纳米掺杂Ag/Cu/SnO_2触头材料的制备及性能分析
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  • 英文篇名:Preparation and properties analysis of nano doped Ag/Cu/SnO_2 contact material
  • 作者:思芳 ; 王俊勃 ; 刘松涛 ; 杨敏鸽
  • 英文作者:SI Fang;WANG Junbo;LIU Songtao;YANG Minge;School of Materials Science and Engineering,Xi′an Polytechnic University;School of Environmental and Chemistry Engineering,Xi′an Polytechnic University;
  • 关键词:Ag/Cu/SnO2触头材料 ; 电性能 ; 耐电弧侵蚀
  • 英文关键词:Ag/Cu/SnO2 contact material;;electrical properties;;arc erosion
  • 中文刊名:FGJK
  • 英文刊名:Basic Sciences Journal of Textile Universities
  • 机构:西安工程大学材料工程学院;西安工程大学环境与化学工程学院;
  • 出版日期:2018-09-30
  • 出版单位:纺织高校基础科学学报
  • 年:2018
  • 期:v.31;No.121
  • 基金:陕西省自然科学基础研究计划项目(2016JM5049);; 陕西省教育厅科学研究计划专项项目(17JK0333)
  • 语种:中文;
  • 页:FGJK201803007
  • 页数:7
  • CN:03
  • ISSN:61-1296/TS
  • 分类号:42-48
摘要
为了降低银基触头材料中银的用量,改善SnO_2在Ag/Cu基体中的润湿性,以CuO为掺杂剂,采用高能球磨法和压力烧结成型工艺制备出银含量为70%的纳米掺杂Ag/Cu/SnO_2触头材料,测试纳米掺杂触头材料的电导率、硬度、密度、耐电压强度等性能,运用X射线衍射仪对Ag/Cu/SnO_2触头材料进行物相分析,利用扫描电镜(SEM)观察分析触头材料耐电弧侵蚀性能测试前后的表面形貌特征.结果表明,制得的纳米掺杂Ag/Cu/SnO_2触头材料组织分布均匀,具备优异的物理性能、耐电压强度和耐电弧侵蚀能力,能够有效降低银基触头材料中银的用量.
        In order to save silver and improve the wettability of SnO_2 particles in Ag/Cu matrix,CuO was used as the doping agents to prepare Ag/Cu/SnO_2 contact material with 70% silver content by high energy ball milling and pressure sintering process.Then the conductivity,hardness,density and electrical properties of Ag/Cu/SnO_2 contact material were tested.The phase structure and microstructural of Ag/Cu/SnO_2 contact material were characterized using XRD and SEM.The results show that the composition of nano doped Ag/Cu/SnO_2 contact material isevenly distributed.The contact material has excellent physical properties,electrical properties and arc erosion ability.It can effectively reduce the amount of silver in silver base contact material.
引文
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