基于HTCC的小型化下变频电路设计
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摘要
下变频是超外差式接收机的核心电路之一。采用基于高温共烧陶瓷(HTCC)的微波多芯片模块(MMCM)的方式来设计下变频电路,可以实现电路的高度集成化和小型化。该电路在优化变频方案的前提下,内部布局合理,并且通过HFSS和ANSYS等多种仿真软件对电路的垂直转换进行优化,对二级安装后的热应力进行仿真,使各项指标均满足系统要求,并且使电路的可靠性和可制造性得到大幅度提高,可以满足在日渐有限的载荷、空间、功耗条件下实现高集成、小型化、低功耗多通道下变频电路的设计要求。
Down-conversion circuit is one of the key circuits of superheterodyne receiver.To achieve high integration and miniaturization,the proposed down-conversion circuit is designed by microwave multi-chip module(MMCM)based on high-temperature co-fired ceramic(HTCC)technology.By optimizing the frequency conversion scheme,the layout of the down-conversion circuit is rational.Then HFSS and ANSYS are utilized to simulate and optimize the circuit's vertical transition and thermal stress.All simulation results meet the system's demands.Thus the reliability and manufacturability of the circuit are greatly improved,which meets the design requirements of high integration,miniaturization and low power consumption for multi-channel downconversion circuits under the conditions of increasingly limited load,space,and power consumption.
Down-conversion circuit is one of the key circuits of superheterodyne receiver.To achieve high integration and miniaturization,the proposed down-conversion circuit is designed by microwave multi-chip module(MMCM)based on high-temperature co-fired ceramic(HTCC)technology.By optimizing the frequency conversion scheme,the layout of the down-conversion circuit is rational.Then HFSS and ANSYS are utilized to simulate and optimize the circuit's vertical transition and thermal stress.All simulation results meet the system's demands.Thus the reliability and manufacturability of the circuit are greatly improved,which meets the design requirements of high integration,miniaturization and low power consumption for multi-channel downconversion circuits under the conditions of increasingly limited load,space,and power consumption.
引文
[1]肖滔.S波段下变频链路研究[D].成都:电子科技大学,2011.
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[2]张光义,赵玉洁.相控阵雷达技术[M].北京:电子工业出版社,2004:214-215.
[3]余雷,揭海,王安劳.基于高温共烧陶瓷基板的三维互连技术[J].电子科技,2013,26(7):157-159.
[4]姬忠涛,张正富.共烧陶瓷多层基板技术及其发展应用[J].中国陶瓷工业,2006,13(4):45-48.
[5]李永彬,庞学满,胡进,等.一种毫米波表贴型外壳的微波设计[J].固体电子学研究与进展,2015,35(3):263-266.
[6]邱颖霞,胡骏,刘建军.HTCC一体化管壳失效问题分析[J].电子与封装,2016,16(3):41-44.
[7]张卫清,许厚棣,唐亮.雷达数字化收发系统芯片设计与实现[J].雷达科学与技术,2016,14(3):317-323.ZHANG Weiqing,XU Houdi,TANG Liang.Design and Implementation of Radar Digitized Receive-Transmit System Chip[J].Radar Science and Technology,2016,14(3):317-323.(in Chinese)
[8]芦耀.多芯片组件的信号完整性研究与互连设计[D].西安:西安电子科技大学,2014.
[9]范鹏飞,刘晓政,张德智,等.变频组件测试夹具的设计与应用[J].现代测量与实验室管理,2010(5):9-10.