摘要
以实际项目的机房为例,利用数据中心专用模拟软件6SigmaRoom,研究热通道封闭数据中心的最佳送风方式,对比分析机架下送风和地板下送风情况下,满足ASHRAE2011温度标准的机柜数量、机房内边缘热点的IT设备数量、机柜数量及不同截面的温度、速度分布情况,并选取几个典型的热环境评价指标定量分析机房热环境。研究表明,由于地板下送风受送风静压箱和地板开孔率的影响较大,热通道封闭的数据中心宜与机架下送风方式相结合,充分利用冷量,达到节能的目的。
By taking the actual computer room as an example,the special simulation software 6 SigmaRoom for data centers was used to study the optimal air supply method for the hot aisle contained data center,the number of cabinets satisfying the ASHRAE2011 temperature standard,the number of IT equipment and number of cabinets,temperature and velocity distribution of different cross-sections at hot spots on the edge of the equipment room were comparatively analyzed for the under-rack air supply and the under-floor air supply,and several typical thermal environment evaluation indicators were selected to quantitatively analyze the thermal environment of the computer room. The study shows that because the air supply under the floor is greatly affected by the static pressure box and the floor opening rate,the data center with contained hot aisle should be combined with the air supply method under the rack to fully utilize the cooling capacity to achieve the purpose of energy conservation.
引文
[1]中国制冷学会数据中心冷却工作组.中国数据中心冷却技术2017年度发展研究报告[M].北京:中国建筑工业出版社,2018.
[2]张愚.数据中心被动式散热解决方案[J].智能建筑与城市信息,2012,184(3),21-25.
[3]吕超,陈光明等.小型数据中心机房布局及气流组织研究[J].低温工程,2017,217(3):61-68.
[4]王宁,陈龙泉,蔡丰,等.冷通道封闭对机房热环境影响的实验与模拟[J].暖通空调,2017,47(6):107-116.
[5]陈杰.数据机房冷通道封闭技术应用及模拟研究[J].暖通空调,2015,45(6):37-40.
[6]数据中心设计规范:GB50174-2017[S].北京:中国计划出版社,2017.
[7]数据中心制冷与空调设计标准:T/CECS 487-2017[S].北京:中国计划出版社,2017.
[8]Herrlin M K.Airflow and cooling performance in data centers:two performance metrics[J].ASHRAE Trans,2008,114(2):182-187.
[9]Herrlin M K.Rack cooling effectiveness in data centers and telecom central offices:the rack cooling index RTI[J].ASHRAE Trans,2005,111(2):1-11.
[10]Sharma R K,Bash C E,Chandrakant D P.Dimensionless parameters for evaluation of thermal design and performance of large-scale data centers[C]//American Institute of Aeronautics and Astronautics,8th ASME/AIAA Joint Thermophysics and Heat Transfer Conferense,2002.