硬质PMI泡沫的表面化学镀及其电磁性能
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摘要
通过化学镀铜使聚甲基丙烯酰亚胺(PMI)泡沫塑料表面金属化,探究镀液中络合剂、稳定剂、添加剂的种类、浓度等因素对镀层性质的影响,并采用X射线衍射仪、X射线光电子能谱仪、扫描电子显微镜等分析方法表征了化学镀工艺对镀层结构的影响规律。优化出铜镀层性能最好的配方为:质量浓度均为15g/L的乙二胺四乙酸和酒石酸钾钠作复合络合剂,质量浓度为0.25g/L的亚铁氰化钾作稳定剂,并采用三乙胺+苯亚磺酸钠作添加剂。镀层表面电导率随反应时间的增大逐渐上升,当沉积时间为70min时,铜镀层的电导率为1.06×10~4 S/m;化学镀铜泡沫的电磁屏蔽性能在低频下最高达–44dB左右,高频下最高达–53dB左右。
With polymethacrylimide(PMI) foam as matrix,surface metallization was achieved by electroless plating,and the effects of complexing agent,stabilizer,additive concentration and types on the properties of the coating were explored. Some equipments were applied to characterize the influence of electroless plating process on the coating structure,such as X ray diffraction,X ray photoelectron spectroscopy,scanning electron microscope and so on. The optimum formula for copper plating was obtained as follows :ethylenediamine tetraacetic acid and sodium potassium tartrate with a mass concentration of 15 g/L as complex agents,potassium ferricyanide with a mass concentration of 0.25 g/L as a stabilizer,triethylamine and sodium benzenesulfonic acid as additives. The surface conductivity of the coating increased with the increase of reaction time. When the deposition time was 70 min,the conductivity of copper coating was 1.06×10~4 S/m. The electromagnetic shielding performance of the electroless copper plated foam was up to about –44 dB at low frequency and –53 dB at high frequency.
With polymethacrylimide(PMI) foam as matrix,surface metallization was achieved by electroless plating,and the effects of complexing agent,stabilizer,additive concentration and types on the properties of the coating were explored. Some equipments were applied to characterize the influence of electroless plating process on the coating structure,such as X ray diffraction,X ray photoelectron spectroscopy,scanning electron microscope and so on. The optimum formula for copper plating was obtained as follows :ethylenediamine tetraacetic acid and sodium potassium tartrate with a mass concentration of 15 g/L as complex agents,potassium ferricyanide with a mass concentration of 0.25 g/L as a stabilizer,triethylamine and sodium benzenesulfonic acid as additives. The surface conductivity of the coating increased with the increase of reaction time. When the deposition time was 70 min,the conductivity of copper coating was 1.06×10~4 S/m. The electromagnetic shielding performance of the electroless copper plated foam was up to about –44 dB at low frequency and –53 dB at high frequency.
引文
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[2]Cho S,Kikuchi K,Kawasaki A.On the role of amorphous intergranular and interfacial layers in the thermal conductivity of a multi-walled carbon nanotube-copper matrix composite[J].Acta Materialia,2012,60(2):726-736.
[3]耿冰霜.化学镀Ni-W-P三元合金工艺、组织结构及性能研究[D].太原:太原理工大学,2008.Geng Bingshuang.Investigation on processes,microstructures and properties of electroless Ni-W-P alloys[D].Taiyuan:Taiyuan University of Technology,2008.
[4]王丽.木材表面化学镀镍基三元合金的研究[D].哈尔滨:东北林业大学,2015.Wang Li.Study on electroless plating nickel-based ternary alloy on wood surface[D].Harbin:Northeast Forestry University,2015.
[5]胡佳勋.多巴胺修饰制备表面化学镀铜复合材料的研究[D].广州:华南理工大学,2016.Hu Jiaxun.Fabrication of electroless copper-plated composites by dopamine surface functionalization[D].Guangzhou:South China University of Technology,2016.
[6]Xu Y,Li Y,Xu W,et al.An ultra-light and high electromagnetic shielding effectiveness material based on melamine foam with its skeleton metallized[J].Journal of Materials Science Materials in Electronics,2015,26(2):1 159-1 171.
[7]Xu C,Liu G,Chen H,et al.Fabrication of conductive coppercoated glass fibers through electroless plating process[J].Journal of Materials Science Materials in Electronics,2014,25(6):2 611-2 617.
[8]Peng Y,Chen Q.Ultrasonic-assisted fabrication of highly dispersed copper/multi-walled carbon nanotube nanowires[J].Colloids&Surfaces A Physicochemical&Engineering Aspects,2009,342(1):132-135.
[9]Lee H D,Penkov O V,Kim D E.Tribological behavior of duallayer electroless-plated Ag-carbon nanotube coatings[J].Thin Solid Films,2013,534(2):410-416.
[10]马立涛,郭忠诚,朱晓云,等.化学镀铜原理、应用及研究展望[J].南方金属,2009(2):20-23.Ma Litao,Guo Zhongcheng,Zhu Xiaoyun,et al.Mechanism,applications and prospects of electroless copper plating[J].Southern Metals,2009(2):20-23.
[11]王大勇.高速高稳定化学镀铜液体系研究[D].成都:电子科技大学,2016.Wang Dayong.Research on system of high deposition rate and stability electroless copper plating[D].Chengdu:University of Electronic Science and Technology of China,2016.
[12]Shao Z,Zhang Y,Zhang N,et al.Preparation and research of electroless copper on carbon fibers[J].Advanced Manufacturing Processes,2016,31(1):12-17.