雷达用高深宽比金属铜微通道散热器的制作
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摘要
基于电化学沉积技术在金属基底上制作了一种雷达用金属铜微通道散热器。针对使用高黏度SU–8胶制作高厚度胶膜时产生的胶厚不均匀问题,采用研磨抛光工艺处理未曝光的胶膜,提高了胶厚均匀性,成功解决了由于空气间隙大带来的尺寸偏差。提出了一种在曝光显影前利用折射率计算胶厚的方法,并通过最小二乘法确定了SU–8胶对钠黄光的折射率。针对高深宽比SU–8胶膜因曝光剂量选择不合适导致制作失败的问题,通过光刻试验分析了曝光剂量对胶膜质量的影响,确定了最优的曝光剂量为640mJ/cm2。在上述工艺和试验的基础上得到了质量良好的SU–8胶膜,并制作出了一种线宽50μm、高度大于250μm、深宽比大于5的金属铜微通道散热器,验证了该制作工艺的有效性。
A high-aspect-ratio copper microchannel cooling device for radar was fabricated on metallic substrate based on the electrochemical deposition technique. In view of the problem of non-uniform thickness in making thick film with high-viscosity SU–8 photoresist, lapping and polishing techniques were applied to the unexposed SU–8 film to improve the thickness uniformity and the dimension error caused by air gap was also reduced. A novel method to measure the thickness of unexposed SU–8 film using refractive index was proposed and the refractive index of SU–8 photoresist at yellow sodium light was obtained by least square method. In order to overcome the failure in making high-aspect-ratio SU–8 film due to inappropriate exposure dose, the effect of exposure dose on the quality of the film was discussed by lithography experiment and the optimal parameter was 640mJ/cm2. SU–8 film with good quality was acquired and a copper microchannel cooling device was fabricated based on the above techniques and experiment. The width is 50μm, the height is over 250μm and the aspect ratio is over 5.
A high-aspect-ratio copper microchannel cooling device for radar was fabricated on metallic substrate based on the electrochemical deposition technique. In view of the problem of non-uniform thickness in making thick film with high-viscosity SU–8 photoresist, lapping and polishing techniques were applied to the unexposed SU–8 film to improve the thickness uniformity and the dimension error caused by air gap was also reduced. A novel method to measure the thickness of unexposed SU–8 film using refractive index was proposed and the refractive index of SU–8 photoresist at yellow sodium light was obtained by least square method. In order to overcome the failure in making high-aspect-ratio SU–8 film due to inappropriate exposure dose, the effect of exposure dose on the quality of the film was discussed by lithography experiment and the optimal parameter was 640mJ/cm2. SU–8 film with good quality was acquired and a copper microchannel cooling device was fabricated based on the above techniques and experiment. The width is 50μm, the height is over 250μm and the aspect ratio is over 5.
引文
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[2]李朝伟,周希元,刘福来.雷达/通信信号侦察一体化技术[J].舰船电子对抗,2008,31(2):5-11.LI Zhaowei,ZHOU Xiyuan,LIU Fulai.Integrative reconnaissance technology for radar and communication signals[J].Shipboard Electronic Countermeasure,2008,31(2):5-11.
[3]徐群玉,宁焕生,陈唯实,等.气象雷达在民航安全中的应用研究[J].电子学报,2010,38(9):2147-2151.XU Qunyu,NING Huansheng,CHEN Weishi,et al.Applications of meteorological radar for the civil aviation safety[J].Acta Electronica Sinica,2010,38(9):2147-2151.
[4]TUCKERMAN D B,PEASE R F W.High-performance heat sinking for VLSI[J].IEEE Electron Device Letters,1981,2(5):126-129.
[5]YU J R,CHENG P,MA Z Q,et al.Fabrication of miniature silicon wafer fuel cells with improved performance[J].Journal of Power Sources,2003,124(1):40-46.
[6]VáZQUEZ E,RODRIGUEZ C A,ELIAS-Zú?IGA A,et al.An experimental analysis of process parameters to manufacture metallic micro-channels by micro-milling[J].International Journal of Advanced Manufacturing Technology,2010,51(9-12):945-955.
[7]HUNG J C,CHANG D H,YIN C.The fabrication of high-aspectratio micro-flow channels on metallic bipolar plates using die-sinking micro-electrical discharge machining[J].Journal of Power Sources,2012,198(1):158-163.
[8]JOO Y,DIEU K,KIM C J.Fabrication of monolithic microchannels for IC chip cooling[C]//Proceedings IEEE Micro Electro Mechanical Systems.New York:IEEE,1995.
[9]PANG A J,DESMULLIEZ M P Y,LEONARD M,et al.Design,manufacture and testing of a low-cost micro-channel cooling device[C]//Proceedings of 6th Electronics Packaging Technology Conference.New York:IEEE,2004.
[10]LEE S J,CHEN Y P,HUANG C H.Electroforming of metallic bipolar plates with micro-featured flow field[J].Journal of Power Sources,2005,145(2):369-375.
[11]杜立群,鲍其雷,赵明,等.在金属基底上制作高深宽比金属微光栅的方法[J].光学精密工程,2015,23(3):700-707.DU Liqun,BAO Qilei,ZHAO Ming,et al.Fabrication of metal micro-grating with high aspect ratio on metal substrate[J].Optics and Precision Engineering,2015,23(3):700-707.
[12]LEE H,LEE K,AHN B,et al.A new fabrication process for uniform SU-8 thick photoresist structures by simultaneously removing edge bead and air bubbles[J].Journal of Micromechanics and Microengineering,2011,21(12):125006-125013.
[13]CAMPO A D,GREINER C.SU-8:a photoresist for highaspect-ratio and 3D submicron lithography[J].Journal of Micromechanics and Microengineering,2007,17(6):81-95.
[14]ZHANG J,CHAN P B,MIAO J,et al.Reduction of diffraction effect for fabrication of very high aspect ratio microchannels in SU-8 over large area by soft cushion technology[J].Microsystem Technologies,2005,11(7):519-525.
[15]DAUNTON R,GALLANT A J,WOOD D.Manipulation of exposure dose parameters to improve production of high aspect ratio structures using SU-8[J].Journal of Micromechanics and Microengineering,2012,22(22):75016-75023.
[16]张金娅,陈迪,朱军,等.超厚SU-8负胶高深宽比结构及工艺研究[J].功能材料与器件学报,2005,11(2):251-254.ZHANG Jinya,CHEN Di,ZHU Jun,et al.Process of high-aspectratio ultrathick SU-8 microstructure[J].Journal of Functional Materials and Devices,2005,11(2):251-254.
[17]刘亚萍.超声改变SU-8胶溶胀性的机理及试验研究[D].大连:大连理工大学,2012.LIU Yaping.Mechanism and experimental study on changing SU-8photoresist swelling by ultrasonic treatment[D].Dalian:Dalian University of Technology,2012.