导电膏互连电镀通孔的仿真研究
|
摘要
基于导电膏填塞微孔的方法,设计了2种印制电路板导电膏互连层间电镀通孔的结构,并对其进行信号完整性仿真。考察了层间粘结半固片所填塞导电膏的预固化条件对层间导通与半固化片层粘结效果的影响。应用网络分析仪测试塞孔互连结构的信号完整性,并与仿真结果进行对比。采用回流焊测试的方法评定印制电路板塞孔互连结构的可靠性。实验结果表明直线型塞孔互连结构具有最好的信号完整性,能较好地实现电信号的可靠传输。
Based on the micro-through filled with conductive paste,two structures of filling interconnection between conductive paste and plating through holes for printed circuit board were designed to simu-late their signal integrity. Precuring conditions of prepreg with filling conductive paste were investigated to find the effects on the layer interconnection and bonding strength. Signal integrity for structures of filling interconnection was tested by a network analyzer,compared with the case for above simulation. The reliability of structures of filling interconnection for printed circuit board was investigated using the reflow soldering test. The results showed that linear-type filling interconnection had good agreement with signal integrity for reliable transmission of electrical signal.
Based on the micro-through filled with conductive paste,two structures of filling interconnection between conductive paste and plating through holes for printed circuit board were designed to simu-late their signal integrity. Precuring conditions of prepreg with filling conductive paste were investigated to find the effects on the layer interconnection and bonding strength. Signal integrity for structures of filling interconnection was tested by a network analyzer,compared with the case for above simulation. The reliability of structures of filling interconnection for printed circuit board was investigated using the reflow soldering test. The results showed that linear-type filling interconnection had good agreement with signal integrity for reliable transmission of electrical signal.
引文
[1]Song E,Cho J,Kim J,et al.Modeling and design optimization of a wideband passive equalizer on PCB basedon near-end crosstalk and reflections for high-speed seri-al data transmission[J].IEEE Transactions on Electro-magnetic Compatibility,2010,52(2):410-420.
[2]苏世栋,聂合贤,何雪梅,等.挠性板通孔电镀配方与工艺优化研究[J].电镀与精饰,2017,39(11):9-14.
[3]孔繁,盛卫星,马晓峰,等.高速背板互连的信号完整性仿真方法[J].系统工程与电子技术,2014,36(10):2082-2088.
[4]Herd J,Duffy S,Carlson D,et al.Low cost multifunc-tion phased array radar concept[C]//2010 IEEE Interna-tional Symposium on Phased Array Systems and Technol-ogy,IEEE,2010:457-460.
[5]Wang S,Yang T,Chen Y,et al.Pre-curing investiga-tion of filling conductive paste in prepreg to interconnecttwo multilayer structures of backboard for press-fit appli-cation[J].Circuit World,2016,42(3):104-109.
[6]Kumar V,Sharma R,Uzunlar E,et al.Airgap intercon-nects:Modeling,optimization,and benchmarking forbackplane PCB and interposer applications[J].IEEETransactions on Components,Packaging and Manufac-turing Technology,2014,4(8):1335-1346.
[7]陈云敏,梁志刚,陈仁朋,等.有缺陷同轴电缆的时域反射特性及应用[J].浙江大学学报(工学版),2005,39(1):51-56.
[8]彭勤卫,汤荣耀.印制电路板板级插入损耗的研究[J].印制电路信息,2013,4:3-9.
[9]张俊民,周小猛,魏娟,等.基于小波变换的导线绝缘故障定位方法[J].电工技术学报,2012,27(5):99-104.
[10]齐海鹏,王宪坤.高速PCB的可靠性设计[J].印制电路信息,2005,5:17-19.
[2]苏世栋,聂合贤,何雪梅,等.挠性板通孔电镀配方与工艺优化研究[J].电镀与精饰,2017,39(11):9-14.
[3]孔繁,盛卫星,马晓峰,等.高速背板互连的信号完整性仿真方法[J].系统工程与电子技术,2014,36(10):2082-2088.
[4]Herd J,Duffy S,Carlson D,et al.Low cost multifunc-tion phased array radar concept[C]//2010 IEEE Interna-tional Symposium on Phased Array Systems and Technol-ogy,IEEE,2010:457-460.
[5]Wang S,Yang T,Chen Y,et al.Pre-curing investiga-tion of filling conductive paste in prepreg to interconnecttwo multilayer structures of backboard for press-fit appli-cation[J].Circuit World,2016,42(3):104-109.
[6]Kumar V,Sharma R,Uzunlar E,et al.Airgap intercon-nects:Modeling,optimization,and benchmarking forbackplane PCB and interposer applications[J].IEEETransactions on Components,Packaging and Manufac-turing Technology,2014,4(8):1335-1346.
[7]陈云敏,梁志刚,陈仁朋,等.有缺陷同轴电缆的时域反射特性及应用[J].浙江大学学报(工学版),2005,39(1):51-56.
[8]彭勤卫,汤荣耀.印制电路板板级插入损耗的研究[J].印制电路信息,2013,4:3-9.
[9]张俊民,周小猛,魏娟,等.基于小波变换的导线绝缘故障定位方法[J].电工技术学报,2012,27(5):99-104.
[10]齐海鹏,王宪坤.高速PCB的可靠性设计[J].印制电路信息,2005,5:17-19.