基于多场耦合的旋转圆盘电极法研究酸性镀铜
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摘要
采用多物理场耦合方法建立了旋转圆盘电极(RDE)电镀酸铜的模型,分析了电解池内不同RDE转速下的流场分布与扩散层分布特征,探讨了镀铜过程中RDE的转速及尺寸对电极表面电流密度与镀层厚度分布的影响,为电镀件表面电流密度分布和镀层厚度均匀性的研究提供理论指导。
A model for acidic copper electrodeposition on rotating disk electrode(RDE) was established based on multi-physics coupling method. The characteristics of flow field distribution and diffusion layer distribution at different rotating speeds of RDE in electrolytic bath were analyzed. The effects of rotating speed and size of RDE on distribution of current density and coating thickness were discussed. The results provide a theoretical guidance for the study of current density distribution and coating thickness uniformity on the electrodeposited object.
A model for acidic copper electrodeposition on rotating disk electrode(RDE) was established based on multi-physics coupling method. The characteristics of flow field distribution and diffusion layer distribution at different rotating speeds of RDE in electrolytic bath were analyzed. The effects of rotating speed and size of RDE on distribution of current density and coating thickness were discussed. The results provide a theoretical guidance for the study of current density distribution and coating thickness uniformity on the electrodeposited object.
引文
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[14]COLLI A N,BISANG J M.Validation of theory with experiments for local mass transfer at parallel plate electrodes under laminar flow conditions[J].Journal of the Electrochemical Society,2013,160(1):E5-E11.
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[17]DECONINCK J.Current distributions and electrode shape changes in electrochemical systems[M].[S.l.]:Springer Science&Business Media,2012.
[2]VAN OLMEN J,HUYGHEBAERT C,COENEN J,et al.Integration challenges of copper through silicon via(TSV)metallization for 3D-stacked IC integration[J].Microelectronic Engineering,2011,88(5):745-748.
[3]JI L X,WANG S X,WANG C,et al.Improved uniformity of conformal through-hole copper electrodeposition by revision of plating cell configuration[J].Journal of the Electrochemical Society,2015,162(12):D575-D583.
[4]JI L X,WANG C,WANG S X,et al.Multi-physics coupling aid uniformity improvement in pattern plating[J].Circuit World,2016,42(2):69-76.
[5]TAO Z H,HE W,WANG S X,et al.Synergistic effect of different additives on microvia filling in an acidic copper plating solution[J].Journal of the Electrochemical Society,2016,163(8):D379-D384.
[6]BROEKMANN P,FLUEGEL A,EMNET C,et al.Classification of suppressor additives based on synergistic and antagonistic ensemble effects[J].Electrochimica Acta,2011,56(13):4724-4734.
[7]TAKAHASHI K M,GROSS M E.Transport phenomena that control electroplated copper filling of submicron vias and trenches[J].Journal of the Electrochemical Society,1999,146(12):4499-4503.
[8]ALEXIADIS A,CORNELL A,DUDUKOVIC M P.Comparison between CFD calculations of the flow in a rotating disk cell and the Cochran/Levich equations[J].Journal of Electroanalytical Chemistry,2012,669:55-66.
[9]DONG Q B,SANTHANAGOPALAN S,WHITE R E.A comparison of numerical solutions for the fluid motion generated by a rotating disk electrode[J].Journal of the Electrochemical Society,2008,155(9):B963-B968.
[10]JI L X,WANG C,WANG S X,et al.Multiphysics coupling simulation of RDE for PCB manufacturing[J].Circuit World,2015,41(1):20-28.
[11]BOOVARAGAVAN V,BASHA C A.A novel approach for computing tertiary current distributions based on simplifying assumptions[J].Journal of Applied Electrochemistry,2006,36(7):745-757.
[12]VOROTYNTSEV M A,KONEV D V.Primary and secondary distributions after a small-amplitude potential step at disk electrode coated with conducting film[J].Electrochimica Acta,2011,56(25):9105-9112.
[13]VAZQUEZ-ARENAS J,PRITZKER M,FOWLER M.Kinetic and hydrodynamic implications of 1-D and 2-D models for copper electrodeposition under mixed kinetic-mass transfer control[J].Electrochimica Acta,2013,89:717-725.
[14]COLLI A N,BISANG J M.Validation of theory with experiments for local mass transfer at parallel plate electrodes under laminar flow conditions[J].Journal of the Electrochemical Society,2013,160(1):E5-E11.
[15]MISHCHENCHUK V V,NECHYPORUK V V,TKACHUK M M,et al.Mathematical modeling of nonequilibrium behavior of electrochemical systems with the electroreduction of anions[J].Electrochimica Acta,2013,108:153-166.
[16]KIM G S,MERCHANT T,D’URSO J,et al.Systematic study of surface chemistry and comprehensive two-dimensional tertiary current distribution model for copper electrochemical deposition[J].Journal of the Electrochemical Society,2006,153(11):C761-C772.
[17]DECONINCK J.Current distributions and electrode shape changes in electrochemical systems[M].[S.l.]:Springer Science&Business Media,2012.