纳米TiO_2对SnAgCu无铅钎料组织和性能的影响
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摘要
为提高钎料的抗热疲劳性,制备了添加纳米TiO_2的复合SnAgCu无铅钎料,对其组织、熔点、显微硬度和钎料接头力学性能进行了研究.结果表明,纳米TiO_2颗粒的添加明显细化了钎焊组织,改善了钎焊接头的力学性能和热稳定性能.其中添加0.5%纳米TiO_2颗粒的复合钎料具有最优的综合性能,与SnAgCu无铅钎料相比,熔点降低1.7℃,接头界面的金属间化合物(IMC)层厚度约为4.9 m,相比于SAC钎料(9 m)显著减小,抗拉强度和抗剪强度分别为69.3 MPa和72.6 MPa,分别提高了26.7%和21.2%.
The Sn-Ag-Cu-TiO_2 composite solders were prepared and the effects of nano-TiO_2 on the microstructure, melting temperature, microhardness and mechanical propertiesof composite solders were investigated. The results show that the TiO_2-containing composite solders have finer intermetallic compound and TiO_2 particles improve the mechanical properties and thermal stability of solder joint. Compared with composite Sn-Ag-Cu solders, SAC-0.5TiO_2 composite solder has the best performance, for which the melting temperature decrease by 1.7 ℃, the thickness of intermetallic compound layer is 4.9 m which is significantly thinner than that of Sn-Ag-Cu solders(9 m). And the tensile strength and shear strength are 69.3 MPa and 72.6 MPa, which increase by 26.7% and 21.2% respectively.
The Sn-Ag-Cu-TiO_2 composite solders were prepared and the effects of nano-TiO_2 on the microstructure, melting temperature, microhardness and mechanical propertiesof composite solders were investigated. The results show that the TiO_2-containing composite solders have finer intermetallic compound and TiO_2 particles improve the mechanical properties and thermal stability of solder joint. Compared with composite Sn-Ag-Cu solders, SAC-0.5TiO_2 composite solder has the best performance, for which the melting temperature decrease by 1.7 ℃, the thickness of intermetallic compound layer is 4.9 m which is significantly thinner than that of Sn-Ag-Cu solders(9 m). And the tensile strength and shear strength are 69.3 MPa and 72.6 MPa, which increase by 26.7% and 21.2% respectively.
引文
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[13]Kumar Santosh,Handwerker Carol,Dayananda Mysore.Intrinsic and interdiffusion in Cu-Sn system[J].Journal of Phase Equilibria and Diffusion,2011,32(4):309-319.
[14]Haseeb A S M A,Arafat M M.Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds[J].Materials Characterization,2012,64:27-35.
[15]Chandra Rao B S S,Mohan Kumar K.Tensile deformation behavior of nano-sized Mo particles reinforced Sn Ag Cu solders[J].Materials Science and Engineering A,2011:4166-4172.
[2]Rosalbino F,Angelini E,Zanicchi G,et al.Corrosion behaviour assessment of lead-free Sn-Ag-M(M=In,Bi,Cu)solder alloys[J].Materials Chemistry and Physics,2008,109(2):386-391.
[3]Han Y D,Jing H Y,Nai S M L,et al.Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sne Age Cu solder joints during thermal cycling[J].Intermetallics,2012,31(3):72-78.
[4]Mohan Kumar K,Kripesh V,Shen Lu,et al.Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications[J].Thin Solid Films,2005,504(2):371-378.
[5]El-Daly A A,Hammad A E.Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions[J].Materials and Design,2012,40(1):292-298.
[6]方喜波,梁静珊.纳米氧化物颗粒掺杂对Sn Ag Cu无铅钎料性能的影响[J].热加工工艺,2013,42(13):156-158.
[7]Seval Aksoy,Yasemin Caglar.Structural transformations of Ti O2films with deposition temperature and electrical properties of nanostructure n-Ti O2/p-Si heterojunction diode[J].Journal of Alloys and Compounds,2014,613(15):330-337.
[8]Nai S M L,Wei J,Gupta M,et al.Development of lead-free solder composites containing nanosized hybrid(Zr O2+8 mol%Y2O3)particulates[J].Solid state phenomena,2006,111:59-62.
[9]Tsao L C,Chang S Y,Lee C I,et al.Effects of nano-Al2O3additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder[J].Materials and Design,2010,31:4831-4835.
[10]Zeng Guang,Xue Songbai,Zhang Liang,et al.A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates[J].Journal of Materials Science:Materials in Electronics,2010,21(5):421-440.
[11]杨扬.Sn基钎料/Cu界面柯肯达尔空洞机理研究[D].上海:上海交通大学,2012.
[12]Meng Gong-ge,Takemoto T,Nishikawa H.Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system[J].Trans.Nonferrous Met Soc China,2007,17(4):686-690.
[13]Kumar Santosh,Handwerker Carol,Dayananda Mysore.Intrinsic and interdiffusion in Cu-Sn system[J].Journal of Phase Equilibria and Diffusion,2011,32(4):309-319.
[14]Haseeb A S M A,Arafat M M.Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds[J].Materials Characterization,2012,64:27-35.
[15]Chandra Rao B S S,Mohan Kumar K.Tensile deformation behavior of nano-sized Mo particles reinforced Sn Ag Cu solders[J].Materials Science and Engineering A,2011:4166-4172.