薄膜体声波谐振器的热学分析
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摘要
采用有限元分析软件Comsol Multiphics构建谐振器三维模型,研究器件结构、材料对其热性能的影响。固态装配型谐振器(SMR)有更好的热传导能力与热应力稳定性。在SMR器件中增加一层SiO2,其最高稳态温度上升7℃。器件最高稳态温度随其谐振区面积的减小而迅速增大。当器件换用高热导率材料时,器件最高稳态温度及其随热耗散功率增加而增大的幅度明显降低。
A finite element simulation software Comsol Multiphsics was employed to build three-dimensional bulk acoustic wave(BAW)resonators model.The influences of different structure and materials on the thermal characteristics of the BAW resonators were investigated.The calculation results revealed that the solid mounted resonators(SMR)had better thermal reliability than that of film bulk acoustic resonators.Adding SiO2 layer into the SMR will increase the steady-state temperature of 7℃.The highest steady-state temperature will increase rapidly with the decrease of the resonant area of SMR.The steady-state temperature decreased greatly when the high thermal conductivity materials are used to replace materials of low thermal conductivity in SMR.
A finite element simulation software Comsol Multiphsics was employed to build three-dimensional bulk acoustic wave(BAW)resonators model.The influences of different structure and materials on the thermal characteristics of the BAW resonators were investigated.The calculation results revealed that the solid mounted resonators(SMR)had better thermal reliability than that of film bulk acoustic resonators.Adding SiO2 layer into the SMR will increase the steady-state temperature of 7℃.The highest steady-state temperature will increase rapidly with the decrease of the resonant area of SMR.The steady-state temperature decreased greatly when the high thermal conductivity materials are used to replace materials of low thermal conductivity in SMR.
引文
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[2]FRANK Z B,BRADLEY P B.Bulk acoustic wave RF technology[J].IEEE Microwave Magazine,2008,9(5):65-80.
[3]ZHANG R,JIAO X Q,YANG J,et al.Electrode influence on effective electromechanical coupling coefficient of thin film bulk acoustic resonators[J].Mater Res Innov,2014,18(S4):606-609.
[4]王刚,安琳.COMSOL Multiphysics工程实践与理论仿真[M].北京:电子工业出版社,2012.
[5]UCHINO K,HIROSE S.Loss mechanisms in piezoelectrics:how to measure different losses separately[J].IEEE Trans Ultrason,Ferroelect,Freq Contr,2001,48(1):307-321.
[6]THEODORE L B,ADRIENNE S L,FRANK P I,et al.Fundamentals of heat and mass transfer[M].New York:John Wiley&Sons,2011:2-12.
[7]吕琼莹,杨艳,焦海坤,等.基于COMSOL Multiphysics超声波电机的谐振特性分析[J].压电与声光,2012,34(6):864-867.LV Qiongying,YANG Yan,JIAO Haikun,et al.The Resonat feature analysis of ultrasonic motor based on COMSOL multiphysics[J].Piezoelectrics&Acoustooptics,2012,34(6):864-867.