相变薄膜热物性对电子设备热控的影响
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摘要
相变热控技术是被动热控的重要方法之一。文中对利用柔性相变薄膜材料进行电子设备热控进行了实验研究和数值模拟,获得了相变材料热物性参数和结构参数对热控性能的影响规律。研究结果表明,相变材料的比热容和相变潜热对热控性能的影响较小,材料的热导率、厚度以及来自芯片的热流密度和热源面积因子对热控有较大影响;当系统达到热平衡时,热源中心温度与相变材料热导率、厚度以及热源面积因子成负相关,与热流密度成正相关。
Phase change thermal control technology is one of the important methods for passive thermal control.The experimental research and numerical simulation for the thermal control of electronic equipment using flexible phase change film materials are carried out,and the influence of the physical parameters of phase-change materials and the experimental parameters on the thermal control are obtained.The results show that the specific heat capacity and the latent heat of the phase-change material have little effects on thermal control,while the thermal conductivity and the thickness of the phase-change material,the heat flux from the chip and the heat source area factor have a large influence on thermal control.When the system reaches thermal balance,the central temperature of the heat source is negatively correlated with the thermal conductivity and the thickness of the phasechange material and the heat source area factor,and is positively correlated with the heat flux.
Phase change thermal control technology is one of the important methods for passive thermal control.The experimental research and numerical simulation for the thermal control of electronic equipment using flexible phase change film materials are carried out,and the influence of the physical parameters of phase-change materials and the experimental parameters on the thermal control are obtained.The results show that the specific heat capacity and the latent heat of the phase-change material have little effects on thermal control,while the thermal conductivity and the thickness of the phase-change material,the heat flux from the chip and the heat source area factor have a large influence on thermal control.When the system reaches thermal balance,the central temperature of the heat source is negatively correlated with the thermal conductivity and the thickness of the phasechange material and the heat source area factor,and is positively correlated with the heat flux.
引文
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[3]韩贵杰,张静,袁梦鑫.电子元器件热电冷却技术研究进展[J].电子世界,2014(18):191.
[4]潘艾刚,王俊彪,张贤杰.相变温控技术在航天热控领域中的应用现状及展望[J].材料导报,2013(8):113-119.
[5]王亮,王涛,林贵平.应用潜热型功能热流体的液冷服散热性能分析[J].航天医学与医学工程,2011,24(3):186-190.
[6]KANDASAMY R,WANG X Q,MUJUMDAR A S.Transient cooling of electronics using phase change material(PCM)-based heat sinks[J].Applied Thermal Engineering,2007,28(8-9):1047-1057.
[7]CHENG W L,YUAN X D.Numerical analysis of a novel household refrigerator with shape-stabilized PCM(phase change material)heat storage condensers[J].Energy,2013,59:265-276.
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[10]WU W F,LIU N,CHENG W L,et al.Study on the effect of shape-stabilized phase change materials on spacecraft thermal control in extreme thermal environment[J].Energy Conversion and Management,2013,69:174-180.
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[12]张东.脂肪酸分子合金相变材料的热稳定性[J].建筑材料学报,2008,11(3):283-287.
[13]李皖皖.高导热柔性相变材料及其热控特性研究[D].合肥:中国科学技术大学,2017.
[14]CHENG W L,ZHANG R M,XIE K,et al.Heat conduction enhanced shape-stabilized paraffin/HDPE composite PCMs by graphite addition:Preparation and thermal properties[J].Solar Energy Materials and Solar Cells,2010,94(10):1636-1642.
[15]CHENG W L,LI W W,NIAN Y L,et al.Study of thermal conductive enhancement mechanism and selection criteria of carbon-additive for composite phase change materials[J].International Journal of Heat and Mass Transfer,2018,116:507-511.
[16]程文龙,李皖皖,年永乐.一种用于电子设备热控技术的柔性相变材料:中国,201710443618.9[P].2017-6-13.
[17]LI W W,CHENG W L,XIE B,et al.Thermal sensitive flexible phase change materials with high thermal conductivity for thermal energy storage[J].Energy Conversion and Management,2017,149:1-12.