Ku波段多通道瓦片式T/R组件的设计
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摘要
本文给出了一种多通道、低成本、高密度的宽带瓦片式T/R组件集成方案。T/R组件集成了16个收发分时工作的T/R通道,每个通道收发电源调制和幅度相位均可独立控制,并且包含负电保护,温度检测等功能。为了降低尺寸和重量,采用瓦片式结构,重量小于55g,相比于砖块式的T/R组件,重量比约为1:4。该组件采用MCM(多芯片组件)技术设计,并对多个芯片进行了集成设计,实现了平均每个通道只有1.5片射频芯片,降低成本的同时增加了微组装的简便性和可靠性。根据本文提出的集成方案进行了实物设计,并完成了实物测试,测试结果满足设计指标。
This paper presents an integrated solution of a multichannel, low-cost, high-density broadband Tile-type T/R Module. The sixteen timesharing T/R channels are integrated, power modulation and amplitude-phase of each channel can be controlled independently. T/R module contains negative electric protection, temperature detection and other functions. To reduce size and weight, tile-type T/R module is used. The weight is less than 55 g, compared with traditional T/R module, the weight ratio is about 1:4. The T/R module is designed based MCM technology, the integrated design of multiple chips is carried out. An average of1.5 slices RF chips per channel is achieved, cost can be reduced, and the simplicity and reliability of micro assembly can be increased.According to the integration scheme proposed in this paper, the physical design is carried out and the physical test is completed. The test result satisfies the design target.
This paper presents an integrated solution of a multichannel, low-cost, high-density broadband Tile-type T/R Module. The sixteen timesharing T/R channels are integrated, power modulation and amplitude-phase of each channel can be controlled independently. T/R module contains negative electric protection, temperature detection and other functions. To reduce size and weight, tile-type T/R module is used. The weight is less than 55 g, compared with traditional T/R module, the weight ratio is about 1:4. The T/R module is designed based MCM technology, the integrated design of multiple chips is carried out. An average of1.5 slices RF chips per channel is achieved, cost can be reduced, and the simplicity and reliability of micro assembly can be increased.According to the integration scheme proposed in this paper, the physical design is carried out and the physical test is completed. The test result satisfies the design target.
引文
[1]胡明春,周志鹏,严伟.相控阵雷达收发组件技术[M].北京:国防工业出版社,2010.
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[3]赵青.一种新型Ku频段瓦式T/R组件的研制[J].电讯技术,2018.06.
[4]B.A.Kopp.X-band transmit/receive module overview[J].IEEE MTT-S Int,Microwave Symp.Dig.Boston,MA,2000.6:705-708.
[5]A.M.Baquero Martinez,L.Ojalvo Sanchez,A.Pedreira Rios.RBX(Band X SAR):Analysis and Calibration of Tx/Rx Modules[C].Proceedings of the 6th European Radar Conference.978-2-87487-014-9,2009.
[6]J.Butz et al.Highly Integrated RF-modules for Ka-band Multiple-beam Active Phased Array Antennas[J].IEEEMTT-S Digest.2002:61-64
[7]徐鸣,严伟.X波段三维LTCC1/4功分器的试验研究[J].微波学报,2007,23(1):47-51.
[2]李俊生,蒙林,张德智.X波段高功率T/R组件的设计与制作[J].现代电子技术,2009.
[3]赵青.一种新型Ku频段瓦式T/R组件的研制[J].电讯技术,2018.06.
[4]B.A.Kopp.X-band transmit/receive module overview[J].IEEE MTT-S Int,Microwave Symp.Dig.Boston,MA,2000.6:705-708.
[5]A.M.Baquero Martinez,L.Ojalvo Sanchez,A.Pedreira Rios.RBX(Band X SAR):Analysis and Calibration of Tx/Rx Modules[C].Proceedings of the 6th European Radar Conference.978-2-87487-014-9,2009.
[6]J.Butz et al.Highly Integrated RF-modules for Ka-band Multiple-beam Active Phased Array Antennas[J].IEEEMTT-S Digest.2002:61-64
[7]徐鸣,严伟.X波段三维LTCC1/4功分器的试验研究[J].微波学报,2007,23(1):47-51.