压力对微小盲孔化学镀金深镀能力的影响

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英文篇名：Effect of pressure on throwing power of electroless gold plating for micro-via 作者：罗华江 ; 陆显文 ; 付定国 英文作者：LUO Hua-jiang;LU Xian-wen;FU Ding-guo;Guizhou Aerospace Electronics Co., Ltd.; 关键词：微小盲孔 ; 电镀金 ; 化学镀金 ; 深镀能力 ; 压力 英文关键词：micro-via;;gold electroplating;;electroless gold plating;;throwing power;;pressure 中文刊名：DDTL 英文刊名：Electroplating & Finishing 机构：贵州航天电器股份有限公司; 出版日期：2017-08-15 出版单位：电镀与涂饰 年：2017 期：v.36;No.297 语种：中文; 页：DDTL201715011 页数：3 CN：15 ISSN：44-1237/TS 分类号：36-38

摘要

分析了微小孔镀金的难点,对比了微小孔分别在常压和负压下化学镀金的深镀能力。结果表明,在常压下微小盲孔化学镀金的深镀能力不如电镀金。在负压下对微小盲孔化学镀金后,孔内镀层可达的深度与孔内径之比高达5.3,深镀能力远优于常压化学镀金和电镀金。
        The difficulties of gold plating for micro-via were analyzed, and the throwing power of electroless gold plating respectively at atmospheric and negative pressure was compared. The results showed that the throwing power of electroless gold plating at atmospheric pressure is worse than that of gold electroplating. After electroless gold plating at negative pressure, the ratio of gold coating length inside a via to the inner diameter of the via is up to 5.3, indicating a much better throwing power as compared with that of electroless plating at atmospheric pressure and electroplating.

引文

[1]张勇强,蒋维刚.接插件微孔深孔电镀工艺技术[J].电镀与涂饰,2015,34(4):189-195.
    [2]张允诚,胡如南,向荣.电镀手册[M].3版.北京:国防工业出版社,2007:543.