T/R开关组件封装工艺的研究
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摘要
贴片工艺中贴片胶厚度、杨氏模量等参数影响着贴片的质量。通过ANSYS仿真不同贴片胶厚度及杨氏模量获得PIN二极管受力的情况,得出PIN二极管在贴片胶厚120μm时受力最小,而且会随着杨氏模量的增大而趋于平缓。金丝键合工艺中超声功率(w)、超声时间(t)、机头压力(P)和键合温度(T)是决定键合质量的重要因素。机头压力分别为16gf和18gf时,金丝键合强度有较好的平均值和均方根值。
In the process of surface mounting technology(SMT),some parameters like the adhesive thickness of SMT and Young modulus may impair the SMT quality. Through the ANSYS simulation of different chip thickness and Young's modulus,the PIN diode force is obtained,the stress is minimum when the PIN diode is in the patch adhesive thickness of 120μm,and with the increase of Young 's modulus,it tends to smooth. In wire bonding process,the ultrasonic power,time,bonding pressure and bonding temperature are the determining factors for bonding quality. When the bonding pressure is 16 gf and 18 gf respectively,the strength of wire bonding has good mean and RMS value.
In the process of surface mounting technology(SMT),some parameters like the adhesive thickness of SMT and Young modulus may impair the SMT quality. Through the ANSYS simulation of different chip thickness and Young's modulus,the PIN diode force is obtained,the stress is minimum when the PIN diode is in the patch adhesive thickness of 120μm,and with the increase of Young 's modulus,it tends to smooth. In wire bonding process,the ultrasonic power,time,bonding pressure and bonding temperature are the determining factors for bonding quality. When the bonding pressure is 16 gf and 18 gf respectively,the strength of wire bonding has good mean and RMS value.
引文
[1]刁玉剑,谢君尧.磁共振快速T/R开关驱动器研制[J].波谱学杂志,2016(1):37-43.
[2]关荣峰,汪学方.MEMS封装技术及标准工艺研究[J].半导体技术,2005(1):50-55.
[3]何中伟.MCM_C实用先进组装封装工艺制造技术研究[D].南京:南京理工大学,2006.
[2]关荣峰,汪学方.MEMS封装技术及标准工艺研究[J].半导体技术,2005(1):50-55.
[3]何中伟.MCM_C实用先进组装封装工艺制造技术研究[D].南京:南京理工大学,2006.