熔融沉积3D打印材料粘接强度及模量预测研究
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  • 英文篇名:Prediction study on bond strength and modulus of fused deposition modeling product
  • 作者:张黎 ; 王新宇 ; 李征 ; 谷俊峰 ; 阮诗伦 ; 申长雨
  • 英文作者:ZHANG Li;WANG Xinyu;LI Zheng;GU Junfeng;RUAN Shilun;SHEN Changyu;Department of Engineering Mechanics, Dalian University of Technology;The William G.Lowrie Department of Chemical and Biomolecular Engineering;State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology;
  • 关键词:聚合物 ; 熔融沉积成型 ; 层间粘接性能预测 ; 扩散 ; 数值模拟
  • 英文关键词:polymers;;fused deposition modeling;;prediction of interlaminar mechanical properties;;diffusion;;simulation
  • 中文刊名:HGSZ
  • 英文刊名:CIESC Journal
  • 机构:大连理工大学工程力学系;俄亥俄州立大学化学及生物分子工程系;大连理工大学工业装备结构分析国家重点实验室;
  • 出版日期:2019-05-17 08:53
  • 出版单位:化工学报
  • 年:2019
  • 期:v.70
  • 基金:国家自然科学基金项目(11432003,11602050,11702053);; 高等学校学科创新引智计划项目(B14013);; 中央高校基本科研业务费专项资金(DUT16TD05)
  • 语种:中文;
  • 页:HGSZ201907034
  • 页数:11
  • CN:07
  • ISSN:11-1946/TQ
  • 分类号:324-333+419
摘要
主要介绍了一种用于预测熔融沉积模型(FDM)层间粘接强度的扩散修复模型。根据流变数据确定温度相关扩散模型,基于一维瞬态热分析预测FDM部件层间的扩散。将温度历史上的扩散系数对时间积分得到界面分子总扩散,进而得到层间粘接强度预测模型。结果表明:不同打印条件下预测结果与测得的粘合强度结果的吻合度较好,且该模型经修正后也适用于FDM部件弹性模量的预测。通过三点弯曲实验与数值模拟的结果对比,验证了粘接强度及模量预测模型的可用性。因此,可以作为FDM打印件承载性能预测的有效模型。
        A diffusion repatr model for the predicting bond strength between layers of fused deposition modeling(FDM) is introduced. The temperature-dependent diffusion model was determined based on the rheological data.The diffusion between the layers of the FDM components was predicted based on one-dimensional transient thermal analysis. The diffusion coefficient of temperature history was integrated with time to obtain the total diffusion of interfacial molecules, and then the interlaminar bond strength prediction model was obtained. The results showed that the predicted bond strength is in good agreement with the measured data under different printing conditions,which indicates that the prediction model is reasonable. Finally, the usability of the model is verified by a combination of three-point bending experiments and numerical simulations. Therefore, it can be used as an effective model for predicting the performance of FDM prints.
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