:中文;
  • 页:CXCQ201901008
  • 页数:6
  • CN:01
  • ISSN:51-1266/TN
  • 分类号:32-36+45
摘要
用非晶带材绕制成圆环铁芯,经退火制备纳米晶铁芯,再放入环氧树脂柔性固化剂中进行真空浸渍后于干燥箱中固化。采用正交试验研究了固化工艺对纳米晶铁芯可切割性和磁性能的影响。结果表明,真空浸渍条件下,固化剂能够充分填充铁芯带材间隙,铁芯固化后具有优异的可切割性;铁芯损耗的主要影响因素是固化温度,最佳固化工艺为:固化温度353 K,固化时间180 min,填料比例10%。该工艺固化的铁芯损耗相对较低:P1/1k=7.319W/kg,P0.5/10k=20.888 W/kg,磁感应强度(H=7 A/m)下降20%,起始磁导率μi下降55%,最大磁导率μmax下降40%;在f=50Hz~1 kHz范围内,固化剂的固化收缩对铁芯电感影响较大,通过调整固化工艺能够有效降低固化收缩对铁芯电感的影响;而在f=1~100 kHz范围内,固化剂对铁芯电感影响较小,对电感变化率影响甚小。
        The influence of curing process of epoxy resin flexible adhesive on the cuttability and magnetic properties of nano-crystalline cores was studied. The results show that the core has excellent cutting property when the adhesive can be fully impregnated with the core gap in the condition of vacuum. The orthogonal test analysis shows that the main influence factor of the core loss is the curing temperature. The optimal curing process is such: temperature of 353 K, time of 180 min, and packing precent of 10 %. The corresponding core loss was lowest: P1/1 k = 7.319 W/kg, P0.5/10 k= 20.888 W/kg, the magnetic fluxin density(H=7 A/m) decreased by 20 %, the initial permeability decreased by 55 % and the maximum permeability decreased by40 %. Under f=50 Hz to 1 kHz, the curing shrinkage of the adhesive has great influence on the inductance. The influence of curing shrinkage on the inductance can be reduced through adjusting the curing process. Under f=1 to 100 kHz, the adhesive has little influence on the inductance as same as through adjusting the curing process for the inductance change rate.
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