空间材料筛选试验方法-热真空释气试验应用研究综述
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摘要
随着我国航天事业的迅猛发展,对越来越多的宇航用材料和元器件提出了热真空释气试验的要求。本文介绍了热真空释气试验的国内外标准现状及应用现状,对热真空释气试验方法进行了对比研究,对热真空释气试验应用进行了标准范围内的研究,包括美国宇航局相关标准、美国军用标准、日本宇航局标准、欧空局标准以及中国国家军用标准和航天部部标准等对热真空释气试验方法的规定及应用。
With the rapid development of China 's aerospace industry,Space special environment put forward the request for the gas release characteristics of materials and components. This paper introduced the domestic and international standards of thermal vacuum outgassing, and studied the standard application of the thermal vacuum outgassing test method,including analysis of NASA,MIL,ESCC,JAXA,GJB and QJ standards.
With the rapid development of China 's aerospace industry,Space special environment put forward the request for the gas release characteristics of materials and components. This paper introduced the domestic and international standards of thermal vacuum outgassing, and studied the standard application of the thermal vacuum outgassing test method,including analysis of NASA,MIL,ESCC,JAXA,GJB and QJ standards.
引文
[1]王鹢,王先荣,姚日剑.飞行器敏感系统在轨分子污染沾染量预估方法研究[J].宇航材料工艺,2007,37(3):20-24.
[2]James S Dyer,Richard C Benson,Terry E Phillips,et al.Outgassing analysis performed during vacuum bakeout of components painted with chemglaze Z306/9922[J].SPIE.Optital System Contamination,1992,1754:177.
[3]王鹢,王先荣.星用非金属材料出气物成分及污染光学测试分析[J].航天器环境工程,2005,22(5):295-299.
[4]ASTM Committee E21 on Space Simulation and Applications of Space Technology.ASTM E595-07,Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials From Outgassing in a Vaccuum Environment[S].2007.
[5]European Space Agency for the Members of ECSS.ECSS-Q-ST-70-02C,Thermal Vacuum Outgassing Test for the Screening of Space Materials[S].Noordwijk:ESA Publications Division ESIC,2008.
[6]Johnson Space Center.NASA-JSC-SP-R-0022A,Vacuum Stability Requirements of Polymeric Material for Spacecraft Application[S].1974.
[7]George C.Marshall Space Flight Center.NASA-MSFC-SPEC-1443,Outgassing Test for Non-Metallic Materials Associated with Sensitive Optical Surfaces in a Space Environment[S].Alabama.1987.
[8]George C.Marshall Space Flight Center.NASA-MSFC-PROC-3257,Outgassing Test Procedure for Non-Metallic Materials Associated with Contamination Sensitive Surfaces in a Thermal Vacuum Environment[S].Alabama.2002.
[9]Defense Supply Center Columbus.MIL-DTL-24308G,Connectors,Electric,Rectangular,Nonenvironmental,Miniature,Polarized Shell,Rack And Panel,General Specification for[S].Columbus.2009.
[10]Defense Supply Center Columbus.MIL-DTL-32234,Connectors,Electrical,Ultra High Density,Modular,Blade and Fork,Eight Row,General Specification for[S].2007.
[11]Defense Supply Center Columbus.MIL-DTL-83733E,Connectors,Electrical Miniature,Rectangular Type,Rack To Panel,Environment Resisting,200°C Total Continuous Operating Temperature,General Specification for[S].2006.
[12]Defense Supply Center Columbus.MIL-DTL-83513G,Connectors,Electrical,Rectangular,Microminiature,Polarized Shell,General Specification for[S].2008.
[13]航天工业部五一O所.QJ1558-88,真空中材料挥发性能测试方法[S].北京:中国航天集团公司706所,1988.
[14]中国电子技术标准化研究院.GJB1217A-2009,方法4001,热真空释气试验[S].北京:总装备部军标出版发行部,2009.
[15]航天工业部五一O所.QJ1322-87,真空中材料质量损失测试方法[S].北京:中国航天集团公司706所,1987.
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[17]Defense Supply Center Columbus.MIL-PRF-39007J,Resistors,Fixed,Wire Wound(Power Type),Nonestablished Reliability,Established Reliability,and Space Level General Specification for[S].2008.
[18]Defense Supply Center Columbus.MIL-PRF-32159,Resistors,Chip,Fixed,Film,Zero Ohm,Industrial,High Reliability,Space Level,General Specification for.[S].2005.
[19]Defense Supply Center Columbus.MIL-PRF-55342H,Resistors,Chip,Fixed,Film,Nonestablished Reliability,Established Reliability,Space Level,General Specification for[S].2007.
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[21]Defense Supply Center Columbus.MIL-PRF-49462C,Resistors,Fixed,Film,High Voltage General Specification for[S].2008.
[22]Defense Supply Center Columbus.MIL-PRF-31031B,Connectors,Electrical,Plugs And Receptacles,Coaxial,Radio Frequency,High Reliability,for Flexible and Semirigid Cables,General Specification for[S].2009.
[23]Defense Supply Center Columbus.MIL-DTL-38999L,Connectors,Electrical,Circular,Miniature,High Density,Quick Disconnect(Bayonet,Threaded,and Breech Coupling),Environment Resistant,Removable Crimp and Hermetic Solder Contacts,General Specification for[S].2009.
[24]Defense Supply Center Columbus.MIL-PRF-85045F,Cables,Fiber Optics,(Metric),General Specification for[S].1999.
[25]Defense Supply Center Columbus.MIL-DTL-49292B,Cable Assemblies,Nonpressure Proof,Fiber Optic,Metric,General Specification for[S].2006.
[26]Defense Supply Center Columbus.MIL-PRF-3098K,Crystal Units,Quartz General Specification for[S].2010.
[27]Defense Supply Center Columbus.MIL-PRF-23419G,Fuse,Cartridge,Instrument Type,General Pecification for[S].2007.
[28]Defense Supply Center Columbus.MIL-PRF-23419/10B,Performance Specification Sheet Fuses,Cartridge,Instrument Type,Style Fm10,(Nonindicating)[S].2005.
[29]Defense Supply Center Columbus.MIL-PRF-28861D,Filters And Capacitors,Radio Frequency/Electromagnetic Interference Suppression,General Specification for[S].2011.
[30]Japan Aviation Electronics Industry,Limited Issued by Japan Aerospace Exploration Agency.JAXA-QTS-2110A,Transformers and Induntors,High Reliability,Space Use,General Specification for[S].2005.
[31]Japan Aviation Electronics Industry,Limited Issued by Japan Aerospace Exploration Agency.JAXA-QTS-2120A,Wires,Electric,Fluorine Resin/Polyimide Insulated[S].2004.
[32]Defense Supply Center Columbus.MIL-PRF-8805/68L,Performance Specification Sheet—Switches,Sensitive,Spdt,4 Amperes,Hermetic Seal[S].2008.
[33]Defense Supply Center Columbus.MIL-PRF-31032/5,Printed Wiring Board,Rigid,Multilayered,Thermoplastic or Thermoplastic and Thermosetting Resin Base Material,with Plated Through Holes,for High Frequency Applications[S].2009.
[34]Defense Supply Center Columbus.MIL-PRF-31032/6,Printed Wiring Board,Rigid,Single and Double Sided,Thermoplastic Resin Base Material,with or without Plated–Through Holes,for High Frequency Applications[S].2010.
[35]Defense Supply Center Columbus.MIL-STD-981C,Design,Manufacturing and Quality Standards for Custom Electromagnetic Devices for Space Applications[S].2010.
[36]Space and Missile Systems Center EL Segundo.SMC-S-010,Parts,Materials,and Processes Technical Requirements for Space and Launch Vehicles[S].2009.
[37]National Aeronautics and Space Adminstration.NASA/TP-2003-212244 PEM-INST-001,Instructions for Plastic Encapsulated Microcircuit(Pem)Selection,Screening,and Qualification[S].2003.
[38]Defense Supply Center Columbus.MIL-HDBK-1547A,Electronic Parts,Materials,and Processes for Space and Launch Vehicles[S].1998.
[39]中国电子技术标准化研究院.GJB1432B-2009,片式膜固定电阻器通用规范[S].北京:总装备部军标出版发行部,2009.
[40]中国电子技术标准化研究院.GJB244A-2001,有质量等级的薄膜固定电阻器总规范[S].北京:总装备部军标出版发行部,2001.
[41]中国电子技术标准化研究院.GJB6786-2009,含宇航级的功率型线绕固定电阻器通用规范[S].北京:总装备部军标出版发行部,2009.
[42]中国电子技术标准化研究院.GJB6787-2009,含宇航级零欧姆片式膜固定电路通用规范[S].北京:总装备部军标出版发行部,2009.
[43]中国电子技术标准化研究院.GJB142B-2011,机柜用外壳定位小型矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[44]中国电子技术标准化研究院.GJB599B-2012,耐环境快速分离高密度小圆形电连接器通用规范[S].北京:总装备部军标出版发行部,2012.
[45]中国电子技术标准化研究院.GJB2446A-2011,外壳定位超小型矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[46]中国电子技术标准化研究院.GJB5021A-2011,柔软和半硬电缆用高可靠射频同轴连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[47]中国电子技术标准化研究院.GJB7245-2011,外壳定位超微矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[48]中国电子技术标准化研究院.GJB1428B-2009,光缆通用规范[S].北京:总装备部军标出版发行部,2009.
[49]中国电子技术标准化研究院.GJB5850-2006,小型熔断器通用规范[S].北京:总装备部军标出版发行部,2006.
[2]James S Dyer,Richard C Benson,Terry E Phillips,et al.Outgassing analysis performed during vacuum bakeout of components painted with chemglaze Z306/9922[J].SPIE.Optital System Contamination,1992,1754:177.
[3]王鹢,王先荣.星用非金属材料出气物成分及污染光学测试分析[J].航天器环境工程,2005,22(5):295-299.
[4]ASTM Committee E21 on Space Simulation and Applications of Space Technology.ASTM E595-07,Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials From Outgassing in a Vaccuum Environment[S].2007.
[5]European Space Agency for the Members of ECSS.ECSS-Q-ST-70-02C,Thermal Vacuum Outgassing Test for the Screening of Space Materials[S].Noordwijk:ESA Publications Division ESIC,2008.
[6]Johnson Space Center.NASA-JSC-SP-R-0022A,Vacuum Stability Requirements of Polymeric Material for Spacecraft Application[S].1974.
[7]George C.Marshall Space Flight Center.NASA-MSFC-SPEC-1443,Outgassing Test for Non-Metallic Materials Associated with Sensitive Optical Surfaces in a Space Environment[S].Alabama.1987.
[8]George C.Marshall Space Flight Center.NASA-MSFC-PROC-3257,Outgassing Test Procedure for Non-Metallic Materials Associated with Contamination Sensitive Surfaces in a Thermal Vacuum Environment[S].Alabama.2002.
[9]Defense Supply Center Columbus.MIL-DTL-24308G,Connectors,Electric,Rectangular,Nonenvironmental,Miniature,Polarized Shell,Rack And Panel,General Specification for[S].Columbus.2009.
[10]Defense Supply Center Columbus.MIL-DTL-32234,Connectors,Electrical,Ultra High Density,Modular,Blade and Fork,Eight Row,General Specification for[S].2007.
[11]Defense Supply Center Columbus.MIL-DTL-83733E,Connectors,Electrical Miniature,Rectangular Type,Rack To Panel,Environment Resisting,200°C Total Continuous Operating Temperature,General Specification for[S].2006.
[12]Defense Supply Center Columbus.MIL-DTL-83513G,Connectors,Electrical,Rectangular,Microminiature,Polarized Shell,General Specification for[S].2008.
[13]航天工业部五一O所.QJ1558-88,真空中材料挥发性能测试方法[S].北京:中国航天集团公司706所,1988.
[14]中国电子技术标准化研究院.GJB1217A-2009,方法4001,热真空释气试验[S].北京:总装备部军标出版发行部,2009.
[15]航天工业部五一O所.QJ1322-87,真空中材料质量损失测试方法[S].北京:中国航天集团公司706所,1987.
[16]航天工业部五一O所.QJ1371-88,真空中材料可凝挥发物测试方法[S].北京:中国航天集团公司706所,1988.
[17]Defense Supply Center Columbus.MIL-PRF-39007J,Resistors,Fixed,Wire Wound(Power Type),Nonestablished Reliability,Established Reliability,and Space Level General Specification for[S].2008.
[18]Defense Supply Center Columbus.MIL-PRF-32159,Resistors,Chip,Fixed,Film,Zero Ohm,Industrial,High Reliability,Space Level,General Specification for.[S].2005.
[19]Defense Supply Center Columbus.MIL-PRF-55342H,Resistors,Chip,Fixed,Film,Nonestablished Reliability,Established Reliability,Space Level,General Specification for[S].2007.
[20]Defense Supply Center Columbus.MIL-PRF-55182H,Resistors,Fixed,Film,Nonestablished Reliability,Established Reliability,and Space Level,General Specification for[S].2002.
[21]Defense Supply Center Columbus.MIL-PRF-49462C,Resistors,Fixed,Film,High Voltage General Specification for[S].2008.
[22]Defense Supply Center Columbus.MIL-PRF-31031B,Connectors,Electrical,Plugs And Receptacles,Coaxial,Radio Frequency,High Reliability,for Flexible and Semirigid Cables,General Specification for[S].2009.
[23]Defense Supply Center Columbus.MIL-DTL-38999L,Connectors,Electrical,Circular,Miniature,High Density,Quick Disconnect(Bayonet,Threaded,and Breech Coupling),Environment Resistant,Removable Crimp and Hermetic Solder Contacts,General Specification for[S].2009.
[24]Defense Supply Center Columbus.MIL-PRF-85045F,Cables,Fiber Optics,(Metric),General Specification for[S].1999.
[25]Defense Supply Center Columbus.MIL-DTL-49292B,Cable Assemblies,Nonpressure Proof,Fiber Optic,Metric,General Specification for[S].2006.
[26]Defense Supply Center Columbus.MIL-PRF-3098K,Crystal Units,Quartz General Specification for[S].2010.
[27]Defense Supply Center Columbus.MIL-PRF-23419G,Fuse,Cartridge,Instrument Type,General Pecification for[S].2007.
[28]Defense Supply Center Columbus.MIL-PRF-23419/10B,Performance Specification Sheet Fuses,Cartridge,Instrument Type,Style Fm10,(Nonindicating)[S].2005.
[29]Defense Supply Center Columbus.MIL-PRF-28861D,Filters And Capacitors,Radio Frequency/Electromagnetic Interference Suppression,General Specification for[S].2011.
[30]Japan Aviation Electronics Industry,Limited Issued by Japan Aerospace Exploration Agency.JAXA-QTS-2110A,Transformers and Induntors,High Reliability,Space Use,General Specification for[S].2005.
[31]Japan Aviation Electronics Industry,Limited Issued by Japan Aerospace Exploration Agency.JAXA-QTS-2120A,Wires,Electric,Fluorine Resin/Polyimide Insulated[S].2004.
[32]Defense Supply Center Columbus.MIL-PRF-8805/68L,Performance Specification Sheet—Switches,Sensitive,Spdt,4 Amperes,Hermetic Seal[S].2008.
[33]Defense Supply Center Columbus.MIL-PRF-31032/5,Printed Wiring Board,Rigid,Multilayered,Thermoplastic or Thermoplastic and Thermosetting Resin Base Material,with Plated Through Holes,for High Frequency Applications[S].2009.
[34]Defense Supply Center Columbus.MIL-PRF-31032/6,Printed Wiring Board,Rigid,Single and Double Sided,Thermoplastic Resin Base Material,with or without Plated–Through Holes,for High Frequency Applications[S].2010.
[35]Defense Supply Center Columbus.MIL-STD-981C,Design,Manufacturing and Quality Standards for Custom Electromagnetic Devices for Space Applications[S].2010.
[36]Space and Missile Systems Center EL Segundo.SMC-S-010,Parts,Materials,and Processes Technical Requirements for Space and Launch Vehicles[S].2009.
[37]National Aeronautics and Space Adminstration.NASA/TP-2003-212244 PEM-INST-001,Instructions for Plastic Encapsulated Microcircuit(Pem)Selection,Screening,and Qualification[S].2003.
[38]Defense Supply Center Columbus.MIL-HDBK-1547A,Electronic Parts,Materials,and Processes for Space and Launch Vehicles[S].1998.
[39]中国电子技术标准化研究院.GJB1432B-2009,片式膜固定电阻器通用规范[S].北京:总装备部军标出版发行部,2009.
[40]中国电子技术标准化研究院.GJB244A-2001,有质量等级的薄膜固定电阻器总规范[S].北京:总装备部军标出版发行部,2001.
[41]中国电子技术标准化研究院.GJB6786-2009,含宇航级的功率型线绕固定电阻器通用规范[S].北京:总装备部军标出版发行部,2009.
[42]中国电子技术标准化研究院.GJB6787-2009,含宇航级零欧姆片式膜固定电路通用规范[S].北京:总装备部军标出版发行部,2009.
[43]中国电子技术标准化研究院.GJB142B-2011,机柜用外壳定位小型矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[44]中国电子技术标准化研究院.GJB599B-2012,耐环境快速分离高密度小圆形电连接器通用规范[S].北京:总装备部军标出版发行部,2012.
[45]中国电子技术标准化研究院.GJB2446A-2011,外壳定位超小型矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[46]中国电子技术标准化研究院.GJB5021A-2011,柔软和半硬电缆用高可靠射频同轴连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[47]中国电子技术标准化研究院.GJB7245-2011,外壳定位超微矩形电连接器通用规范[S].北京:总装备部军标出版发行部,2011.
[48]中国电子技术标准化研究院.GJB1428B-2009,光缆通用规范[S].北京:总装备部军标出版发行部,2009.
[49]中国电子技术标准化研究院.GJB5850-2006,小型熔断器通用规范[S].北京:总装备部军标出版发行部,2006.