基于爬锡现象的手工表面贴装方法研究
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摘要
针对目前小批量电子元器件手工焊接质量不稳定、采用传统工业化表面贴装方法成本高的问题,基于爬锡现象,提出一种适用于小批量生产的元器件手工表面贴装方法,采用常见厚度(约0. 2 mm)的薄片制作印刷锡膏的钢网,改进了钢网的开孔方式,并通过试验验证了焊接效果,有效地降低小批量元器件焊接成本,提高电路板焊接效率和质量。
For the welding of small batch components, the quality of manual welding is not guaranteed, and the cost of using traditional industrial surface mounting method is high. Based on the climbing phenomenon of tin, the paper presents a manual surface mount method for components in small batch production to solve these problems, which uses a thin sheet of about 0.2 mm thick to make a steel mesh for printing tin paste, and improves the trepanning method of the steel mesh. Through the test, the welding effect is verified, the cost of small batch component welding is reduced effectively, and the efficiency and quality of PCB welding are improved.
For the welding of small batch components, the quality of manual welding is not guaranteed, and the cost of using traditional industrial surface mounting method is high. Based on the climbing phenomenon of tin, the paper presents a manual surface mount method for components in small batch production to solve these problems, which uses a thin sheet of about 0.2 mm thick to make a steel mesh for printing tin paste, and improves the trepanning method of the steel mesh. Through the test, the welding effect is verified, the cost of small batch component welding is reduced effectively, and the efficiency and quality of PCB welding are improved.
引文
[1]罗磊,王石刚,蔡建国.表面贴装关键技术综述[J].组合机床与自动化加工技术, 2003(2):70-72.
[2]汪斌.电子产品加工工艺的探索[D].华南理工大学, 2011.
[3]刘少敏.插装元件通孔回流焊工艺研究[J].电子工艺技术, 2013(2):100-102.
[4]姜丽娣.表面贴装预处理系统的关键技术研究[D].西安电子科技大学, 2010.
[5]李晓延,武传松,李午申.中国焊接制造领域学科发展研究[J].机械工程学报, 2012, 48(6):19-31.
[6]李佳,朱浩悦.表面贴装技术[J].电子设计工程,2009, 17(7):81-83.
[7]杨根林.焊锡膏特性和模板工艺对稳定印刷品质的要因解析[C]//2014中国高端SMT学术会议论文集. 2014.
[8]史建卫,宋耀宗.回流焊工艺中常见缺陷及其防止措施[J].电子工艺技术, 2011, 32(1):58-61.
[9]李婷.氩气回流无铅焊点的显微组织与性能研究[D].上海交通大学, 2015.
[2]汪斌.电子产品加工工艺的探索[D].华南理工大学, 2011.
[3]刘少敏.插装元件通孔回流焊工艺研究[J].电子工艺技术, 2013(2):100-102.
[4]姜丽娣.表面贴装预处理系统的关键技术研究[D].西安电子科技大学, 2010.
[5]李晓延,武传松,李午申.中国焊接制造领域学科发展研究[J].机械工程学报, 2012, 48(6):19-31.
[6]李佳,朱浩悦.表面贴装技术[J].电子设计工程,2009, 17(7):81-83.
[7]杨根林.焊锡膏特性和模板工艺对稳定印刷品质的要因解析[C]//2014中国高端SMT学术会议论文集. 2014.
[8]史建卫,宋耀宗.回流焊工艺中常见缺陷及其防止措施[J].电子工艺技术, 2011, 32(1):58-61.
[9]李婷.氩气回流无铅焊点的显微组织与性能研究[D].上海交通大学, 2015.