体声波滤波器的设计与微加工方法
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  • 英文篇名:Design and Microfabrication Method of BAW Filter
  • 作者:高杨 ; 蔡洵 ; 贺学锋
  • 英文作者:GAO Yang;CAI Xun;HE Xuefeng;Institute of Electronic Engineering,China Academy of Engineering Physics;State Key Lab.of Particle Detection and Electronics,Institute of High Energy Physics,CAS;School of Information Engineering,Southwest University of Science and Technology;National Key Lab.of Fundamental Science of Micro/Nano-Device and System Technology,Chongqing University;
  • 关键词:微机电系统(MEMS) ; 滤波器 ; 薄膜体声波谐振器(FBAR) ; 谐振区面积 ; 优化参数 ; 带内纹波
  • 英文关键词:microelectromechanical systems(MEMS);;filter;;thin film bulk acoustic wave resonator(FBAR);;active area;;optimization parameter;;ripple in band
  • 中文刊名:YDSG
  • 英文刊名:Piezoelectrics & Acoustooptics
  • 机构:中国工程物理研究院电子工程研究所;核探测与核电子学国家重点实验室(中国科学院高能物理研究所);西南科技大学信息工程学院;重庆大学新型微纳器件与系统技术国防重点学科实验室;
  • 出版日期:2017-04-15
  • 出版单位:压电与声光
  • 年:2017
  • 期:v.39;No.233
  • 基金:国家自然科学基金资助项目(61574131);; 中国工程物理研究院超精密加工技术重点实验室基金资助项目(2014ZA001);; 核探测与核电子学国家重点实验室开放课题基金资助项目(2016KF-02);; 特殊环境机器人技术四川省重点实验室(西南科技大学)开放基金资助项目(14ZXTK01)
  • 语种:中文;
  • 页:YDSG201702002
  • 页数:6
  • CN:02
  • ISSN:50-1091/TN
  • 分类号:6-11
摘要
提出了一种易于使用的薄膜体声波(FBAR)滤波器的4步设计方法,以一种FDD-LTE Band7的Rx滤波器为例展示了该方法的应用流程。第一步,根据FBAR滤波器的中心频率和带宽指标,确定FBAR薄膜叠层中各层薄膜的厚度。第二步,得到滤波器的电路结构。第三步,得到每个FBAR单元的谐振区面积;为此,将串联FBAR单元的谐振区面积、并联FBAR单元与串联FBAR单元的谐振区面积比值作为两组优化参数;将给定滤波器的插入损耗和带外抑制指标作为优化目标,利用ADS软件中的梯度优化算法,得到其优化值。第四步,旨在使滤波器的带内纹波最小化。设计中采用一种新的FBAR电极厚度调整方法,故意使串联FBAR的串联谐振频率与并联FBAR的并联谐振频率频率值不等,但相差很小,实现了该目标。由于案例设计结果中,SiO2支撑层的厚度仅300nm,需要在背面通孔刻蚀的微加工工艺中工序保留良好,因此,提出了一种基于绝缘衬底上的Si(SOI)圆片中埋氧层(BOX)缓冲的两步通孔刻蚀工艺方案,该方法利用了BOX的刻蚀自停止特性。研究结果表明,Rx滤波器插入损耗为0.6dB,在Tx频段的带外抑制为40.4dB,带内纹波为0.4dB。由此验证了该设计方法的可行性。
        An easy-to-use 4-step design method for FBAR filters was presented,and demonstrated by a design case of FBAR Rx filter for FDD-LTE Band 7.According to the center frequency and bandwidth of FBAR filter,the thicknesses of each film in the FBAR film stack layer were determined at the step 1.The step 2gets the filter′s circuit architecture.In the step 3,we obtain the active area of each FBAR unit.To get this,the active area of series FBAR units and the ratio of active area of parallel FBAR units and series FBAR units were used as two groups of optimization parameters reasonably.Taking the given insertion loss and out-of-band rejection of filter as the optimization objectives,we obtained the optimized values by the algorithm based on gradient in ADS software.The step 4aimed at minimizing the filter passband ripple.In the design case,this aim was fulfilled by a novel FBARs′electrode layer thickness adjusting method,and intentionally slightly mismatched the series resonant frequency of the series FBAR units with the parallel resonant frequency of the parallel FBAR units.As in the design case results,a SiO_2 support layer with only 300 nm needed to survive the backside viahole etching micro-fabrication process,a buried oxide layer(BOX)buffered 2-step via-hole etching scheme was proposed in this work,which taking advantage of the etching self-stop characteristic of BOX.The study results showed that the insertion loss of the Rx filter was 0.6dB,out-of-band rejection in Tx frequency band was 40.4dB and the passband ripple was 0.4dB.The feasibility of the design method was validated from this.
引文
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