基于动力学校对的三明治薄膜芯片设计制造
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摘要
基于动力学校对机理的固态纳米孔测序技术,设计了全新结构的纳米孔芯片,在氮化硅/氧化硅/氮化硅(Si3N4/Si O2/Si3N4)三明治结构层的基础上,增加了Si O2/Si3N4双牺牲层,在减小悬空薄膜应力的同时还能通过增加电容器有效降低测序噪声,通过热应力计算确定各层薄膜的厚度,避免在生产过程中薄膜的破裂。利用纳机电系统(NEMS),制定三明治结构薄膜芯片的工艺流程,包括低压化学气相沉积(LPCVD),多次光刻,反应离子束刻蚀(RIE),湿法腐蚀等技术,得到高质量的悬空三明治结构薄膜。进一步对此工艺制造的薄膜进行聚焦离子束(FIB)刻蚀,用蔡司的氦离子显微镜制造得到直径约5 nm的纳米孔。
A new structure of nanopore chip for solid state nanopore sequencing technology based on kinetic profreading is designed,in addition to sandwich structure layers of Si3 N4/Si O2/Si3 N4,increase the double sacrifice layers of Si O2/Si3 N4,while reducing the stress of each layer free-standing film,it can also reduce the noise by increasing capacitance,the thickness of each layer films is determined by thermal stress computation to avoid cracking of each layer film during the production process. Process for fabrication of sandwich structure film is designed using nano-electro-mechanical systems( NEMS),including low-pressure chemical vapor deposition( LPCVD),lithography,reactive ion beam etching( RIE) and wet etching and so on,to gain high quality free-standing sandwich structure film. The film fabrication is further etched by focused ion beam( FIB),a nanopore of about 5 nm in diameter is made with Zeiss' s helium ion microscope.
A new structure of nanopore chip for solid state nanopore sequencing technology based on kinetic profreading is designed,in addition to sandwich structure layers of Si3 N4/Si O2/Si3 N4,increase the double sacrifice layers of Si O2/Si3 N4,while reducing the stress of each layer free-standing film,it can also reduce the noise by increasing capacitance,the thickness of each layer films is determined by thermal stress computation to avoid cracking of each layer film during the production process. Process for fabrication of sandwich structure film is designed using nano-electro-mechanical systems( NEMS),including low-pressure chemical vapor deposition( LPCVD),lithography,reactive ion beam etching( RIE) and wet etching and so on,to gain high quality free-standing sandwich structure film. The film fabrication is further etched by focused ion beam( FIB),a nanopore of about 5 nm in diameter is made with Zeiss' s helium ion microscope.
引文
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[3] LüW,Chen M,Wu R. The impact of the number of layers of a graphene nanopore on DNA translocation[J]. Soft Matter,2013,9(3):960-966.
[4] Ling D Y,Ling X S. On the distribution of DNA translocation times in solid-state nanopores:An analysis using Schr9dinger’s first-passage-time theory[J]. Quantitative Biology,2013,25(37):375102.
[5] Ling X S. Methods of sequencing nucleic acids using nanopores and active kinetic proofreading[P]. 2013.
[6] Jerman H. Electrically-activated,micromachined diaphragm valves[C]∥1990 IEEE Solid-State Sensor and Actuator Workshop,IEEE,1990:65-69.
[7]利萨·格迪斯. MEMS材料与工艺手册[M].南京:东南大学出版社,2014.
[8] Sekimoto M,Yoshihara H,Ohkubo T. Silicon nitride single-layer X-ray mask[J]. Journal of Vacuum Science&Technology,1982,21(4):1017-1021.
[9] Levin R M. Low pressure deposition of phosphosilicate glass films[J].Journal of the Electrochemical Society,1982,129(7):1588-1592.
[10]刘昶,黄庆安.微机电系统基础[M].北京:机械工业出版社,2013.