半球研磨均匀性三维仿真
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  • 英文篇名:Simulation of hemispherical grinding uniformity based on model
  • 作者:鲁江锋 ; 王鹏 ; 李娟 ; 鲁军 ; 沈克纯
  • 英文作者:LU Jiangfeng;WANG Peng;LI Juan;LU Jun;SHEN Kechun;School of Marine Science and Technology,Northwestern Polytechnical University;Xi'an Aerospace Precision Mechatronics Institute;
  • 关键词:半球 ; 精密加工 ; 研磨 ; 材料去除率 ; 均匀性 ; 运动轨迹 ; 加工仿真
  • 英文关键词:hemisphere;;precision finishing;;grinding;;material removal rate;;uniformity;;motion curve;;machining simulation
  • 中文刊名:HEBG
  • 英文刊名:Journal of Harbin Engineering University
  • 机构:西北工业大学航海学院;西安航天精密机电研究所;
  • 出版日期:2018-12-20 14:29
  • 出版单位:哈尔滨工程大学学报
  • 年:2019
  • 期:v.40;No.271
  • 基金:国家自然科学基金项目(51375389)
  • 语种:中文;
  • 页:HEBG201905023
  • 页数:5
  • CN:05
  • ISSN:23-1390/U
  • 分类号:153-157
摘要
为了进一步改善球面研磨轨迹的均匀性,提高球面加工的一致性和圆度指标,本文利用定心变角旋转加工法对半球精密加工进行研究。建立半球研磨的Preston方程,发现了摇摆速度和旋转速度是影响材料去除率的主要因素。基于UG方案建立了半球运动的三维仿真模型,得到了半球研磨的运动规律,应用Vericut软件对研磨过程进行了仿真。试验结果表明:摇摆速度与旋转速度比值为2时,半球研磨的均匀性从85%提高到100%。本文的研究结果对于半球零件的加工研究有较大的参考价值和指导作用。
        An effective hemisphere grinding method-rotation machining with variable angles around a point is presented in this paper in order to improve lapping uniformity of spherical surface lapping path as well as to enhance the consistency and sphericity index of spherical surface processing. The established Preston function of hemisphere lapping indicates that the swing speed and rotational speed are the main factors affecting the material removal rate.Using the UG software,a 3 D hemisphere simulation model was set up,and the movement pattern of hemisphere lapping was derived. On the basis of this movement pattern,the grinding process was simulated using the software Vericut,yielding a reasonable ratio of swing speed and rotational speed. Experimental results show clear improvement in the uniformity of hemisphere grinding. When the ratio of rolling speed to rotation speed is 2,the uniformity of hemispheric grinding is increased from 85% to 100%. The main findings of this paper have an important reference value and guidance function to hemisphere machining study.
引文
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