脱合金化制备纳米多孔Cu-Ni薄膜
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摘要
以薄铜片为基底,共沉积制备了纳米Cu-Ni-Zn薄膜,经化学和电化学脱合金除Zn得到纳米多孔Cu-Ni薄膜.通过XRD、SEM等技术进行表征,并测定其显微硬度.结果表明:化学脱合金化所得纳米多孔Cu-Ni薄膜微观结构呈圆球颗粒状,孔径尺寸约500nm,与电化学脱合金化相比形貌更规则;纳米多孔Cu-Ni薄膜显微硬度达到113HV.
Taking thin copper sheet as substrate,nano-porous Cu-Ni-Zn film was prepared by means of codeposition and the nano-porous Cu-Ni film was obtained through chemical plus electrochemical dealloying to get rid of Zn.Its surface morphology and structure were characterized with scanning electric microscopy and X-ray diffractometry,and its microhardness was measured.The result showed that the chemically dealloyed nano-porous Cu-Ni film would have a spherical particle microstructure.Its aperture size would be about 500 nm.Compared with electrochemical dealloying,its morphology would be more regular and its microhardness would amount to 113 HV.
Taking thin copper sheet as substrate,nano-porous Cu-Ni-Zn film was prepared by means of codeposition and the nano-porous Cu-Ni film was obtained through chemical plus electrochemical dealloying to get rid of Zn.Its surface morphology and structure were characterized with scanning electric microscopy and X-ray diffractometry,and its microhardness was measured.The result showed that the chemically dealloyed nano-porous Cu-Ni film would have a spherical particle microstructure.Its aperture size would be about 500 nm.Compared with electrochemical dealloying,its morphology would be more regular and its microhardness would amount to 113 HV.
引文
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[3]肖美群,沈嘉年,李谋成,等.添加Fe3+对二氧化钛薄膜吸收光谱及光催化活性的影响[J].上海金属,2004,26(4):13-16.
[4]MATHUR A,ERLEBACHER J.Size dependence of effective Young’s modulus of nanoporous gold[J].Applied Physics Letters,2007,90(6):061910(1-3).
[5]KUCHEYEV S O,HAYES J R,BIENER J,et al.Surface-enhanced Raman scattering on nanoporous Au[J].Applied Physics Letters,2006,89(5):05310(2-4).
[6]HAN R B,WU H,WAN C L.Templated nanoporous copper and nickel:novel substrates for surface-enhanced Raman scattering[J].Scripta Mater,2008,59(10):1047-1050.
[7]常玲,方文斌,王建明.多孔镍基复合膜电极的制备与电化学电容性能[J].中国科技论文,2016,11(6):606-609.
[8]周琦,王文辉,吴海涛,等.腐蚀因素对去合金化法制备纳米多孔铜材料结构的影响[J].兰州理工大学学报,2013,39(2):1-4.
[9]孔德帅.纳米多孔结构镍基复合膜电极的电化学法制备及其赝电容性能[D].杭州:浙江大学,2012.
[10]HAKAMADA M,TAKAHASHI M,FURUKAWA T,et al.Coercivity of nanoporous Ni produced by dealloyingp[J].Applied Physics Letters,2009,94(94):153105(1-3).
[11]HAKAMADA M,MABUCHI M.Preparation of nanoporous Ni and Ni-Cu by dealloying of rolled Ni-Mn and Ni-Cu-Mn alloys[J].Journal of Alloys and Compounds,2009,485(485):583-587.
[12]QI Zhen,ZHANG Zhonghua,JIA Haoling,et al.Alloy composition dependence of formation of porous Ni prepared by rapid solidification and chemical dealloying[J].Journal of Alloys and Compounds,2009,472(1/2):71-78.
[13]周琦,李大鹏,王文辉,等.不同去合金化法对制备纳米多孔合金微观结构的影响[J].兰州理工大学学报,2013,39(5):1-4.
[14]朱福良,于倩倩,黄达,等.铜/镍纳米多层膜脉冲电沉积法制备及沉积机理初探[J].材料保护,2009,42(6):20-23.
[15]张卫国,李伟祥,张璐,等.双槽法电沉积Cu/Ni多层纳米线有序阵列[J].物理化学学报,2006,22(8):977-980.
[16]汪骥,陈昌毅,李瑞,等.纳米复合电沉积制备钢基超疏水表面工艺探究[J].哈尔滨工程大学学报,2016,37(5):660-665.
[17]李卫东,胡进,左正忠,等.有关复合电沉积机理研究[J].武汉大学学报(理学版),2000,46(6):695-700.