便于激光刻蚀的PCB基板铜箔表面黑氧化工艺
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摘要
采用正交试验确定了适合激光刻蚀的PCB覆铜板铜箔表面黑氧化的最佳工艺为:先在常温的30g/L(NH_4)_2S_2O_8溶液中微刻蚀5~10min,然后在70°C的NaClO_2 80g/L+NaOH 25g/L的溶液中浸泡15min。对黑氧化膜进行了X射线衍射及扫描电镜分析,并进行激光刻蚀实验予以验证。结果表明,黑氧化工艺可提高铜箔对激光的吸收率,改善了激光刻蚀质量。
The process for black oxidation of copper foils on PCB copper clad laminate was optimized by orthogonal test to facilitate the laser etching: first, slightly etch in a 30 g/L(NH_4)_2S_2O_8 solution at room temperature for 5-10 min; and second, immerse in a solution comprising NaClO_2 80 g/L and NaOH 25 g/L at 70 °C for 15 min. The black oxide film was analyzed by X-ray diffraction and scanning electron microscopy, and its etchability by laser was verified experimentally. The results showed that the black oxidation process can increase the laser absorptivity of copper foil, improving the laser etching quality.
The process for black oxidation of copper foils on PCB copper clad laminate was optimized by orthogonal test to facilitate the laser etching: first, slightly etch in a 30 g/L(NH_4)_2S_2O_8 solution at room temperature for 5-10 min; and second, immerse in a solution comprising NaClO_2 80 g/L and NaOH 25 g/L at 70 °C for 15 min. The black oxide film was analyzed by X-ray diffraction and scanning electron microscopy, and its etchability by laser was verified experimentally. The results showed that the black oxidation process can increase the laser absorptivity of copper foil, improving the laser etching quality.
引文
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[2]邵丹,胡兵,郑启光.激光先进制造技术与设备集成[M].北京:科学出版社,2009:451-455.
[3]ROZMAN R,KMETEC B,PODOBNIK B,et al.Optimisation of direct laser structuring of printed circuit boards[J].Applied Surface Science,2008,254(17):5524-5529.
[4]徐滨士,董世运.激光再制造[M].北京:国防工业出版社,2016:21.
[5]耿广刚.激光热处理用吸光涂层材料的设计与优化[D].杭州:浙江工业大学,2011.
[6]赵阳.PWB丝印前铜表面黑氧化工艺研究[J].电子工艺简讯,1993(5):4-5.
[7]张小春,苏显华.多层印制线路板内层铜的黑氧化[J].电镀与涂饰,2004,23(1):26-27,53.
[8]李乙翘,陈长生.印制电路[M].北京:化学工业出版社,2007:306-308.
[9]向琳.铜/树脂界面结合力的研究及其在印制线路板制造中的应用[D].成都:电子科技大学,2015.