摘要
为了开发成本低廉的压力容器焊接用的陶质衬垫,按照不同组分配料和预制衬垫毛坯,进行了不同温度毛坯烧制和陶质衬垫性能检测分析。通过对比分析与优选,成功开发出新型的陶质衬垫,其具有最低1 050℃的烧结温度,并且衬垫性能优良,焊接工艺性良好,可以替代目前常规的高温烧制陶质衬垫。
In order to develop a kind of ceramic backing with low cost for pressure vessel welding, blanks of ceramic backing of different ingredients were made and sintered under different temperatures. Then the performance of ceramic backings was tested.Through comparison and optimization, a new kind of ceramic backing has been successfully developed, which has the lowest sintering temperature of 1 050℃. The ceramic backing has excellent performance, good weldability. It can replace the conventional high temperature sintered ceramic backing.
引文
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