微胶囊铜粉对铜复合浆料性能的影响
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摘要
为提高铜浆料的导电性,利用微胶囊技术在铜粉表面包覆液体石蜡,增强铜粉的抗氧化性,并添加少量导电性能优异的碳纳米管作为导电增强相,制备碳纳米管-铜复合浆料.利用四探针测试仪、扫描电镜等测试方法研究了液体石蜡含量对包覆铜粉性能的影响以及微胶囊铜粉作为主导电相,碳纳米管作为导电增强相对浆料导电性能的影响.结果表明:液体石蜡包覆含量为4 wt%的微胶囊铜粉具有良好的导电性和抗氧化性,其电导率为44.32%IACS;微胶囊铜粉作为碳纳米管-铜浆料的主导电相,制备浆料膜层电阻率为22.59 mΩ·cm,相比于未包覆的铜粉为主导电相制备的浆料膜层电阻率降低了12.44%;碳纳米管作为导电增强相所制备的浆料相比于纯铜浆料,电阻率降低31.74%.
The copper powders were coated with liquid paraffin by micro capsule technology to enhance theantioxidation of copper powders. A small amount of carbon nanotubes with good conductivity were added asconductive reinforced phase to prepare the composite paste. Influences of paraffin content on the paraffin-coated copper powders were analyzed. Influences of micro capsule copper powders as main conductive phaseand carbon nanotubes as conductive reinforced phase were characterized by Four-Point probe, scanningelectron microscopy(SEM) and other testing methods. The results show that copper powders coated by 4 wt%paraffin have better conductive property and oxidation resistance. Its conductivity is 44.32 s/cm. The microcapsule copper powders are used as conductive phase to prepare the paste. Its resistivity is 22.59 Ω·cm,which is decreased by 12.44% compared to the copper paste. The resistivity of the paste with carbon nanotubesas conductive reinforced phase is decreased by 31.74% compared to the copper paste.
The copper powders were coated with liquid paraffin by micro capsule technology to enhance theantioxidation of copper powders. A small amount of carbon nanotubes with good conductivity were added asconductive reinforced phase to prepare the composite paste. Influences of paraffin content on the paraffin-coated copper powders were analyzed. Influences of micro capsule copper powders as main conductive phaseand carbon nanotubes as conductive reinforced phase were characterized by Four-Point probe, scanningelectron microscopy(SEM) and other testing methods. The results show that copper powders coated by 4 wt%paraffin have better conductive property and oxidation resistance. Its conductivity is 44.32 s/cm. The microcapsule copper powders are used as conductive phase to prepare the paste. Its resistivity is 22.59 Ω·cm,which is decreased by 12.44% compared to the copper paste. The resistivity of the paste with carbon nanotubesas conductive reinforced phase is decreased by 31.74% compared to the copper paste.
引文
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[2]张静,杨彦,袁梦鑫.新型电子元器件电极浆料组成与性能的研究[J].科研发展,2014(18):144.ZHANG Jing,YANG Yan,YUAN Mengxin.Researchon the composition and properties of new electroniccomponents electrode paste[J].Research anddevelopment,2014(18):144.
[3]陆广广,宣天鹏.电子浆料的研究进展与发展趋势[J].金属功能材料,2008,15(1):48.LU Guanguang,XUAN Tianpeng.Developmenttendency and research progress of the electronic paste[J].Metallic Functional Materials,2008,15(1):48.
[4]徐磊,张宏亮,刘显杰.电子浆料研究进展.[J].船电技术,2012,1(32):141-146.XU Lei,ZHANG Hongliang,LIU Xianjie.Reviews onelectronic paste[J].Marine Electric&Electronic,,2012,1(32):141-146.
[5]JUSSI P,MACIEJ S,SAARA R,et al.Characterizationof laser-sintered thick-film paste on polycarbonatesubstrates[J].Optics and Lasers in Engineering 2014(56):19-27.
[6]IRFAN M,KUMAR D.Recent advances in isotropicconductive adhesives for electronics packagingapplications[J].International Journal of Adhesion andAdhesives,2008,28(7):362-371.
[7]刘新峰,屈银虎,郑红梅,等.铜电子浆料的抗氧化研究和进展[J].应用化工,2014,43(8):1493-1497.LIU Xinfeng,QU Yinhu,ZHENG Hongmei,et al.Progress on oxidation resistance of copper paste[J].Applied Chemical Industry,2014,43(8):1493-1497.
[8]刘晓琴,苏晓磊.铜电子浆料的研究发展现状[J].硅酸盐通报,2013,32(12):2502-2513.LIU Xiaoqin,SU Xiaolei.Research progress anddevelopments of conductive copper paste[J].Bulletinof the Chinese Ceramic Society,2013,32(12):2502-2513.
[9]蒙青,屈银虎,成小乐,等.无铅玻璃粘结相对铜导电浆料性能的影响[J].功能材料,2016(2):2130-2134.MENG Qing,QU Yinhu,CHENG Xiaole,et al.Theeffects of the lead-free glass powders on performancesof copper electronic paste[J].Journal of functionalmaterials,2016(2):2130-2134.
[10]刘新峰.高温烧结型铜电子浆料抗氧化性研究[D].西安:西安工程大学,2015.LIU Xinfeng.Study for anti-oxidation of copperelectrical paste sintered in high temperature[D].Xi’an:Xi’an Polytechnic University,2015.
[11]王翔,屈银虎,成小乐,等.高温烧结型铜电子浆料的导电性[J].西安工程大学学报,2017,31(1):113-118.WANG Xiang,QU Yinhu,CHENG Xiaole,et al.Theelectrical conductivity of high temperature sinteredcopper electronic paste[J].2017,31(1):113-118.
[12]李冰,王俊勃,苏晓磊,等.电子浆料中的贱金属导电相的改善工艺研究进展[J].材料导报A,2013,21:35-39.LI Bing,WANG Junbo,SU Xiaolei,et al.Researchprogress in improving progressing of base metal electricconduction phase in electronic paste[J].Journal ofmaterials A,2013,21:35-39.
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[15]CAROLINE C,HANS B,FLORIAN V,et al.Inertdrying system for copper paste application in PV.Energy Procedia,2013,38:423-429.
[16]廖辉伟,李翔,彭汝芳,等.包覆型纳米铜-银双金属粉研究[J].无机化学学报,2003,19(12):1327-1330.LIAO Huiwei,LI Xiang,PENG Rufang,et al.Studyon Ag coating Cu nano bimetallic powders[J].ChineseJournal of Inorganic Chemistry,2003,19(12):1327-1330.
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[21]尚润琪,屈银虎,成小乐,等.碳纳米管对铜电子浆料导电性能的影响[J].西安工程大学学报,2016(6):802-807.SHANG Runqi,QU Yinhu,CHENG Xiaole,et al.Effect of carbon nanotubes on electrical conductivity ofCu paste[J].Xi′an Polytechnic University,2016(6):802-807.
[22]王利民,何卫,蔡炜,等.碳纳米管与铝合金基体材料的混合工艺研究[J].材料科学与工艺,2015,23(6):104-108.WANG Limin,HE Wei,CAI Wei,et al.Research onmixing procedure of carbon nanotubes and aluminumalloy powder[J].Materials Science and Technology,2015,23(6):104-108.